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SP3485EN-HXY

Public Made by Adom

by adom

HXY MOSFET RS-485 / RS-422 ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Symbol & Footprint

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Datasheet

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Contents

README

markdown

SP3485EN-HXY

HXY MOSFET · RS-485 / RS-422 ICs · SOP-8

SP3485EN-HXY from HXY MOSFET, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 R output Receiver output (RO), driven high when A-B is above +0.2V and low when below -0.2V, high impedance when the receiver is disabled (RE high).
2 RE input Active-low receiver enable input; logic low enables the receiver and high disables it, with VIH 2.0V min and VIL 0.8V max.
3 DE input Driver enable input; high enables the driver outputs A and B and low places them in high impedance, with VIH 2.0V min and VIL 0.8V max.
4 D input Driver input (DI); with the driver enabled, low forces A low and B high, and high forces A high and B low, within -0.3V to +7V.
5 GND power_in Ground reference for the device.
6 A bidirectional Non-inverting RS-485/RS-422 driver output and receiver input, rated -7V to +13V.
7 B bidirectional Inverting RS-485/RS-422 driver output and receiver input, rated -7V to +13V.
8 VCC power_in Supply voltage input, operating range 3.0 to 3.6V, absolute maximum 7V.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Recommended supply voltage (working voltage range) VCC 3 3.6 V 1
Supply Voltage (VCC) VCC 7 V 1
Control Input Voltage -0.3 7 V 1
Driver Input Voltage (DI) DI -0.3 7 V 1
Driver Output Voltage (A, B) -7 13 V 1
Receiver Input Voltage (A, B) -7 13 V 1
Receiver Output Voltage (RO) RO -0.3 7 V 1
Continuous Power Dissipation, 8-Pin SO 400 mW TA = +70°C 1
Operating Temperature Range 0 70 °C 1
Storage Temperature Range -65 150 °C 1
Lead Temperature (soldering) 300 °C soldering, 10sec 1
Differential Driver Output (no load) VOD1 3.3 V no load 2
Differential Driver Output (with load) VOD2 2 V R = 100Ω (RS-485) 2
Change in Magnitude of Driver Differential Output Voltage for Complementary Output States ∆VOD 0.2 V R = 54Ω 2
Driver Common-Mode Output Voltage VOC 3 V R = 54Ω 2
Change in Magnitude of Driver Common-Mode Output Voltage for Complementary Output States ∆VOD 0.2 V R = 54 2
Input High Voltage VIH 2 V DE, DI, RE 2
Input Low Voltage VIL 0.8 V DE, DI, RE 2
Input Current IIN1 -2 2 µA DE, DI, RE 2
Input Current (A, B) IIN2 125 µA DE = 0V; VIN = 12V 2
Input Current (A, B) IIN2 -100 µA VCC = 0V or 3.3V, VIN = -7V 2
Receiver Differential Threshold Voltage VTH -0.2 0.2 V -7V ≤ VCM ≤12V 2
Receiver Output Low Voltage VOL 0.4 V IO = 2.5mA, VID = -200mV 2
Three-State (high impedance) Output Current at Receiver IOZR -1 1 µA 0.4V ≤ VO ≤ 2.4V 2
No-Load Supply Current ICC 520 800 µA DE = VCC 2
No-Load Supply Current ICC 540 700 µA RE = 0V or VCC 2
No-Load Supply Current ICC 10 96 µA DE = 0V 2
Driver Short-Circuit Current IOSD -250 250 mA 2
Driver Input to Output (low-to-high) tPLH 8 35 ns RDIFF = 27Ω 3
Driver Input to Output (high-to-low) tPHL 8 35 ns CL1 = CL2 = 100pF 3
Driver Output Skew to Output tSKEW 10 35 ns RDIFF = 60Ω, CL1 = CL2 = 100pF 3
Driver Enable to Output High tZH 20 90 ns CL= 110pF, S2 closed 3
Driver Enable to Output Low tZL 20 90 ns CL= 110pF, S1 closed 3
Driver Disable Time from Low tLZ 20 80 ns CL= 110pF, S1 closed 3
Driver Disable Time from High tHZ 20 80 ns CL= 110pF, S2 closed 3
Differential Receiver Skew /tPLH - tPHL/ tSKD 7 ns RDIFF = 54Ω 3
Receiver Enable to Output Low tZL 20 45 ns CRL = 15pF, S1 closed 3
Receiver Enable to Output High tZH 20 45 ns CRL = 15pF, S2 closed 3
Receiver Disable Time from Low tLZ 200 1400 ns CRL = 15pF, S1 closed 3
Receiver Disable Time from High tHZ 200 1400 ns CRL = 15pF, S2 closed 3
Receiver Input Hysteresis ∆VTH 30 mV VCM = 0V 2

CAD (KiCad official)

  • Symbol: SP3485EN-HXY
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: sp3485en-hxy-etched.step / sp3485en-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp3485en-hxy.step / sp3485en-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (8 pp, sha256 67ff0ce3386f5361, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF