# SP5300L

**Changjing** · Schottky Diodes · TO-277

SP5300L from Changjing, in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode 1 | passive | Anode 1 of the Schottky rectifier (300V VRRM, 5A IF(AV)), internally common with Anode 2. |
| 2 | Anode 2 | passive | Anode 2 of the Schottky rectifier (300V VRRM, 5A IF(AV)), internally common with Anode 1. |
| 3 | Cathode | passive | Cathode, connected to the exposed heatsink tab of the TO-277 package. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Changjing |
| Package | TO-277 |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive Peak Reverse Voltage | VRRM |  |  | 300 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 210 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 300 | V |  | 1 |
| Average Forward Current | IF(AV) |  |  | 5 | A | 60Hz Half-sine wave, Resistance load, TL(Fig.1) | 1 |
| Junction Temperature | TJ | -55 |  | 150 | ℃ |  | 1 |
| Storage Temperature | TSTG | -55 |  | 150 | ℃ |  | 1 |
| Peak Forward Voltage | VF |  | 0.94 | 0.96 | V | IF= 5.0A (temperature row not clearly printed; see review) | 1 |
| Peak Forward Voltage | VF |  | 0.75 | 0.78 | V | IF= 5.0A (temperature row not clearly printed; see review) | 1 |
| Peak Reverse Current (Ta=25℃) | IRRM1 |  | 0.01 | 0.03 | mA | VRM=VRRM, Ta=25℃ | 1 |
| Peak Reverse Current (Ta=125℃) | IRRM2 |  | 5 | 10 | mA | VRM=VRRM, Ta=125℃ | 1 |
| Typical Junction Capacitance | CJ |  | 160 |  | pF | VR=4.0 V, f=1 MHz | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.3" x 0.3" (8.0 mm x 8.0 mm) copper | 1 |

## CAD (KiCad official)

- Symbol: `SP5300L`
- Footprint: `Package_TO_SOT_SMD:TO-277A`
- 3D model: TO-277 (KiCad packages3D, STEP)
- 3D model files: `sp5300l-etched.step` / `sp5300l-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sp5300l.step` / `sp5300l.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Changjing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590176804138229760) (3 pp, sha256 `ec0d0a058c8c66fd`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sp5300l-datasheet.pdf)