component

SP485EIM

Public Made by Adom

by adom

HGSEMI RS-485 / RS-422 ICs, SOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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SP485EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

SP485EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output. When RE is low: if (A - B) ≥ 200 mV, RO is high; if (A - B) ≤ -200 mV, RO is low. Drives typical UART RX input.
2 RE input Receiver output enable, active low. When RE is low, RO is active; when RE is high, RO is high-impedance. If RE is high and DE is low simultaneously, the device enters low-power shutdown mode. Hot-swap protected input.
3 DE input Driver output enable, active high. When DE is high, driver outputs A/B are active; when DE is low, A/B are high-impedance. If DE is low while RE is high, the device enters low-power shutdown mode. Hot-swap protected input.
4 DI input Driver input. When DE is high: DI low drives A low and B high; DI high drives A high and B low. Typical connection is the UART TX line.
5 GND power_in Ground reference (0 V).
6 A bidirectional Non-inverting receiver input and non-inverting driver output on the RS-485 differential bus. Absolute-max range -7 V to +12 V; ±16 kV ESD (IEC 61000-4-2 air) on the bus pins.
7 B bidirectional Inverting receiver input and inverting driver output on the RS-485 differential bus. Absolute-max range -7 V to +12 V; ±16 kV ESD (IEC 61000-4-2 air) on the bus pins.
8 VCC power_in Positive supply, 4.5 V ≤ VCC ≤ 5.5 V. Decouple to GND with a 0.1 µF ceramic capacitor placed close to the pin.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • SP485EIM/TR
  • SP485ECM/TR
  • SP485EIN
  • SP485ECN
  • SP485EIMM/TR
  • SP485ECMM/TR

CAD (KiCad official)

  • Symbol: SP485EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: sp485eim-etched.step / sp485eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp485eim.step / sp485eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (17 pp, sha256 01ef68b4a0c8c0b3, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF