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SP3074EEN-L

MaxLinear · RS-485 / RS-422 ICs · SOIC-8

SP3074EEN-L from MaxLinear, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Positive supply, 3.3V ±0.3V; bypass VCC to GND with a 0.1µF capacitor.
2 RO output Receiver output: RO is high when (A - B) ≥ -50mV and low when (A - B) ≤ -200mV, and it fails safe to high for open or shorted inputs.
3 DI input Driver input: a low level forces the noninverting output Y low and the inverting output Z high, and a high level forces Y high and Z low.
4 GND power_in Ground reference for the device.
5 Y output Noninverting driver output, meeting RS-485/RS-422 levels with short-circuit current limiting and thermal shutdown.
6 Z output Inverting driver output, meeting RS-485/RS-422 levels with short-circuit current limiting and thermal shutdown.
7 B input Inverting receiver input; the receiver input range is -7V to +12V common-mode.
8 A input Noninverting receiver input; the receiver input range is -7V to +12V common-mode.

Key specifications

Parameter Value
Manufacturer MaxLinear
Package SOIC-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Differential driver output voltage (RS-422 load) VOD 2 V RL = 100Ω (RS-422), Figure 1 3
Change in magnitude of differential output voltage ΔVOD 0.2 V RL = 54 or 100Ω, Figure 1 3
Change in magnitude of common mode output voltage ΔVOC -0.2 0.2 V RL = 54 or 100Ω, Figure 1 3
Input high voltage VIH 2 V DE, DI, RE 3
Input low voltage VIL 0.8 V DE, DI, RE 3
Input current IIN -1 1 µA DE, DI, RE 3
Output leakage (Y and Z; full duplex A and B) IO 125 µA DE = GND, VCC = GND or 3.6V, VIN = +12 V 3
Output leakage (Y and Z; full duplex A and B) IO -100 µA DE = GND, VCC = GND or 3.6V, VIN = -7V 3
Driver short-circuit current IOSD -250 250 mA -7V ≤ VOUT ≤ 12V, Figure 4A 3
Receiver differential threshold (sensitivity) VTH -200 -50 mV -7V ≤ VCM ≤ 12V 4
Receiver output low voltage VOL 0.4 V IO = 1mA 4
Tri-state output current at receiver IOZR -1 1 µA 0 ≤ VO ≤ VCC 4
Receiver input resistance RIN 96 kΩ -7V ≤ VCM ≤ 12V 4
Receiver output short-circuit current -60 60 mA 0V ≤ RO ≤ VCC 4
ESD protection, Human Body Model (Y, Z, A, B) -15 15 kV Human Body Model 4
ESD protection, Air Gap (IEC 1000-4-2) -15 15 kV Air Gap (IEC 1000-4-2) 4
ESD protection, Contact (IEC 1000-4-2) -8 8 kV Contact (IEC 1000-4-2) 4
Supply voltage VCC VCC 6 V 3
Input voltage at control input pins (RE, DE) -0.3 6 V 3
Driver input voltage (RE, DE) -0.3 6 V 3
Driver output voltage (A, B, Y, & Z) -8 13 V 3
Receiver input voltage (A, B) -8 13 V 3
Junction temperature 150 ºC 3
Storage temperature range -65 150 ºC 3
Lead temperature (soldering) 300 ºC soldering, 10s 3
Operating temperature range (EEN grade) TA -40 85 ºC SP307_EEN 3
Supply voltage VCC (nominal) VCC -0.3 3.3 0.3 V VCC = +3.3 ±0.3V, unless otherwise noted 3

CAD (KiCad official)

  • Symbol: SP3074EEN-L
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: sp3074een-l-etched.step / sp3074een-l-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp3074een-l.step / sp3074een-l.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MaxLinear datasheet (19 pp, sha256 36aba08af75de5c4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF