component
SP3022-01ETG
Public Made by Adomby adom
Littelfuse ESD Protection Devices, SOD-882. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSP3022-01ETG
Littelfuse · ESD Protection Devices · SOD-882
SP3022-01ETG from Littelfuse, in a SOD-882. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the back-to-back bidirectional TVS diode pair, rated for ±20kV contact and ±30kV air ESD per IEC 61000-4-2 with 0.35pF typical capacitance at VR=0V. |
| 2 | 2 | passive | The other terminal of the back-to-back bidirectional TVS diode pair, providing symmetrical protection for AC data lines with a 5.3V reverse standoff voltage. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse |
| Package | SOD-882 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | VBR | 6.8 | 7.8 | 9 | V | IR=1mA | 2 |
| Reverse Leakage Current | ILEAK | 100 | nA | VR=5.3V | 2 | ||
| Diode Capacitance | CD | 0.35 | 0.5 | pF | Reverse Bias=0V | 2 | |
| Dynamic Resistance | RDYN | 0.7 | Ω | TLP, tp=100ns, I/O to GND | 2 | ||
| ESD Withstand Voltage (Contact) | VESD | -20 | 20 | kV | IEC 61000-4-2 (Contact) | 2 | |
| ESD Withstand Voltage (Air) | VESD | -30 | 30 | kV | IEC 61000-4-2 (Air) | 2 | |
| Reverse Standoff Voltage | VRWM | 5.3 | V | 2 | |||
| Clamp Voltage | VC | 12 | V | IPP=1A, tp=8/20µs, Fwd | 2 | ||
| Peak Pulse Power | PPK | 20 | W | tP=8/20µs | 2 | ||
| Peak Current | IPP | 3 | A | tp=8/20μs | 2 | ||
| Operating Temperature | TOP | -40 | 125 | °C | 2 | ||
| Storage Temperature Range | -55 | 150 | °C | 2 | |||
| Maximum Junction Temperature | 150 | °C | 2 | ||||
| Maximum Lead Temperature (Soldering) | 260 | °C | Soldering 20-40s | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper Alloy | tin | Lead Plating Pre-Plated Frame or Matte Tin Lead Material Copper Alloy | 3 |
CAD (KiCad official)
- Symbol:
SP3022-01ETG - Footprint:
Diode_SMD:D_SOD-882 - 3D model: SOD-882 (KiCad packages3D, STEP)
- 3D model files:
sp3022-01etg-etched.step/sp3022-01etg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sp3022-01etg.step/sp3022-01etg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Littelfuse datasheet (5 pp, sha256
a1d402595ba75a58, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).