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Contents

README

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SP010N02BGHTF

Siliup · MOSFETs · TO-247

SP010N02BGHTF from Siliup, in a TO-247. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Pin 1 is the gate (G) of the TO-247 package, as assigned in the datasheet package pinout.
2 D passive Pin 2 is the drain (D) of the TO-247 package, as assigned in the datasheet package pinout.
3 S passive Pin 3 is the source (S) of the TO-247 package, as assigned in the datasheet package pinout.

Key specifications

Parameter Value
Manufacturer Siliup
Package TO-247
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V , ID=250uA 2
Drain Cut-Off Current IDSS 1 μA VDS=80V , VGS=0V , TJ=25℃ 2
Gate Leakage Current IGSS -100 100 nA VGS=±20V , VDS=0V 2
Gate Threshold Voltage VGS(th) 2.7 3.2 4 V VGS=VDS , ID =250uA 2
Drain-Source ON Resistance RDS(ON) 2 2.6 mΩ VGS=10V , ID=20A 2
Drain-Source Voltage VDS 100 V 2
Gate-Source Voltage VGS -20 20 V 2
Continuous Drain Current ID 235 A Tc=25℃ 2
Continuous Drain Current ID 160 A Tc=100℃ 2
Pulsed Drain Current IDM 940 A 2
Single Pulse Avalanche Energy EAS 1458 mJ VDD=50V,VGS=10V,L=0.5mH,RG=25Ω 2
Power Dissipation PD 280 W Tc=25℃ 2
Thermal Resistance Junction-to-Case RθJC 0.45 ℃/W 2
Storage Temperature Range TSTG -55 150 ℃ 2
Operating Junction Temperature Range TJ -55 150 ℃ 2
Source-Drain Diode Forward Voltage VSD 1.2 V IS = 1A, VGS = 0V 2
Maximum Body-Diode Continuous Current IS 235 A 2
Input Capacitance Ciss 10256 pF VDS=50V , VGS=0V , f=1MHz 2
Output Capacitance Coss 1876 pF 2
Reverse Transfer Capacitance Crss 35 pF 2
Total Gate Charge Qg 158 nC VDS=50V , VGS=10V , ID=125A 2
Gate-Source Charge Qgs 51 nC 2
Gate-Drain Charge Qgd 27 nC 2
Turn-On Delay Time td(on) 35 nS VDD=50V, VGS=10V , RG=1.6Ω, ID=125A 2
Rise Time tr 68 nS 2
Turn-Off Delay Time td(off) 150 nS 2
Fall Time tf 105 nS 2
Reverse Recovery Time Trr 86 nS IS=50A, di/dt=100A/us, TJ=25℃ 2
Reverse Recovery Charge Qrr 256 nC 2

CAD (KiCad official)

  • Symbol: SP010N02BGHTF
  • Footprint: Package_TO_SOT_THT:TO-247-3_Vertical
  • 3D model: TO-247 (KiCad packages3D, STEP)
  • 3D model files: sp010n02bghtf-etched.step / sp010n02bghtf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sp010n02bghtf.step / sp010n02bghtf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Siliup datasheet (5 pp, sha256 57aa8432e46f65e3, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF