component
SP3076EIMT
Public Made by Adomby adom
HGSEMI RS-485 / RS-422 ICs, TSSOP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SP3076EIMT
HGSEMI · RS-485 / RS-422 ICs · TSSOP-14
SP3076EIMT from HGSEMI, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | N.C. | unconnected | No connection; internally not connected and may be grounded. |
| 2 | RO | output | Receiver output: with RE low, RO is high if (A-B) is at least -50mV and low if (A-B) is -200mV or less. |
| 3 | ~{RE} | input | Receiver output enable: RO is active when RE is low and high-impedance when RE is high; RE high with DE low enters low-power shutdown, and RE is a hot-swap input. |
| 4 | DE | input | Driver output enable: driver outputs are active when DE is high and high-impedance when DE is low; RE high with DE low enters low-power shutdown, and DE is a hot-swap input. |
| 5 | DI | input | Driver input: with DE high, a low on DI forces Y low and Z high, and a high on DI forces Y high and Z low. |
| 6 | GND | power_in | Ground. |
| 7 | GND | power_in | Ground. |
| 8 | N.C. | unconnected | No connection; internally not connected and may be grounded. |
| 9 | Y | output | Non-inverting driver output. |
| 10 | Z | output | Inverting driver output. |
| 11 | B | input | Inverting receiver input. |
| 12 | A | input | Non-inverting receiver input. |
| 13 | N.C. | unconnected | No connection; internally not connected and may be grounded. |
| 14 | VCC | power_in | Positive supply, 3.15V ≤ VCC ≤ 3.45V, bypassed to ground with a 0.1µF capacitor. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | TSSOP-14 |
| Category | Interface |
| Pins | 14 |
CAD (KiCad official)
- Symbol:
SP3076EIMT - Footprint:
Package_SO:TSSOP-14_4.4x5mm_P0.65mm - 3D model: TSSOP-14 (KiCad packages3D, STEP)
- 3D model files:
sp3076eimt-etched.step/sp3076eimt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sp3076eimt.step/sp3076eimt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (24 pp, sha256
8e05fb90f05e9ccc, retrieved 2026-10-27, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SP3076EIMT
**HGSEMI** · RS-485 / RS-422 ICs · TSSOP-14
SP3076EIMT from HGSEMI, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | N.C. | unconnected | No connection; internally not connected and may be grounded. |
| 2 | RO | output | Receiver output: with RE low, RO is high if (A-B) is at least -50mV and low if (A-B) is -200mV or less. |
| 3 | ~{RE} | input | Receiver output enable: RO is active when RE is low and high-impedance when RE is high; RE high with DE low enters low-power shutdown, and RE is a hot-swap input. |
| 4 | DE | input | Driver output enable: driver outputs are active when DE is high and high-impedance when DE is low; RE high with DE low enters low-power shutdown, and DE is a hot-swap input. |
| 5 | DI | input | Driver input: with DE high, a low on DI forces Y low and Z high, and a high on DI forces Y high and Z low. |
| 6 | GND | power_in | Ground. |
| 7 | GND | power_in | Ground. |
| 8 | N.C. | unconnected | No connection; internally not connected and may be grounded. |
| 9 | Y | output | Non-inverting driver output. |
| 10 | Z | output | Inverting driver output. |
| 11 | B | input | Inverting receiver input. |
| 12 | A | input | Non-inverting receiver input. |
| 13 | N.C. | unconnected | No connection; internally not connected and may be grounded. |
| 14 | VCC | power_in | Positive supply, 3.15V ≤ VCC ≤ 3.45V, bypassed to ground with a 0.1µF capacitor. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | TSSOP-14 |
| Category | Interface |
| Pins | 14 |
## CAD (KiCad official)
- Symbol: `SP3076EIMT`
- Footprint: `Package_SO:TSSOP-14_4.4x5mm_P0.65mm`
- 3D model: TSSOP-14 (KiCad packages3D, STEP)
- 3D model files: `sp3076eimt-etched.step` / `sp3076eimt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sp3076eimt.step` / `sp3076eimt.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HGSEMI datasheet](docs/sp3076eimt-datasheet.pdf) (24 pp, sha256 `8e05fb90f05e9ccc`, retrieved 2026-10-27, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/sp3076eimt-datasheet.pdf)