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SP3085EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

SP3085EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with /RE low, RO is high when A-B is at or above -50 mV and low when A-B is at or below -200 mV.
2 /RE input Receiver output enable, active low: low enables RO, high puts RO in high impedance, and /RE high with DE low puts the device into low-power shutdown.
3 DE input Driver output enable: high enables the driver outputs and low puts them in high impedance; /RE high with DE low puts the device into low-power shutdown.
4 DI input Driver input: when DE is high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground reference for the device; all voltages are referenced to ground.
6 A bidirectional Non-inverting receiver input and non-inverting driver output on the bus; bus-side input voltage limits are -7 V to 13 V.
7 B bidirectional Inverting receiver input and inverting driver output on the bus; bus-side input voltage limits are -7 V to 13 V.
8 VCC power_in Supply pin, 4.5 V to 5.5 V operating range (5 V ±10%), absolute maximum +7 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 7 V 3
Control port voltage /RE, DE, DI -0.3 V 3
Bus-side input voltage A, B -7 13 V 3
Receiver output voltage RO -0.3 V 3
Storage operating temperature range -60 150 ℃ 3
Soldering temperature range TLEAD 260 ℃ 10 s 3
Continuous power dissipation, SOP-8 400 mW 3
Operating temperature range (SP3085EI) -40 85 ℃ SP3085EI 3
Supply voltage operating range VCC 4.5 5.5 V 2
Differential driver output VOD2 VOD2 1.5 V 图 2,RL = 27 Ω 3
Differential driver output VOD2 VOD2 2 V 图 2,RL = 50 Ω 3
Change in magnitude of VOD ΔVOD 0.2 V 图 2,RL = 27 Ω 3
Change in magnitude of VOC ΔVOC 0.2 V 图 2,RL = 27 Ω 3
High-level input voltage VIH 2 V DE,DI,/RE 3
Low-level input voltage VIL 0.8 V DE,DI,/RE 3
Logic input current IIN1 -2 2 uA DE,DI,/RE 3
Output short-circuit current, short to high IOSD1 35 250 mA 短路到 0V~12V 3
Output short-circuit current, short to low IOSD2 -250 -35 mA 短路到-7V~0V 3
Input current (A, B) at VIN = 12 V IIN2 125 uA DE = 0 V,VCC=0 或 5V,VIN = 12 V 4
Input current (A, B) at VIN = -7 V IIN2 -100 uA DE = 0 V, VCC=0 或 5V,VIN = -7 V 4
Input hysteresis voltage Vhys 10 30 mV -7V≦VCM≦12V 4
Low-level output voltage VOL 0.4 V IOUT = +4mA,VID = -200 mV 4
Three-state input leakage current IOZR -1 1 uA 0.4 V < VO < 2.4 V 4
Receiver input resistance RIN 96 kΩ -7V≦VCM≦12V 4
Receiver short-circuit current IOSR -95 95 mA 0 V≤VO≤VCC 4
Supply current, driver disabled ICC1 180 300 uA /RE=0V 或 VCC,DE = 0 V 4
Supply current, driver and receiver enabled ICC2 150 300 uA /RE=VCC,DE=VCC 4
Shutdown supply current ISHDN 0.5 10 uA /RE=VCC,DE=0V 4
ESD HBM, pins A and B -16 16 kV 4
ESD contact discharge, pins A and B -16 16 kV 4
ESD HBM, other ports -6 6 kV 4
Driver propagation delay, low to high tDPLH 100 150 ns RDIFF = 54 Ω, CL1=CL2=100pF 4
Driver propagation delay, high to low tDPHL 100 150 ns RDIFF = 54 Ω, CL1=CL2=100pF 4
Driver output skew tSKEW1 -10 10 ns 4
Driver rise and fall time tDR, tDF 190 250 ns 4
Driver enable to output high tDZH 70 160 ns CL= 100 pF,S1 闭合(见图 5、6) 4
Driver enable to output low tDZL 70 160 ns CL= 100 pF,S1 闭合(见图 5、6) 4
Driver input low to disable tDLZ 70 100 ns CL = 15 pF,S2 闭合(见图 5、6) 4
Driver input high to disable tDHZ 70 100 ns CL = 15 pF,S2 闭合(见图 5、6) 4
Driver enable to output high in shutdown tDZH(SHDN) 80 120 ns CL = 15 pF,S2 闭合(见图 5、6) 4
Driver enable to output low in shutdown tDZL(SHDN) 80 120 ns CL = 15 pF,S1 闭合(见图 5、6) 4
Receiver propagation delay, low to high tRPLH 50 80 ns 见图 7 与图 8,VID≥2.0V;上升与下降沿时间 VID≤15ns 5
Receiver propagation delay, high to low tRPHL 50 80 ns 5
Receiver output skew tSKEW2 5 15 ns 5
Receiver enable to output low tRZL 25 40 ns CL = 100 pF,S1 闭合(见图 9,10) 5
Receiver enable to output high tRZH 25 40 ns CL = 100 pF,S2 闭合(见图 9,10) 5
Receiver output low to disable tRLZ 25 50 ns CL = 100 pF,S1 闭合(见图 9,10) 5
Receiver output high to disable tRHZ 25 50 ns CL= 100pF,S2 闭合(见图 9,10) 5
Receiver enable to output high in shutdown tRZH(SHDN) 1000 ns CL = 100 pF,S2 闭合(见图 9,10) 5
Receiver enable to output low in shutdown tRZL(SHDN) 1000 ns CL= 100 pF,S1 闭合(见图 9,10) 5
Time to enter shutdown tSHDN 50 200 600 ns NOTE2 5

CAD (KiCad official)

  • Symbol: SP3085EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: sp3085eim-etched.step / sp3085eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp3085eim.step / sp3085eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (13 pp, sha256 233345f58348b0ba, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF