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SP010N10HTQ

Siliup · MOSFETs · TO-220-3L

SP010N10HTQ from Siliup, in a TO-220-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the MOSFET; the datasheet rates gate-source voltage VGS at ±20 V.
2 D passive Drain terminal of the MOSFET; the datasheet rates drain-source voltage VDS at 100 V and continuous drain current ID at 100 A (Tc=25℃).
3 S passive Source terminal of the MOSFET; the datasheet rates the diode continuous current IS at 100 A.

Key specifications

Parameter Value
Manufacturer Siliup
Package TO-220-3L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 80 V VGS=0V , ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=80V , VGS=0V , TJ=25℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V , VDS=0V 2
Gate Threshold Voltage VGS(th) 2 3 4 V VGS=VDS , ID =250uA 2
Static Drain-Source On-Resistance RDS(ON) 10 13 mΩ VGS=10V , ID=40A 2
Diode Forward Voltage VSD 1.2 V VGS=0V , IS=40A , TJ=25℃ 2
Diode Continuous Current IS 100 A 2
Drain source voltage VDS 100 V 2
Gate source voltage VGS -20 20 V 2
Continuous drain current ID 100 A Tc=25℃ 2
Continuous drain current ID 80 A Tc=100℃ 2
Pulsed drain current IDM 400 A 2
Single pulsed avalanche energy EAS 720 mJ Note 1: starting Tj = 25℃, VDD=50V, VGS = 10V, L = 0.5mH, Rg=25Ω 2
Power dissipation PD 200 W Tc=25℃ 2
Thermal resistance, junction-case RθJC 0.625 ℃/W 2
Storage Temperature Range TSTG -55 150 ℃ 2
Operating Junction Temperature Range TJ -55 150 ℃ 2

CAD (KiCad official)

  • Symbol: SP010N10HTQ
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220-3L (KiCad packages3D, STEP)
  • 3D model files: sp010n10htq-etched.step / sp010n10htq-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp010n10htq.step / sp010n10htq.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Siliup datasheet (6 pp, sha256 bcc7aaf1e8fc4b3f, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF