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SP202EEN-HXY
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HXY MOSFET RS232 ICs, SOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SP202EEN-HXY
HXY MOSFET · RS232 ICs · SOP-16
SP202EEN-HXY from HXY MOSFET, in a SOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | C1+ | passive | Terminal for the positive side of the charge-pump C1 capacitor, with 0.1 µF capacitors specified for C1 to C4. |
| 2 | V+ | power_out | Positive voltage generated by the charge pump, with the datasheet noting that a larger capacitor (up to 10 µF) reduces output impedance at V+. |
| 3 | C1- | passive | Terminal for the negative side of the charge-pump C1 capacitor, with 0.1 µF capacitors specified for C1 to C4. |
| 4 | C2+ | passive | Terminal for the positive side of the charge-pump C2 capacitor, with 0.1 µF capacitors specified for C1 to C4. |
| 5 | C2- | passive | Terminal for the negative side of the charge-pump C2 capacitor, with 0.1 µF capacitors specified for C1 to C4. |
| 6 | V- | power_out | Negative voltage generated by the charge pump, with the datasheet giving a V- low-level output limit of -14 V at the transmitter. |
| 7 | T2OUT | output | RS-232 driver output at RS-232 levels, with the datasheet specifying a driver output slew rate of 30 V/µs maximum. |
| 8 | R2IN | input | RS-232 receiver input at RS-232 levels, with the datasheet specifying a receiver input voltage of -30 V to 30 V. |
| 9 | R2OUT | output | RS-232 receiver output at TTL/CMOS levels. |
| 10 | T2IN | input | RS-232 driver input at TTL/CMOS levels, with the datasheet specifying a driver low-level input of 0.8 V maximum and high-level input of 2 V minimum. |
| 11 | T1IN | input | RS-232 driver input at TTL/CMOS levels, with the datasheet specifying a driver low-level input of 0.8 V maximum and high-level input of 2 V minimum. |
| 12 | R1OUT | output | RS-232 receiver output at TTL/CMOS levels. |
| 13 | R1IN | input | RS-232 receiver input at RS-232 levels, with the datasheet specifying a receiver input voltage of -30 V to 30 V. |
| 14 | T1OUT | output | RS-232 driver output at RS-232 levels, with the datasheet specifying a driver output slew rate of 30 V/µs maximum. |
| 15 | GND | power_in | Ground reference for the device. |
| 16 | VCC | power_in | Supply voltage input, with the datasheet giving a recommended supply range of 4.5 V to 5.5 V and an absolute maximum of 6.0 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOP-16 |
| Category | Communication Interface Chip |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 4.5 | 5 | 5.5 | V | 3 | |
| Driver high-level input voltage (DIN) | VIH | 2 | V | 3 | |||
| Driver low-level input voltage (DIN) | VIL | 0.8 | V | 3 | |||
| Driver input voltage (DIN) | VI | 0 | 5.5 | V | 3 | ||
| Receiver input voltage | VI | -30 | 30 | V | 3 | ||
| Supply voltage | VCC | -0.3 | 6 | V | 3 | ||
| Transmitter low output voltage | V- | -0.3 | -14 | V | 3 | ||
| Receiver input voltage | VRIN | -30 | 30 | V | 3 | ||
| Voltage applied to receiver output | VROUT | -0.3 | V | 3 | |||
| Storage temperature range | TSTG | -65 | 150 | °C | 3 | ||
| ESD protection Human-Body Model | -15 | 15 | 15 | kV | Human-Body Model, pins DOUT, RIN | 3 | |
| Junction-to-ambient thermal resistance | RθJA | 84.6 | °C/W | 3 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 43.5 | °C/W | 3 | |||
| Junction-to-board thermal resistance | RθJB | 43.2 | °C/W | 3 | |||
| Junction-to-top characterization parameter | ψJT | 10.4 | °C/W | 3 | |||
| Junction-to-board characterization parameter | ψJB | 42.8 | °C/W | 3 | |||
| Supply current | ICC | 8 | 15 | mA | No load, VCC = 5 V | 3 | |
| High-level output voltage | VOH | 5 | 9 | V | DOUT at RL = 3kΩ to GND, DIN = GND | 4 | |
| Low-level output voltage | VOL | -9 | -5 | V | DOUT at RL = 3kΩ to GND, DIN = VCC | 4 | |
| High-level input current | IIH | 0 | 200 | µA | VI = VCC | 4 | |
| Low-level input current | IIL | -200 | 0 | µA | VI at 0V | 4 | |
| Short-circuit output current | IOS | -60 | 10 | 60 | mA | VCC = 5.5V, VO = 0V | 4 |
| Output resistance | rO | 300 | Ω | VCC, V+, and V- = 0V, VO = ±2V | 4 | ||
| High-level output voltage (receiver) | VOH | 3.5 | V | IOH = -1mA | 4 | ||
| Low-level output voltage (receiver) | VOL | 0.4 | V | IOL = 1.6mA | 4 | ||
| Positive-going input threshold voltage | VIT+ | 1.7 | 2.4 | V | VCC = 5V, TA = 25°C | 4 | |
| Negative-going input threshold voltage | VIT- | 0.8 | 1.2 | V | VCC = 5V, TA = 25°C | 4 | |
| Input hysteresis (VIT+, VIT-) | Vhys | 0.2 | 0.5 | 1 | V | 4 | |
| Input resistance | ri | 3 | 5 | 7 | kΩ | VI = ±3V to ±25V | 4 |
| Maximum data rate | 120 | kbit/s | CL = 50pF to 1000pF, RL = 3kΩ to 7kΩ, one DOUT switching | 4 | |||
| Propagation delay time, low- to high-level output (driver) | tPLH(D) | 2 | µs | CL = 2500pF, RL = 3kΩ, all drivers loaded | 4 | ||
| Propagation delay time, high- to low-level output (driver) | tPHL(D) | 2 | µs | CL = 2500pF, RL = 3kΩ, all drivers loaded | 4 | ||
| Pulse skew (driver) | tsk(p) | 300 | ns | CL = 150 to 2500pF, RL = 3kΩ to 7 kΩ | 4 | ||
| Slew rate, transition region | SR(tr) | 3 | 6 | 30 | V/µs | CL = 50 to 1000pF, RL = 3kΩ to 7 kΩ, VCC = 5V | 4 |
| Propagation delay time, low- to high-level output (receiver) | tPLH(R) | 0.5 | 10 | µs | CL = 150pF | 4 | |
| Propagation delay time, high- to low-level output (receiver) | tPHL(R) | 0.5 | 10 | µs | CL = 150pF | 4 | |
| Pulse skew (receiver) | tsk(p) | 300 | ns | CL = 150pF | 4 |
CAD (KiCad official)
- Symbol:
SP202EEN-HXY - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOP-16 (KiCad packages3D, STEP)
- 3D model files:
sp202een-hxy-etched.step/sp202een-hxy-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sp202een-hxy.step/sp202een-hxy.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (9 pp, sha256
2886398c00153352, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SP202EEN-HXY
**HXY MOSFET** · RS232 ICs · SOP-16
SP202EEN-HXY from HXY MOSFET, in a SOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | C1+ | passive | Terminal for the positive side of the charge-pump C1 capacitor, with 0.1 µF capacitors specified for C1 to C4. |
| 2 | V+ | power_out | Positive voltage generated by the charge pump, with the datasheet noting that a larger capacitor (up to 10 µF) reduces output impedance at V+. |
| 3 | C1- | passive | Terminal for the negative side of the charge-pump C1 capacitor, with 0.1 µF capacitors specified for C1 to C4. |
| 4 | C2+ | passive | Terminal for the positive side of the charge-pump C2 capacitor, with 0.1 µF capacitors specified for C1 to C4. |
| 5 | C2- | passive | Terminal for the negative side of the charge-pump C2 capacitor, with 0.1 µF capacitors specified for C1 to C4. |
| 6 | V- | power_out | Negative voltage generated by the charge pump, with the datasheet giving a V- low-level output limit of -14 V at the transmitter. |
| 7 | T2OUT | output | RS-232 driver output at RS-232 levels, with the datasheet specifying a driver output slew rate of 30 V/µs maximum. |
| 8 | R2IN | input | RS-232 receiver input at RS-232 levels, with the datasheet specifying a receiver input voltage of -30 V to 30 V. |
| 9 | R2OUT | output | RS-232 receiver output at TTL/CMOS levels. |
| 10 | T2IN | input | RS-232 driver input at TTL/CMOS levels, with the datasheet specifying a driver low-level input of 0.8 V maximum and high-level input of 2 V minimum. |
| 11 | T1IN | input | RS-232 driver input at TTL/CMOS levels, with the datasheet specifying a driver low-level input of 0.8 V maximum and high-level input of 2 V minimum. |
| 12 | R1OUT | output | RS-232 receiver output at TTL/CMOS levels. |
| 13 | R1IN | input | RS-232 receiver input at RS-232 levels, with the datasheet specifying a receiver input voltage of -30 V to 30 V. |
| 14 | T1OUT | output | RS-232 driver output at RS-232 levels, with the datasheet specifying a driver output slew rate of 30 V/µs maximum. |
| 15 | GND | power_in | Ground reference for the device. |
| 16 | VCC | power_in | Supply voltage input, with the datasheet giving a recommended supply range of 4.5 V to 5.5 V and an absolute maximum of 6.0 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOP-16 |
| Category | Communication Interface Chip |
| Pins | 16 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 4.5 | 5 | 5.5 | V | | 3 |
| Driver high-level input voltage (DIN) | VIH | 2 | | | V | | 3 |
| Driver low-level input voltage (DIN) | VIL | | | 0.8 | V | | 3 |
| Driver input voltage (DIN) | VI | 0 | | 5.5 | V | | 3 |
| Receiver input voltage | VI | -30 | | 30 | V | | 3 |
| Supply voltage | VCC | -0.3 | | 6 | V | | 3 |
| Transmitter low output voltage | V- | -0.3 | | -14 | V | | 3 |
| Receiver input voltage | VRIN | -30 | | 30 | V | | 3 |
| Voltage applied to receiver output | VROUT | -0.3 | | | V | | 3 |
| Storage temperature range | TSTG | -65 | | 150 | °C | | 3 |
| ESD protection Human-Body Model | | -15 | 15 | 15 | kV | Human-Body Model, pins DOUT, RIN | 3 |
| Junction-to-ambient thermal resistance | RθJA | | 84.6 | | °C/W | | 3 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 43.5 | | °C/W | | 3 |
| Junction-to-board thermal resistance | RθJB | | 43.2 | | °C/W | | 3 |
| Junction-to-top characterization parameter | ψJT | | 10.4 | | °C/W | | 3 |
| Junction-to-board characterization parameter | ψJB | | 42.8 | | °C/W | | 3 |
| Supply current | ICC | | 8 | 15 | mA | No load, VCC = 5 V | 3 |
| High-level output voltage | VOH | 5 | | 9 | V | DOUT at RL = 3kΩ to GND, DIN = GND | 4 |
| Low-level output voltage | VOL | -9 | | -5 | V | DOUT at RL = 3kΩ to GND, DIN = VCC | 4 |
| High-level input current | IIH | 0 | | 200 | µA | VI = VCC | 4 |
| Low-level input current | IIL | -200 | | 0 | µA | VI at 0V | 4 |
| Short-circuit output current | IOS | -60 | 10 | 60 | mA | VCC = 5.5V, VO = 0V | 4 |
| Output resistance | rO | 300 | | | Ω | VCC, V+, and V- = 0V, VO = ±2V | 4 |
| High-level output voltage (receiver) | VOH | 3.5 | | | V | IOH = -1mA | 4 |
| Low-level output voltage (receiver) | VOL | | | 0.4 | V | IOL = 1.6mA | 4 |
| Positive-going input threshold voltage | VIT+ | | 1.7 | 2.4 | V | VCC = 5V, TA = 25°C | 4 |
| Negative-going input threshold voltage | VIT- | | 0.8 | 1.2 | V | VCC = 5V, TA = 25°C | 4 |
| Input hysteresis (VIT+, VIT-) | Vhys | 0.2 | 0.5 | 1 | V | | 4 |
| Input resistance | ri | 3 | 5 | 7 | kΩ | VI = ±3V to ±25V | 4 |
| Maximum data rate | | | | 120 | kbit/s | CL = 50pF to 1000pF, RL = 3kΩ to 7kΩ, one DOUT switching | 4 |
| Propagation delay time, low- to high-level output (driver) | tPLH(D) | | | 2 | µs | CL = 2500pF, RL = 3kΩ, all drivers loaded | 4 |
| Propagation delay time, high- to low-level output (driver) | tPHL(D) | | | 2 | µs | CL = 2500pF, RL = 3kΩ, all drivers loaded | 4 |
| Pulse skew (driver) | tsk(p) | | | 300 | ns | CL = 150 to 2500pF, RL = 3kΩ to 7 kΩ | 4 |
| Slew rate, transition region | SR(tr) | 3 | 6 | 30 | V/µs | CL = 50 to 1000pF, RL = 3kΩ to 7 kΩ, VCC = 5V | 4 |
| Propagation delay time, low- to high-level output (receiver) | tPLH(R) | 0.5 | | 10 | µs | CL = 150pF | 4 |
| Propagation delay time, high- to low-level output (receiver) | tPHL(R) | 0.5 | | 10 | µs | CL = 150pF | 4 |
| Pulse skew (receiver) | tsk(p) | | | 300 | ns | CL = 150pF | 4 |
## CAD (KiCad official)
- Symbol: `SP202EEN-HXY`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOP-16 (KiCad packages3D, STEP)
- 3D model files: `sp202een-hxy-etched.step` / `sp202een-hxy-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sp202een-hxy.step` / `sp202een-hxy.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HXY MOSFET datasheet](docs/sp202een-hxy-datasheet.pdf) (9 pp, sha256 `2886398c00153352`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/sp202een-hxy-datasheet.pdf)