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Ray Publish 0.1.0 d3f06cc 17d ago

SP3070TH

Siliup · MOSFETs · TO-252-2L

SP3070TH from Siliup, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the MOSFET, with a gate-source voltage rating of ±20 V (VGS).
2 D passive Drain terminal of the MOSFET, rated for a drain-source voltage of 30 V (VDS) and a continuous drain current of 70 A at TC=25℃.
3 S passive Source terminal of the MOSFET, serving as the reference for VGS and VDS.

Key specifications

Parameter Value
Manufacturer Siliup
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 30 V VGS=0V , ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=24V , VGS=0V , TJ=25℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V , VDS=0V 2
Gate Threshold Voltage VGS(th) 1 1.5 2.5 V VGS=VDS , ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 4.5 6.3 mΩ VGS=10V , ID=20A 2
Static Drain-Source On-Resistance RDS(ON) 6 9 mΩ VGS=4.5V , ID=15A 2
Diode Forward Voltage VSD 1.2 V VGS=0V , IS=1A , TJ=25℃ 2
Maximum Body-Diode Continuous Current IS 70 A 2
Drain-Source Voltage VDS 30 V 2
Gate-Source Voltage VGS -20 20 V 2
Continuous Drain Current ID 70 A TC=25℃ 2
Continuous Drain Current ID 47 A TC=100℃ 2
Pulsed Drain Current IDM 280 A 2
Single Pulse Avalanche Energy EAS 132 mJ Note 1: VDD=15V, VGS=10V, L=0.5mH, RG=25Ω 2
Power Dissipation PD 36 W TC=25℃ 2
Storage Temperature Range TSTG -55 150 ℃ 2
Operating Junction Temperature Range TJ -55 150 ℃ 2
Thermal Resistance Junction-to-Case RθJC 1.7 ℃/W 2

CAD (KiCad official)

  • Symbol: SP3070TH
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: sp3070th-etched.step / sp3070th-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp3070th.step / sp3070th.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Siliup datasheet (5 pp, sha256 cf4e76782de6d149, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF