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SN75LBC184M

Public Made by Adom

by adom

HGSEMI RS-485/RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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SN75LBC184M

HGSEMI · RS-485/RS-422 ICs · SOIC-8

SN75LBC184M from HGSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 R output Receiver output, driven high when the inputs are open-circuit (fail-safe) and high-impedance when RE is high; rated VOH 2.8 V min at -8 mA and VOL 0.4 V max at 4 mA.
2 RE input Active-low receiver enable; low enables the receiver and high puts R in high impedance, with VIH 2 V min and VIL 0.8 V max.
3 DE input Driver enable; high enables the driver outputs A and B and low puts them in high impedance, with VIH 2 V min and VIL 0.8 V max.
4 D input Driver data input; high drives A high and B low, low drives A low and B high when DE is high, with VIH 2 V min and VIL 0.8 V max.
5 GND power_in Ground, the network ground reference for all voltages except differential bus voltage.
6 A bidirectional Non-inverting driver output and receiver input bus terminal, with transient voltage suppression and bus voltage range of -7 V to 12 V recommended.
7 B bidirectional Inverting driver output and receiver input bus terminal, with transient voltage suppression and bus voltage range of -7 V to 12 V recommended.
8 VCC power_in Supply voltage, recommended 4.75 V to 5.25 V (5 V typical), absolute maximum 7 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 4.75 5 5.25 V 5
Voltage at any bus terminal VI or VIC -7 12 V separately or common mode 5
High-level input voltage VIH 2 V D, DE, and RE 5
Low-level input voltage VIL 0.8 V D, DE, and RE 5
Differential input voltage /VID/ 12 V 5
High-level output current, driver IOH -60 mA Driver 5
High-level output current, receiver IOH -8 mA Receiver 5
Low-level output current, driver IOL 60 mA Driver 5
Low-level output current, receiver IOL 4 mA Receiver 5
Operating free-air temperature TA 0 70 °C SN75LBC184 5
Supply voltage VCC -0.5 7 V 4
Continuous voltage range at any bus terminal -15 15 V 4
Data input/output voltage -0.3 7 V 4
Receiver output current IO -20 20 mA 4
ESD contact discharge IEC61000-4-2 30 KV A,B,ND 4
ESD air discharge IEC61000-4-2 15 KV A,B,ND 4
ESD human body model 15 KV A,B,ND 4
Lead temperature 260 ℃ Soldering, 10 seconds 4
Power rating M package 1150 mW TA ≤ 25℃; derating 9.2 mW/℃ above 25℃ 5
Power rating M package 736 mW TA = 70°C 5
Driver supply current, enabled ICC 12 25 mA DE = RE = 5 V, No Load 6
Driver supply current, disabled ICC 175 300 µA DE = 0 V, RE = 5 V, No Load 6
High-level input current IIH 50 µA VI = 2.4 V 6
Low-level input current IIL -50 µA VI = 0.4 V 6
Short-circuit output current IOS -250 -120 mA VO = −7 V 6
Short-circuit output current IOS 250 mA VO = VCC 6
Output voltage VO 0 5 V IO = 0 (max printed as VCC) 6
Peak-to-peak change in common-mode output voltage VOC(PP) 0.8 V See Figures 5 and 6 6
Common-mode output voltage VOC 1 3 V See Figure 4 6
Change in common-mode steady-state output voltage ΔVOC(SS) 0.1 V See Figure 5 6
Differential output voltage magnitude /VOD/ 1.5 6 V IO = 0 6
Differential output voltage magnitude /VOD/ 1.5 V RL = 54Ω, See Figure 4 6
Change in differential voltage magnitude between logic states Δ/VOD/ 0.1 V RL = 54Ω 6
Driver differential output delay time, low-to-high td(DH) 1.3 µs RL = 54Ω, CL = 50 pF, See Figure 5 6
Driver differential output delay time, high-to-low td(DL) 1.3 µs RL = 54Ω, CL = 50 pF, See Figure 5 6
Driver propagation delay, low-to-high tPLH 0.5 1.3 µs RL = 54Ω, CL = 50 pF, See Figure 5 6
Driver propagation delay, high-to-low tPHL 0.5 1.3 µs RL = 54Ω, CL = 50 pF, See Figure 5 6
Driver pulse skew tsk(p) 75 150 ns RL = 54Ω, CL = 50 pF, See Figure 5 6
Driver rise time, single ended tr 0.25 1.2 µs RL = 54Ω, CL = 50 pF, See Figure 5 6
Driver fall time, single ended tf 0.25 1.2 µs RL = 54Ω, CL = 50 pF, See Figure 5 6
Driver output enable time to high level tPZH 3.5 µs RL = 110Ω See Figure 2 6
Driver output enable time to low level tPZL 3.5 µs RL = 110Ω See Figure 3 6
Driver output disable time from high level tPHZ 2 µs RL = 110Ω See Figure 2 6
Driver output disable time from low level tPLZ 2 µs RL = 110Ω See Figure 3 6
Receiver supply current (total package) ICC 3.9 mA DE = RE = 0 V, No Load 7
Receiver supply current, disabled ICC 300 µA RE = 5 V, No Load, DE = 0 V, No Load 7
Input current II 250 µA Other input = 0 V, VI = 12 V 7
Input current II -200 µA Other input = 0 V, VI = −7V 7
High-impedance-state output current IOZ -100 100 µA VO = 0.4 V to 2.4 V 7
Input hysteresis voltage Vhys 70 mV 7
Positive-going input threshold voltage VIT+ 200 mV 7
Negative-going input threshold voltage VIT− -200 mV 7
High-level output voltage VOH 2.8 V IOH = − 8 mA Figure 7 7
Low-level output voltage VOL 0.4 V IOL = 4 mA Figure 7 7
Receiver propagation delay, low-to-high tPLH 150 ns CL = 50 pF, See Figure 7 7
Receiver propagation delay, high-to-low tPHL 150 ns CL = 50 pF, See Figure 7 7
Receiver pulse skew tsk(p) 50 ns CL = 50 pF, See Figure 7 7
Receiver rise time, single ended tr 20 ns See Figure 7 7
Receiver fall time, single ended tf 20 ns See Figure 7 7
Receiver output enable time to high level tPZH 100 ns See Figure 8 7
Receiver output enable time to low level tPZL 100 ns See Figure 8 7

CAD (KiCad official)

  • Symbol: SN75LBC184M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: sn75lbc184m-etched.step / sn75lbc184m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn75lbc184m.step / sn75lbc184m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (18 pp, sha256 9096a171de5a8521, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF