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Contents

README

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SP4044-04ATG

Littelfuse · TVS · MSOP-10

SP4044-04ATG from Littelfuse, in a MSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O 1 passive ESD/surge-protected I/O channel 1 with 1.5pF (TYP) capacitance to GND, rated for 24A (8/20μs) and ±30kV IEC 61000-4-2 contact/air.
2 NC unconnected No connection.
3 GND power_in Ground reference, internally connected to pin 8 as the common return for all diode channels.
4 NC unconnected No connection.
5 I/O 2 passive ESD/surge-protected I/O channel 2 with 1.5pF (TYP) capacitance to GND, rated for 24A (8/20μs) and ±30kV IEC 61000-4-2 contact/air.
6 NC unconnected No connection.
7 I/O 3 passive ESD/surge-protected I/O channel 3 with 1.5pF (TYP) capacitance to GND, rated for 24A (8/20μs) and ±30kV IEC 61000-4-2 contact/air.
8 GND power_in Ground reference, internally connected to pin 3 as the common return for all diode channels.
9 I/O 4 passive ESD/surge-protected I/O channel 4 with 1.5pF (TYP) capacitance to GND, rated for 24A (8/20μs) and ±30kV IEC 61000-4-2 contact/air.
10 NC unconnected No connection.

Key specifications

Parameter Value
Manufacturer Littelfuse
Package MSOP-10
Category Circuit Protection
Pins 10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Standoff Voltage VRWM 2.8 V 2
Snap Back Voltage VSB 2.8 V ISB=50mA 2
Reverse Leakage Current ILEAK 0.5 1 µA VR=2.8V, I/O to GND 2
Clamp Voltage VC 5.2 V IPP=1A, tp=8/20µs, Fwd 2
Clamp Voltage VC 6 V IPP=2A, tp=8/20µs, Fwd 2
ESD Withstand Voltage (Contact) VESD -30 30 kV IEC61000-4-2 (Contact) 2
ESD Withstand Voltage (Air) VESD -30 30 kV IEC61000-4-2 (Air) 2
Peak Current IPP 24 A tp=8/20μs 2
Peak Pulse Power PPK 500 W tp=8/20µs 2
Operating Temperature TOP -40 125 °C 2
Storage Temperature TSTOR -55 150 °C 2
Maximum Junction Temperature 150 °C 2
Maximum Lead Temperature 260 °C Soldering 20-40s 2
Dynamic Resistance RDYN 0.22 Ω TLP tp=100ns, Pin 1 to Pin 2 2
Diode Capacitance CI/O-GND 1.5 pF Reverse Bias=0V 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper Alloy Lead Plating Pre-Plated Frame Lead Material Copper Alloy 3

CAD (KiCad official)

  • Symbol: SP4044-04ATG
  • Footprint: Package_SO:MSOP-10_3x3mm_P0.5mm
  • 3D model: MSOP-10 (KiCad packages3D, STEP)
  • 3D model files: sp4044-04atg-etched.step / sp4044-04atg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp4044-04atg.step / sp4044-04atg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse datasheet (4 pp, sha256 decba90a59d598bd, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF