component

SP3485ECMM

Public Made by Adom

by adom

HGSEMI Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management (pmic)sp3485ecmmfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 2h ago
viewers sp3485ecmm: viewers · Ray 2h ago
package.json Publish 0.1.0 · Ray 2h ago
page.json Set visibility: public · Ray 2h ago
README.md Publish 0.1.0 · Ray 2h ago
sp3485ecmm-etched.glb Publish 0.1.0 · Ray 2h ago
sp3485ecmm-etched.step sp3485ecmm: factory component page (tier=lcsc) · Ray 2h ago
sp3485ecmm-hero.glb sp3485ecmm: hero GLB from the etched model (keeps the MPN mark) · Ray 2h ago
sp3485ecmm-hero.overlay.json Publish 0.1.0 · Ray 2h ago
sp3485ecmm.glb Publish 0.1.0 · Ray 2h ago
sp3485ecmm.kicad_mod Publish 0.1.0 · Ray 2h ago
sp3485ecmm.kicad_sym Publish 0.1.0 · Ray 2h ago
sp3485ecmm.lbr Publish 0.1.0 · Ray 2h ago
sp3485ecmm.step Publish 0.1.0 · Ray 2h ago

SP3485ECMM

HGSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · MSOP-8

SP3485ECMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A-B is at or above +200 mV and low when A-B is at or below -200 mV.
2 RE input Receiver output enable, active low: RE high disables the receiver so RO is high-impedance, and RE high with DE low puts the device into low-power shutdown.
3 DE input Driver output enable, active high: DE low puts the driver outputs in high-impedance, and RE high with DE low puts the device into low-power shutdown.
4 DI input Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground; all voltages in the datasheet are referenced to this pin.
6 A bidirectional Non-inverting receiver input and non-inverting driver output on the RS-485 bus.
7 B bidirectional Inverting receiver input and inverting driver output on the RS-485 bus.
8 VCC power_in Supply pin; the device operates from 3.0 to 3.6 V (3.3 V ±10%), with absolute maximum VCC of +7 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Differential driver output voltage (RL=54Ω) VOD2 1.5 V 图 2，RL = 54Ω 4
Differential driver output voltage (RL=100Ω) VOD2 2 V 图 2，RL = 100 Ω 4
Change in magnitude of differential output voltage ΔVOD 0.2 V 图 2，RL = 54 Ω 4
Driver common-mode output voltage VOC 3 V 图 2，RL = 54 Ω 4
Change in magnitude of common-mode output voltage ΔVOC 0.2 V 图 2，RL = 54 Ω 4
High-level input voltage VIH 2 V DE，DI，RE 4
Low-level input voltage VIL 0.8 V DE，DI，RE 4
Logic input current IIN1 -2 2 uA DE，DI，RE 4
Output short-circuit current, shorted to high IOSD1 250 mA 短路到 0V~12V 4
Output short-circuit current, shorted to low IOSD2 -250 mA 短路到-7V~0V 4
Input current (A, B) IIN2 1 mA DE = 0 V, VCC=0 或 3.3V,VIN = 12 V 5
Input current (A, B) IIN2 -0.8 mA DE = 0 V, VCC=0 或 3.3V,VIN = -7 V 5
Positive input threshold voltage VIT+ 200 mV -7V≦VCM≦12V 5
Negative input threshold voltage VIT- -200 mV -7V≦VCM≦12V 5
Input hysteresis voltage Vhys 10 30 mV -7V≦VCM≦12V 5
Low-level output voltage VOL 0.4 V IOUT = +2.5mA，VID = -200 mV 5
Three-state input leakage current IOZR -1 1 uA 0.4 V < VO < 2.4 V 5
Receiver input resistance RIN 12 kΩ -7V≦VCM≦12V 5
Receiver short-circuit current IOSR -60 60 mA 0 V≤VO≤VCC 5
Supply current (RE=0V, DE=0V) ICC1 800 uA RE =0V，DE = 0 V 5
Supply current (RE=VCC, DE=VCC) ICC2 700 uA RE =VCC，DE=VCC 5
Shutdown current ISHDN 30 uA RE =VCC，DE=0V 5
ESD HBM (A/B pins) -15 15 kV HBM 人体模式 5
ESD MM (A/B pins) -800 800 V MM 机器模式 5
ESD contact discharge (A/B pins) -12 12 kV IEC 61000-4-2 接触放电 5
ESD air discharge (A/B pins) -15 15 kV IEC 61000-4-2 空气放电 5
ESD HBM (other pins) -4 4 kV HBM 人体模式 5
Driver differential output delay tDD 10 35 ns RDIFF = 60 Ω, CL1=CL2=100pF (见图 3 与图 4) 6
Driver differential transition time tTD 12 25 ns 6
Driver propagation delay, low to high tPLH 8 35 ns RDIFF = 27 Ω, (见图 3 与图 4) 6
Driver propagation delay, high to low tPHL 8 35 ns 6
Driver propagation delay skew /tPLH-tPHL/ tPDS 1 8 ns 6
Enable to output high tPZH 20 90 ns RL = 110Ω，（见图 5、6） 6
Enable to output low tPZL 20 90 ns 6
Input low to disable tPLZ 20 80 ns 6
Input high to disable tPHZ 20 80 ns 6
Enable to output high from shutdown tDSH 500 900 ns RL = 110Ω，（见图 5、6） 6
Enable to output low from shutdown tDSL 500 900 ns RL = 110Ω，（见图 5、6） 6
Receiver propagation delay, input to output low to high tRPLH 80 150 ns CL=15pF，见图 7 与图 8 7
Receiver propagation delay, input to output high to low tRPHL 80 150 ns 7
Receiver propagation delay skew /tRPLH − tRPHL/ tRPDS 7 10 ns 7
Enable to output low time tRPZL 20 50 ns CL=15pF，见图 7 与图 8 7
Enable to output high time tRPZH 20 50 ns CL=15pF，见图 7 与图 8 7
Output low to disable time tPRLZ 20 45 ns CL=15pF，见图 7 与图 8 7
Output high to disable time tPRHZ 20 45 ns CL=15pF，见图 7 与图 8 7
Enable to output high time from shutdown tRPSH 200 1400 ns CL=15pF，见图 7 与图 8 7
Enable to output low time from shutdown tRPSL 200 1400 ns CL=15pF，见图 7 与图 8 7
Time to enter shutdown tSHDN 80 300 ns NOTE2 7
Supply voltage VCC 7 V 3
Control port voltage (RE, DE, DI) RE, DE, DI -0.3 7 V 3
Bus-side input voltage (A, B) A, B -7 13 V 3
Receiver output voltage RO -0.3 7 V 3
Storage operating temperature range -60 150 ℃ 3
Soldering temperature range TLEAD 260 ℃ 10 s 3
Operating temperature range (SP3485EC) 0 70 ℃ 3
Operating supply voltage range VCC 3 3.6 V 2

CAD (KiCad official)

  • Symbol: SP3485ECMM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: sp3485ecmm-etched.step / sp3485ecmm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp3485ecmm.step / sp3485ecmm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (17 pp, sha256 c05da1a89ebea3bb, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF