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SP3085ECMM

Public Made by Adom

by adom

HGSEMI RS-485 / RS-422 ICs, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SP3085ECMM

HGSEMI · RS-485 / RS-422 ICs · MSOP-8

SP3085ECMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with /RE low, RO is high when A-B ≥ -50 mV and low when A-B ≤ -200 mV.
2 /RE input Active-low receiver output enable: low enables RO, high puts RO in high-impedance, and /RE high with DE low puts the device into low-power shutdown.
3 DE input Driver output enable: high enables the driver outputs, low puts them in high-impedance, and /RE high with DE low puts the device into low-power shutdown.
4 DI input Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground reference for the device; all voltages are referenced to ground.
6 A bidirectional Non-inverting receiver input and driver output on the bus; bus-side input voltage is limited to -7 V to 13 V.
7 B bidirectional Inverting receiver input and driver output on the bus; bus-side input voltage is limited to -7 V to 13 V.
8 VCC power_in Power supply, specified for 4.5 V to 5.5 V operation with an absolute maximum of +7 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
电源电压 (Supply voltage, absolute max) VCC 7 V 3
总线侧输入电压 (Bus pins A, B) A, B -7 13 V 3
控制端口电压 (Control port /RE, DE, DI) /RE, DE, DI -0.3 V 3
接收器输出电压 (Receiver output RO) RO -0.3 V 3
存储工作温度范围 (Storage temperature) -60 150 ℃ 3
焊接温度范围 (Lead soldering temperature) TLEAD 260 ℃ 10 s 3
工作电压范围 (Operating supply voltage) VCC 4.5 5.5 V 2
工作温度范围 (Operating temperature, SP3085EC) 0 70 ℃ SP3085EC 3
驱动器差分输出（无负载） VOD1 5 V 3
驱动差分输出 VOD2 1.5 V 图 2，RL = 27 Ω 3
驱动差分输出 VOD2 2 V 图 2，RL = 50 Ω 3
输出电压幅值的变化 ΔVOD 0.2 V 图 2，RL = 27 Ω 3
输出共模电压 VOC 3 V 图 2，RL = 27 Ω 3
共模输出电压幅值的变化 ΔVOC 0.2 V 图 2，RL = 27 Ω 3
高电平输入 VIH 2 V DE，DI，/RE 3
低电平输入 VIL 0.8 V DE，DI，/RE 3
逻辑输入电流 IIN1 -2 2 uA DE，DI，/RE 3
输出短路时的电流，短路到高 IOSD1 35 250 mA 短路到 0V~12V 3
输出短路时的电流，短路到低 IOSD2 -250 -35 mA 短路到-7V~0V 3
过温关断阈值温度 150 ℃ 3
过温关断迟滞温度 20 ℃ 3
输入电流（A，B） IIN2 125 uA DE = 0 V，VCC=0 或 5V，VIN = 12 V 4
输入电流（A，B） IIN2 -100 uA DE = 0 V， VCC=0 或 5V，VIN = -7 V 4
正向输入阈值电压 VIT+ -50 mV -7V≦VCM≦12V 4
反向输入阈值电压 VIT- -200 mV -7V≦VCM≦12V 4
输入迟滞电压 Vhys 10 30 mV -7V≦VCM≦12V 4
低电平输出电压 VOL 0.4 V IOUT = +4mA，VID = -200 mV 4
三态输入漏电流 IOZR -1 1 uA 0.4 V < VO < 2.4 V 4
接收端输入电阻 RIN 96 kΩ -7V≦VCM≦12V 4
接收器短路电流 IOSR -95 95 mA 0 V≤VO≤VCC 4
供电电流 ICC1 180 300 uA /RE=0V 或 VCC，DE = 0 V 4
供电电流 ICC2 150 300 uA /RE=VCC，DE=VCC 4
关断电流 ISHDN 0.5 10 uA /RE=VCC，DE=0V 4
ESD 人体模型 (HBM), A、B -16 16 KV HBM 4
ESD 接触放电, A、B -16 16 KV 接触放电 4
ESD 人体模型 (HBM), 其它端口 -6 6 KV HBM 4
驱动器输入到输出传播延迟（低到高） tDPLH 100 150 ns RDIFF = 54 Ω, CL1=CL2=100pF 4
驱动器输入到输出传播延迟（高到低） tDPHL 100 150 ns RDIFF = 54 Ω, CL1=CL2=100pF 4
/tDPLH- tDPHL/ tSKEW1 -10 10 ns RDIFF = 54 Ω, CL1=CL2=100pF 4
上升沿时间/下降沿时间 tDR, tDF 190 250 ns RDIFF = 54 Ω, CL1=CL2=100pF 4
使能到输出高 tDZH 70 160 ns CL= 100 pF，S1 闭合 4
使能到输出低 tDZL 70 160 ns CL= 100 pF，S1 闭合 4
输入低到禁能 tDLZ 70 100 ns CL = 15 pF，S2 闭合 4
输入高到禁能 tDHZ 70 100 ns CL = 15 pF，S2 闭合 4
关断条件下，使能到输出高 tDZH(SHDN) 80 120 ns CL = 15 pF,S2 闭合 4
关断条件下，使能到输出低 tDZL(SHDN) 80 120 ns CL = 15 pF,S1 闭合 4
接收器输入到输出传播延迟从低到高 tRPLH 50 80 ns VID≥2.0V；上升与下降沿时间≤15ns 5
接收器输入到输出传播延迟从高到低 tRPHL 50 80 ns VID≥2.0V；上升与下降沿时间≤15ns 5
/tRPLH − tRPHL/ tSKEW2 5 15 ns 5
使能到输出低时间 tRZL 25 40 ns CL = 100 pF，S1 闭合 5
使能到输出高时间 tRZH 25 40 ns CL = 100 pF，S2 闭合 5
从输出低到禁能时间 tRLZ 25 50 ns CL = 100 pF,S1 闭合 5
从输出高到禁能时间 tRHZ 25 50 ns CL= 100pF，S2 闭合 5
关断状态下使能到输出高时间 tRZH(SHDN) 1000 ns CL = 100 pF，S2 闭合 5
关断状态下使能到输出低时间 tRZL(SHDN) 1000 ns CL= 100 pF，S1 闭合 5
进入关断状态时间 tSHDN 50 200 600 ns NOTE2 5

CAD (KiCad official)

  • Symbol: SP3085ECMM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: sp3085ecmm-etched.step / sp3085ecmm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp3085ecmm.step / sp3085ecmm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (13 pp, sha256 467b978ccfded829, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF