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Contents

README

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SPD06N80C3-VB

VBsemi Elec · MOSFETs · TO-252

SPD06N80C3-VB from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal; gate-source voltage is rated at ±30 V (absolute maximum), and the gate input resistance Rg is typically 3.5 Ω.
2 D passive Drain terminal (also the tab); drain-source voltage is rated at 800 V minimum breakdown, and junction-to-case thermal resistance is 0.7 °C/W maximum.
3 S passive Source terminal; body diode forward voltage is 1.4 V maximum at IS = 4 A, VGS = 0 V.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage VDS 800 V VGS = 0 V, ID = 250 μA 2
Gate-Source Threshold Voltage (N) VGS(th) 2 4 V VDS = VGS, ID = 250 μA 2
Gate-Source Leakage IGSS -100 100 nA VGS = ±20 V 2
Gate-Source Leakage IGSS -1 1 μA VGS = ±30 V 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS = 800 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS 10 μA VDS = 520 V, VGS = 0 V, TJ = 125 °C 2
Diode Forward Voltage VSD 1.4 V TJ = 25 °C, IS = 4 A, VGS = 0 V 2
Drain-Source Voltage VDS 800 V 1
Gate-Source Voltage VGS -30 30 V 1
Continuous Drain Current ID 5.9 A TJ = 150 °C, TC = 100 °C, VGS at 10 V 1
Soldering Recommendations (Peak Temperature) 300 °C for 10 s, 1.6 mm from case 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient RthJA 72 °C/W 2
Maximum Junction-to-Case (Drain) RthJC 0.7 °C/W 2

CAD (KiCad official)

  • Symbol: SPD06N80C3-VB
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: spd06n80c3-vb-etched.step / spd06n80c3-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); spd06n80c3-vb.step / spd06n80c3-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (8 pp, sha256 295c057860a341e2, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF