# SP60N30TH

**Siliup** · MOSFETs · TO-252

SP60N30TH from Siliup, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the MOSFET; the datasheet rates the gate-source voltage VGS at ±20 V. |
| 2 | D | passive | Drain of the MOSFET; rated for a drain-source voltage of 60 V and continuous drain current of 25 A at TC=25℃ (17 A at TC=100℃). |
| 3 | S | passive | Source of the MOSFET; the maximum body-diode continuous current IS is rated at 25 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Siliup |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 60 |  |  | V | VGS=0V, ID=250uA | 2 |
| Drain-Source Leakage Current | IDSS |  |  | 1 | uA | VDS=48V, VGS=0V, TJ=25℃ | 2 |
| Gate-Source Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V, VDS=0V | 2 |
| Gate Threshold Voltage | VGS(th) | 1 | 1.6 | 2.5 | V | VGS=VDS, ID=250uA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  | 30 | 40 | mΩ | VGS=10V, ID=10A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  | 40 | 50 | mΩ | VGS=4.5V, ID=5A | 2 |
| Diode Forward Voltage | VSD |  |  | 1.2 | V | VGS=0V, IS=1A, TJ=25℃ | 2 |
| Maximum Body-Diode Continuous Current | IS |  |  | 25 | A |  | 2 |
| Drain-Source Voltage | VDS |  |  | 60 | V |  | 2 |
| Gate-Source Voltage | VGS | -20 |  | 20 | V |  | 2 |
| Continuous Drain Current | ID |  |  | 25 | A | TC=25℃ | 2 |
| Continuous Drain Current | ID |  |  | 17 | A | TC=100℃ | 2 |
| Pulsed Drain Current | IDM |  |  | 100 | A |  | 2 |
| Single Pulse Avalanche Energy | EAS |  |  | 25 | mJ | VDD=30V, VGS=10V, L=0.5mH, RG=25Ω (Note 1) | 2 |
| Power Dissipation | PD |  |  | 40 | W | TC=25℃ | 2 |
| Storage Temperature Range | TSTG | -55 |  | 150 | ℃ |  | 2 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | ℃ |  | 2 |
| Thermal Resistance Junction-to-Case | RθJC |  |  | 3.1 | ℃/W |  | 2 |

## CAD (KiCad official)

- Symbol: `SP60N30TH`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `sp60n30th-etched.step` / `sp60n30th-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sp60n30th.step` / `sp60n30th.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Siliup datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603361504804950016) (5 pp, sha256 `6cecd2038d143430`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sp60n30th-datasheet.pdf)