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Contents

README

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SP232EIMT

HGSEMI · RS232 ICs · TSSOP-16

SP232EIMT from HGSEMI, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C1+ passive Connects to the external capacitor of the positive voltage multiplier unit (charge pump).
2 V+ power_out Output of the positive voltage from the multiplier unit; the recommended operating conditions give a transmitter output high voltage (V+) of at least 5.0 V.
3 C1- passive Connects to the external capacitor of the positive voltage multiplier unit (charge pump).
4 C2+ passive Connects to the external capacitor of the negative voltage multiplier unit (charge pump).
5 C2- passive Connects to the external capacitor of the negative voltage multiplier unit (charge pump).
6 V- power_out Output of the negative voltage from the multiplier unit; the recommended operating conditions give a transmitter output low voltage (V-) of at most -5.0 V.
7 T2OUT output Transmitter data output at RS-232 levels.
8 R2IN input Receiver data input at RS-232 levels; receiver input voltage range is -30 V to 30 V.
9 R2OUT output Receiver data output at TTL/CMOS levels.
10 T2IN input Transmitter data input at TTL/CMOS levels.
11 T1IN input Transmitter data input at TTL/CMOS levels.
12 R1OUT output Receiver data output at TTL/CMOS levels.
13 R1IN input Receiver data input at RS-232 levels; receiver input voltage range is -30 V to 30 V.
14 T1OUT output Transmitter data output at RS-232 levels.
15 GND power_in Common ground return for the device.
16 VCC power_in Supply input; the recommended supply voltage is 4.5 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package TSSOP-16
Category Interface
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply current, static ICC 14 mA VCC=5.0V, VIL=0V 5
Receiver hysteresis voltage Vh 0.2 1 V VCC=5.0V 5
Receiver on (operation) voltage VOn 2.3 V VO≤0.1 V, IOL≤20 uA 5
Receiver off (dropout) voltage Voff 0.9 V VO≥VCC-0.1V, IOH≤-20 uA 5
Receiver output low voltage VOL 0.4 V IOL=3.2 mA, VCC=4.5 V, VIH=2.4 V 5
Receiver output high voltage VOH 3.5 V IOH=-1.0 mA, VCC=4.5 V, VIL=0.8 V 5
Receiver input resistance RI 3 7 kOhm VCC=5.0 V 5
Transmitter output low voltage VOL -5 V VCC=4.5 V, VIH=2.0 V, RL=3.0 kOhm 5
Transmitter output high voltage VOH 5 V VCC=4.5 V, VIL=0.8 V, RL=3.0 kOhm 5
Input low current IIL -10 uA VCC=5.5 V, VIL=0 V 5
Input high current IIH 10 uA VCC=5.5 V, VIH=VCC 5
Speed of output front change (slew rate) SR 2.7 27 V/µs VCC=5.0 V, CL=50-1000 pF, RL=3.0-7.0 kOhm 5
Output resistance RO 300 Ohm VCC=V+=V-=0 V, VO=±2 V 5
Short circuit output current ISC -60 60 mA VCC=5.5 V, VO=0 V, VI=VCC / VI=0 V 5
Speed of information transmission ST 120 kbps VCC=4.5 V, CL=1000 pF, RL=3.0 kOhm, tW=7us (for extreme tW=8us) 5
Signal propagation delay time (on/off), CL=150 pF tPHLR 10 us VCC=4.5 V, CL=150 pF, VIL=0 V, VIH=3.0 V, tLH=tHL≤10 ns 6
Signal propagation delay time (on/off), CL=2500 pF tphlt 6 us VCC=4.5 V, CL=2500 pF, VIL=0 V, VIH=3.0 V, RL=3 kOhm, tLH=tHL≤10 ns 6
Input capacitance CIN 9 pF VCC=5.0 V 6
Dynamic capacitance CPD 90 pF 6
Supply voltage VCC -0.3 6 V 3
Transmitter high output voltage V+ 14 V 3
Transmitter low output voltage V- -0.3 -14 V 3
Transmitter input voltage VTIN -0.3 V 3
Receiver input voltage VRIN -30 30 V 3
Ambient temperature Ta -60 150 ℃ 3
Lead temperature (soldering) TL 260 ℃ 10 seconds soldering 3
Supply voltage VCC 4.5 5.5 V 4
Transmitter output high voltage V+ 5 V 4
Transmitter output low voltage V- -5 V 4
Transmitter input voltage VTIN 0 V 4
Receiver input voltage VRIN -30 30 V 4
Transmitter short circuit output current ISC -60 60 mA 4
Ambient temperature (SP232EI, industrial) Ta -40 85 ℃ SP232EI 4

CAD (KiCad official)

  • Symbol: SP232EIMT
  • Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: sp232eimt-etched.step / sp232eimt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp232eimt.step / sp232eimt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (11 pp, sha256 7a22dc363a005e60, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF