component
SP3030-01ETG
Public Made by Adomby adom
Littelfuse ESD Protection Devices, SOD-882. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 13d ago |
| viewers | 13d ago |
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| page.json | 13d ago |
| README.md | 13d ago |
| sp3030-01etg-etched.glb | 13d ago |
| sp3030-01etg-etched.step | 13d ago |
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| sp3030-01etg-hero.overlay.json | 13d ago |
| sp3030-01etg.glb | 13d ago |
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| sp3030-01etg.lbr | 13d ago |
| sp3030-01etg.step | 13d ago |
SP3030-01ETG
Littelfuse · ESD Protection Devices · SOD-882
SP3030-01ETG from Littelfuse, in a SOD-882. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Pin 1 is one terminal of the SP3030 unidirectional 0.5 pF TVS diode, and it is the pin identified by the Pin 1 product ID mark on the SOD882 package (the datasheet gives no separate electrical limit for this pin). |
| 2 | 2 | passive | Pin 2 is the other terminal of the SP3030 unidirectional 0.5 pF TVS diode, with the datasheet giving only the I/O-to-I/O diode capacitance of 0.5 pF at 0 V bias and 5 V reverse standoff for the device. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse |
| Package | SOD-882 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Current (tp=8/20μs) | IPP | 3 | A | tp=8/20μs | 2 | ||
| Operating Temperature | TOP | -40 | 125 | °C | 2 | ||
| Storage Temperature | TSTOR | -55 | 150 | °C | 2 | ||
| Storage Temperature Range | -55 | 150 | °C | 2 | |||
| Maximum Junction Temperature | 150 | °C | 2 | ||||
| Maximum Lead Temperature (Soldering 20-40s) | 260 | °C | Soldering 20-40s | 2 | |||
| Reverse Leakage Current | ILEAK | 0.1 | 0.5 | µA | VR=5V with 1pin at GND | 2 | |
| ESD Withstand Voltage (IEC61000-4-2 Contact) | VESD | -20 | 20 | kV | IEC61000-4-2 (Contact) | 2 | |
| ESD Withstand Voltage (IEC61000-4-2 Air) | VESD | -30 | 30 | kV | IEC61000-4-2 (Air) | 2 | |
| Reverse Standoff Voltage | VRWM | 5 | V | 2 | |||
| Clamp Voltage | VC | 9.2 | V | IPP=1A, tp=8/20µs, Fwd | 2 | ||
| Clamp Voltage | VC | 10 | V | IPP=2A, tp=8/20µs, Fwd | 2 | ||
| Dynamic Resistance | RDYN | 0.55 | Ω | (VC2-VC1)/(IPP2-IPP1) | 2 | ||
| Diode Capacitance | CI/O-I/O | 0.5 | pF | Reverse Bias=0V, f=1 MHz | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper Alloy | Lead Plating Pre-Plated Frame Lead Material Copper Alloy | 3 |
CAD (KiCad official)
- Symbol:
SP3030-01ETG - Footprint:
Diode_SMD:D_SOD-882 - 3D model: SOD-882 (KiCad packages3D, STEP)
- 3D model files:
sp3030-01etg-etched.step/sp3030-01etg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sp3030-01etg.step/sp3030-01etg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Littelfuse datasheet (4 pp, sha256
ed2e16df218f364b, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).