# SP485EN-HXY

**HXY MOSFET** · RS-485/RS-422 ICs · SOP-8

SP485EN-HXY from HXY MOSFET, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | R | output | Receiver output (RO): logic high if A-B ≥ +0.2V, logic low if A-B ≤ -0.2V, high-impedance when RE is high. |
| 2 | RE | input | Receiver output enable, active low: RO is enabled when RE is 0 and high-impedance when RE is 1 (input high VIH 2.0V min, low VIL 0.8V max). |
| 3 | DE | input | Driver output enable, active high: driver outputs A and B are enabled when DE is 1 and high-impedance when DE is 0. |
| 4 | D | input | Driver input (DI): with the driver enabled, a low on D forces A low and B high, and a high on D forces A high and B low; input range -0.5V to VCC+0.5V. |
| 5 | GND | power_in | Ground reference for the device. |
| 6 | A | bidirectional | Noninverting receiver input and noninverting driver output on the RS-485 bus, with voltage range -8V to +12.5V. |
| 7 | B | bidirectional | Inverting receiver input and inverting driver output on the RS-485 bus, with voltage range -8V to +12.5V. |
| 8 | VCC | power_in | Positive supply input, operated from a single 5V ±5% supply with an absolute maximum of 12V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOP-8 |
| Category | Communication Interface Chip |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC |  |  | 12 | V |  | 1 |
| Driver Output Voltage (A, B) |  | -8 |  | 12.5 | V |  | 1 |
| Receiver Input Voltage (A, B) |  | -8 |  | 12.5 | V |  | 1 |
| Continuous Power Dissipation |  |  |  | 471 | mW | TA=+70°C, 8-Pin SO (derate 5.88mW/°C above +70°C) | 1 |
| Operating Temperature Range |  | 0 |  | 70 | °C |  | 1 |
| Storage Temperature Range |  | -65 |  | 160 | °C |  | 1 |
| Lead Temperature |  |  |  | 300 | °C | soldering, 10sec | 1 |
| Differential Driver Output (no load) | VOD1 |  |  | 5 | V |  | 2 |
| Differential Driver Output (with load) | VOD2 | 2 |  |  | V | R = 50Ω (RS-422) | 2 |
| Differential Driver Output (with load) | VOD2 | 1.5 |  | 5 | V | R = 27Ω (RS-485), Figure 4 | 2 |
| Change in Magnitude of Driver Differential Output Voltage | ∆VOD |  |  | 0.2 | V | R = 27Ω or 50Ω, Figure 4 | 2 |
| Driver Common-Mode Output Voltage | VOC |  |  | 3 | V | R = 27Ω or 50Ω, Figure 4 | 2 |
| Change in Magnitude of Driver Common-Mode Output Voltage | ∆VOD |  |  | 0.2 | V | R = 27Ω or 50Ω, Figure 4 | 2 |
| Input High Voltage | VIH | 2 |  |  | V | DE, DI, RE | 2 |
| Input Low Voltage | VIL |  |  | 0.8 | V | DE, DI, RE | 2 |
| Input Current | IIN1 | -2 |  | 2 | µA | DE, DI, RE | 2 |
| Input Current (A, B) | IIN2 |  |  | 1 | mA | DE = 0V; VIN = 12V | 2 |
| Input Current (A, B) | IIN2 | -0.8 |  |  | mA | VCC = 0V or 5.25V, VIN = -7V | 2 |
| Receiver Differential Threshold Voltage | VTH | -0.2 |  | 0.2 | V | -7V ≤ VCM ≤12V | 2 |
| Receiver Input Hysteresis | ∆VTH |  | 70 |  | mV | VCM = 0V | 2 |
| Receiver Output High Voltage | VOH | 3.5 |  |  | V | IO = -4mA, VID = 200mV | 2 |
| Receiver Output Low Voltage | VOL |  |  | 0.4 | V | IO = 4mA, VID = -200mV | 2 |
| Three-State Output Current at Receiver | IOZR | -1 |  | 1 | µA | 0.4V ≤ VO ≤ 2.4V | 2 |
| No-Load Supply Current | ICC |  | 500 | 900 | µA | DE = VCC | 2 |
| No-Load Supply Current | ICC |  | 300 | 500 | µA | DE = 0V | 2 |
| Driver Short-Circuit Current, VO = High | IOSD1 | 35 |  | 250 | mA | -7V ≤ VO ≤ 12V (Note 4) | 2 |
| Driver Short-Circuit Current, VO = Low | IOSD2 | 35 |  | 250 | mA | -7V ≤ VO ≤12V (Note 4) | 2 |
| Receiver Short-Circuit Current | IOSR | 7 |  | 95 | mA | 0V ≤ VO ≤ VCC | 2 |
| Driver Input to Output tPLH | tPLH | 10 | 30 | 60 | ns | RDIFF = 54Ω, CL1 = CL2 = 100pF | 3 |
| Driver Input to Output tPHL | tPHL | 10 | 30 | 60 | ns | RDIFF = 54Ω, CL1 = CL2 = 100pF | 3 |
| Driver Output Skew to Output | tSKEW |  | 5 | 10 | ns | RDIFF = 54Ω, CL1 = CL2 = 100pF | 3 |
| Driver Enable to Output High | tZH |  | 40 | 70 | ns | CL= 100pF, S2 closed | 3 |
| Driver Enable to Output Low | tZL |  | 40 | 70 | ns | CL= 100pF, S1 closed | 3 |
| Driver Disable Time from Low | tLZ |  | 40 | 70 | ns | CL= 15pF, S1 closed | 3 |
| Driver Disable Time from High | tHZ |  | 40 | 70 | ns | CL= 15pF, S2 closed | 3 |
| Receiver Skew /tPLH - tPHL/ | tSKD |  |  | 13 | ns | RDIFF = 54Ω, CL1 = CL2 = 100pF | 3 |
| Receiver Enable to Output Low | tZL |  | 20 | 50 | ns | CRL = 15pF, S1 closed | 3 |
| Receiver Enable to Output High | tZH |  | 20 | 50 | ns | CRL = 15pF, S2 closed | 3 |
| Receiver Disable Time from Low | tLZ |  | 20 | 50 | ns | CRL = 15pF, S1 closed | 3 |
| Receiver Disable Time from High | tHZ |  | 20 | 50 | ns | CRL = 15pF, S2 closed | 3 |
| Maximum Data Rate | fMAX | 2.5 |  |  | Mbps |  | 3 |

## CAD (KiCad official)

- Symbol: `SP485EN-HXY`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `sp485en-hxy-etched.step` / `sp485en-hxy-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sp485en-hxy.step` / `sp485en-hxy.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HXY MOSFET datasheet](docs/sp485en-hxy-datasheet.pdf) (6 pp, sha256 `4721a03f19c99d0e`, retrieved 2026-10-23, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sp485en-hxy-datasheet.pdf)