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SP485EN-MS

MSKSEMI · RS-485 / RS-422 ICs · SOP-8

SP485EN-MS from MSKSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: when /RE is low, RO is high if A-B ≥ -50 mV and low if A-B ≤ -200 mV.
2 /RE input Receiver output enable, active low: high disables the receiver output (RO high-impedance), and /RE high with DE low puts the device into low-power shutdown.
3 DE input Driver output enable, active high: low forces the driver outputs to high-impedance, and /RE high with DE low puts the device into low-power shutdown.
4 DI input Driver input: when DE is high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground reference; all voltages in the datasheet are referenced to this pin.
6 A bidirectional Non-inverting receiver input and non-inverting driver output; bus-side input voltage is rated -7 V to 13 V.
7 B bidirectional Inverting receiver input and inverting driver output; bus-side input voltage is rated -7 V to 13 V.
8 VCC power_in Supply pin: operating supply range is 4.75 V to 5.25 V, with an absolute maximum of +7 V.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum) VCC 7 V 3
Control port voltage /RE, DE, DI (max VCC+0.3 V) -0.3 V 3
Bus-side input voltage A, B -7 13 V 3
Receiver output voltage RO (max VCC+0.3 V) -0.3 V 3
Operating temperature range -40 85 °C 3
Storage temperature range -60 150 °C 3
Soldering temperature 300 °C 3
Continuous power dissipation, SOP8 400 mW 3
Supply voltage operating range VCC 4.75 5.25 V 2
Driver differential output, no load VOD1 5 V No load 4
Driver differential output, RL=27 Ω VOD2 1.5 5 V Fig 2, RL = 27 Ω 4
Driver differential output, RL=50 Ω VOD2 2 V Fig 2, RL = 50 Ω 4
Change in differential output magnitude ΔVOD 0.2 V Fig 2, RL = 27 Ω 4
Driver common-mode output voltage VOC 3 V Fig 2, RL = 27 Ω 4
Change in common-mode output magnitude ΔVOC 0.2 V Fig 2, RL = 27 Ω 4
High-level input voltage VIH 2 V DE, DI, /RE 4
Low-level input voltage VIL 0.8 V DE, DI, /RE 4
Logic input current IIN1 -2 2 µA DE, DI, /RE 4
Driver output short-circuit current, short to high IOSD1 35 250 mA Short to 0 V to 12 V 4
Driver output short-circuit current, short to low IOSD2 -250 -35 mA Short to -7 V to 0 V 4
Receiver input current (A, B), max IIN2 125 µA DE = 0 V, VCC = 0 or 5 V 4
Receiver input current (A, B), min IIN2 -100 µA DE = 0 V, VCC = 0 or 5 V 4
Positive-going input threshold voltage VIT+ -50 mV -7 V≤VCM≤12 V 4
Negative-going input threshold voltage VIT- -200 mV 4
Input hysteresis voltage Vhys 10 30 mV -7 V≤VCM≤12 V 4
Low-level output voltage VOL 0.4 V IOUT = +4 mA, VID = -200 mV 4
Three-state input leakage current IOZR -1 1 µA 0.4 V < VO < 2.4 V 5
Receiver input resistance RIN 96 kΩ -7 V≤VCM≤12 V 5
Receiver short-circuit current (magnitude) IOSR 7 95 mA 0 V≤VO≤VCC 5
Supply current, receiver/driver enabled ICC 180 500 µA /RE=0 V or VCC, DE = 0 V 5
Supply current, /RE=VCC ICC 170 400 µA /RE=VCC 5
Shutdown supply current ISHDN 0.5 10 µA DE =0 V, /RE= VCC 5
ESD HBM, A and B 15 kV A, B; human body model 5
ESD contact discharge, A and B 15 kV A, B; contact discharge 5
Driver propagation delay, low-to-high and high-to-low tDPLH, tDPHL 1000 ns RDIFF = 54 Ω, CL1=CL2=100 pF (Fig 3, 4) 5
Driver propagation delay skew tSKEW1 -100 100 ns 5
Driver rise and fall time tDR, tDF 200 500 700 ns 5
Driver enable to output high/low tDZH, tDZL 2500 ns CL = 100 pF, S1 closed (Fig 5, 6) 5
Driver input low/high to disable tDLZ, tDHZ 100 ns CL = 15 pF, S2 closed (Fig 5, 6) 5
Driver enable to output high in shutdown tDZH(SHDN) 4500 ns CL = 15 pF, S2 closed 5
Driver enable to output low in shutdown tDZL(SHDN) 4500 ns CL = 15 pF, S1 closed 5
Receiver propagation delay, low-to-high and high-to-low tRPLH, tRPHL 127 200 ns VID≥2.0 V; rise and fall time VID≤15 ns (Fig 7, 8) 6
Receiver propagation delay skew tSKEW2 3 30 ns Fig 7, 8 6
Receiver enable to output low, output high to disable tRZL, tRLZ 20 50 ns CL = 100 pF, S1 closed (Fig 9, 10) 6
Receiver enable to output high, output low to disable tRZH, tRHZ 20 50 ns CL = 100 pF, S2 closed (Fig 9, 10) 6
Receiver enable to output high in shutdown tRZH(SHDN) 3500 ns CL = 100 pF, S2 closed (Fig 9, 10) 6
Receiver enable to output low in shutdown tRZL(SHDN) 3500 ns CL = 100 pF, S1 closed (Fig 9, 10) 6
Time to enter shutdown tSHDN 50 200 600 ns NOTE2 (/RE=1, DE=0 duration) 6
Driver over-temperature shutdown hysteresis 20 °C 5

CAD (KiCad official)

  • Symbol: SP485EN-MS
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: sp485en-ms-etched.step / sp485en-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp485en-ms.step / sp485en-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (13 pp, sha256 6a312ca51fc5ae87, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF