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SP3485EIMM

Public Made by Adom

by adom

HGSEMI RS-485/RS-422 ICs, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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SP3485EIMM

HGSEMI · RS-485/RS-422 ICs · MSOP-8

SP3485EIMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high if A-B ≥ 200mV and low if A-B ≤ -200mV; high-impedance when RE is high.
2 RE input Receiver output enable, active low: RO is enabled when RE is low and high-impedance when RE is high; RE high with DE low puts the device in low-power shutdown.
3 DE input Driver output enable: driver outputs are active when DE is high and high-impedance when DE is low; RE high with DE low enters low-power shutdown.
4 DI input Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground.
6 A bidirectional Non-inverting receiver input and non-inverting driver output.
7 B bidirectional Inverting receiver input and inverting driver output.
8 VCC power_in Power supply, 3.0 to 3.6 V operating range.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Communication Interface Chip/UART/485/232
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 3 3.6 V operating voltage range 2
Supply voltage VCC 7 V 3
Control port voltage RE, DE, DI -0.3 7 V 3
Bus input voltage A, B -7 13 V 3
Receiver output voltage RO -0.3 7 V 3
Operating temperature range SP3485EI -40 85 ℃ 3
Storage temperature range -60 150 ℃ 3
Lead soldering temperature TLEAD 260 ℃ 10S 3
Differential driver output (no load) VOD1 3.3 V 4
Differential driver output VOD2 1.5 V Figure 2, RL = 54Ω 4
Differential driver output VOD2 2 V Figure 2, RL = 100Ω 4
Change in magnitude of VOD ∆VOD 0.2 V Figure 2, RL = 54Ω 4
Driver common-mode output voltage VOC 3 V Figure 2, RL = 54Ω 4
Change in magnitude of VOC ∆VOC 0.2 V Figure 2, RL = 54Ω 4
High-level input voltage VIH 2 V DE, DI, RE 4
Low-level input voltage VIL 0.8 V DE, DI, RE 4
Logic input current IIN1 -2 2 uA DE, DI, RE 4
Output short-circuit current, short to high IOSD1 250 mA short to 0V~12V 4
Output short-circuit current, short to low IOSD2 -250 mA short to -7V~0V 4
Input current (A, B) IIN2 1 mA DE = 0 V, VCC=0 or 3.3V, VIN = 12 V 5
Input current (A, B) IIN2 -0.8 mA DE = 0 V, VCC=0 or 3.3V, VIN = -7 V 5
Positive-going input threshold voltage VIT+ 200 mV -7V≦VCM≦12V 5
Negative-going input threshold voltage VIT- -200 mV -7V≦VCM≦12V 5
Input hysteresis voltage Vhys 10 30 mV -7V≦VCM≦12V 5
Low-level output voltage VOL 0.4 V IOUT = +2.5mA, VID = -200 mV 5
Three-state output leakage current IOZR -1 1 uA 0.4 V < VO < 2.4 V 5
Receiver input resistance RIN 12 kΩ -7V≦VCM≦12V 5
Receiver short-circuit current IOSR 8 60 mA 0 V≤VO≤VCC 5
Supply current ICC1 520 800 uA RE =0V, DE = 0 V 5
Supply current ICC2 540 700 uA RE =VCC, DE=VCC 5
Shutdown current ISHDN 0.5 30 uA RE =VCC, DE=0V 5
Driver differential output delay tDD 10 35 ns RDIFF = 60 Ω, CL1=CL2=100pF 6
Driver differential transition time tTD 12 25 ns RDIFF = 60 Ω, CL1=CL2=100pF 6
Driver propagation delay low to high tPLH 8 35 ns RDIFF = 27 Ω 6
Driver propagation delay high to low tPHL 8 35 ns RDIFF = 27 Ω 6
Driver propagation skew /tPLH-tPHL/ tPDS 1 8 ns RDIFF = 27 Ω 6
Driver enable to output high tPZH 20 90 ns RL = 110Ω 6
Driver enable to output low tPZL 20 90 ns RL = 110Ω 6
Driver input low to disable tPLZ 20 80 ns RL = 110Ω 6
Driver input high to disable tPHZ 20 80 ns RL = 110Ω 6
Driver enable to output high from shutdown tDSH 500 900 ns RL = 110Ω 6
Driver enable to output low from shutdown tDSL 500 900 ns RL = 110Ω 6
Receiver propagation delay low to high tRPLH 80 150 ns CL=15pF 7
Receiver propagation delay high to low tRPHL 80 150 ns CL=15pF 7
Receiver propagation skew /tRPLH − tRPHL/ tRPDS 7 10 ns CL=15pF 7
Receiver enable to output low tRPZL 20 50 ns CL=15pF 7
Receiver enable to output high tRPZH 20 50 ns CL=15pF 7
Receiver output low to disable tPRLZ 20 45 ns CL=15pF 7
Receiver output high to disable tPRHZ 20 45 ns CL=15pF 7
Receiver enable to output high from shutdown tRPSH 200 1400 ns CL=15pF 7
Receiver enable to output low from shutdown tRPSL 200 1400 ns CL=15pF 7
Time to shutdown tSHDN 80 300 ns NOTE2 7
Thermal shutdown threshold 140 ℃ 4
Thermal shutdown hysteresis 20 ℃ 4

CAD (KiCad official)

  • Symbol: SP3485EIMM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: sp3485eimm-etched.step / sp3485eimm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp3485eimm.step / sp3485eimm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (17 pp, sha256 c05da1a89ebea3bb, retrieved 2026-10-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF