# SP60P140T1

**Siliup** · MOSFETs · SOT-23-3L

SP60P140T1 from Siliup, in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limit is ±20 V with threshold VGS(th) of -1 to -2.5 V at ID=-250µA. |
| 2 | S | passive | Source of the P-channel MOSFET; continuous drain current is -1.8 A and body-diode forward voltage is max -1.2 V at IS=-1A. |
| 3 | D | passive | Drain; drain-source voltage rating is -60 V, pulsed drain current is -7.2 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Siliup |
| Package | SOT-23-3L |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | -60 |  |  | V |  | 2 |
| Gate-Source Voltage | VGSS | -20 |  | 20 | V |  | 2 |
| Continuous Drain Current | ID | -1.8 |  |  | A |  | 2 |
| Pulse Drain Current Tested | IDM | -7.2 |  |  | A |  | 2 |
| Power Dissipation | PD |  |  | 1.2 | W |  | 2 |
| Storage Temperature Range | TSTG | -55 |  | 150 | °C |  | 2 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | °C |  | 2 |
| Drain-Source Breakdown Voltage | BVDSS | -60 |  |  | V | VGS=0V, ID=-250µA | 2 |
| Drain-Source Leakage Current | IDSS |  |  | -1 | uA | VDS=-48V, VGS=0V | 2 |
| Gate-Source Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V, VDS=0V | 2 |
| Gate Threshold Voltage | VGS(th) | -1 | -1.5 | -2.5 | V | VDS=VGS, ID=-250µA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  | 140 | 180 | mΩ | VGS=-10V, ID=-1.5A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  | 160 | 200 | mΩ | VGS=-4.5V, ID=-1A | 2 |
| Diode Forward Voltage | VSD |  |  | -1.2 | V | VGS=0V, IS=-1A, TJ=25℃ | 2 |
| Thermal Resistance Junction-to-Ambient | RθJA |  | 104 |  | °C/W |  | 2 |

## CAD (KiCad official)

- Symbol: `SP60P140T1`
- Footprint: `Package_TO_SOT_SMD:SOT-23-3`
- 3D model: SOT-23-3L (KiCad packages3D, STEP)
- 3D model files: `sp60p140t1-etched.step` / `sp60p140t1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sp60p140t1.step` / `sp60p140t1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Siliup datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8604428738067521536) (5 pp, sha256 `453f212b806e505e`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sp60p140t1-datasheet.pdf)