component
SN75LBC184-TD
Public Made by Adomby adom
TDSEMIC RS-485 / RS-422 ICs, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
SN75LBC184-TD
TDSEMIC · RS-485 / RS-422 ICs · DIP-8
SN75LBC184-TD from TDSEMIC, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output, high when A is at least 200 mV above B and low when A is 200 mV below B, and high-impedance when RE is high. |
| 2 | RE | input | Active-low receiver enable; when RE is high the receiver output is high-impedance. |
| 3 | DE | input | Active-high driver enable; when DE is low the driver outputs are high-impedance, and when DE is high the chip is in transmit state. |
| 4 | DI | input | Driver data input; DI low gives A high and B low, DI high gives the opposite. |
| 5 | GND | power_in | Ground, power supply negative terminal. |
| 6 | A | bidirectional | Non-inverting receiver input and non-inverting driver output (the datasheet describes A as the positive receiver input and positive driver output). |
| 7 | B | bidirectional | Inverting receiver input and inverting driver output. |
| 8 | VCC | power_in | Positive power supply terminal; absolute maximum +5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TDSEMIC |
| Package | DIP-8 |
| Category | Interface |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
SN75LBC184-TD - Footprint:
Package_DIP:DIP-8_W7.62mm - 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files:
sn75lbc184-td-etched.step/sn75lbc184-td-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sn75lbc184-td.step/sn75lbc184-td.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TDSEMIC datasheet (11 pp, sha256
d283adb0948b33a5, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SN75LBC184-TD
**TDSEMIC** · RS-485 / RS-422 ICs · DIP-8
SN75LBC184-TD from TDSEMIC, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output, high when A is at least 200 mV above B and low when A is 200 mV below B, and high-impedance when RE is high. |
| 2 | RE | input | Active-low receiver enable; when RE is high the receiver output is high-impedance. |
| 3 | DE | input | Active-high driver enable; when DE is low the driver outputs are high-impedance, and when DE is high the chip is in transmit state. |
| 4 | DI | input | Driver data input; DI low gives A high and B low, DI high gives the opposite. |
| 5 | GND | power_in | Ground, power supply negative terminal. |
| 6 | A | bidirectional | Non-inverting receiver input and non-inverting driver output (the datasheet describes A as the positive receiver input and positive driver output). |
| 7 | B | bidirectional | Inverting receiver input and inverting driver output. |
| 8 | VCC | power_in | Positive power supply terminal; absolute maximum +5 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TDSEMIC |
| Package | DIP-8 |
| Category | Interface |
| Pins | 8 |
## CAD (KiCad official)
- Symbol: `SN75LBC184-TD`
- Footprint: `Package_DIP:DIP-8_W7.62mm`
- 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files: `sn75lbc184-td-etched.step` / `sn75lbc184-td-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sn75lbc184-td.step` / `sn75lbc184-td.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TDSEMIC datasheet](docs/sn75lbc184-td-datasheet.pdf) (11 pp, sha256 `d283adb0948b33a5`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/sn75lbc184-td-datasheet.pdf)