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Contents

README

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SN75158DR

Texas Instruments · RS-485/RS-422 ICs · SOIC-8

SN75158DR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1Z output Inverting output of the differential driver on channel 1.
2 1Y output Non-inverting output of the differential driver on channel 1.
3 1A input Single-ended data input for channel 1.
4 GND power_in Device ground.
5 2A input Single-ended data input for channel 2.
6 2Y output Non-inverting output of the differential driver on channel 2.
7 2Z output Inverting output of the differential driver on channel 2.
8 VCC power_in 5V power supply positive terminal connection, with a recommended supply range of 4.75 V to 5.25 V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 4.75 5 5.25 V 4
High-level input voltage VIH 2 V 4
Low-level input voltage VIL 0.8 V 4
High-level output current IOH -40 mA 4
Low-level output current IOL 40 mA 4
Operating free-air temperature TA 0 70 °C 4
Supply voltage VCC 7 V 4
Input voltage range VI 5.5 V 4
Operating free-air temperature range TJ 0 70 °C 4
Storage temperature range Tstg -65 150 °C 4
Lead temperature 260 °C 1,6 mm (1/16 inch) from case for 10 s 4
Junction-to-ambient thermal resistance (D package) RθJA 116.7 °C/W D package, 8-pins 4
Junction-to-case (top) thermal resistance (D package) RθJC(top) 56.3 °C/W D package, 8-pins 4
Junction-to-board thermal resistance (D package) RθJB 63.4 °C/W D package, 8-pins 4
Junction-to-top characterization parameter (D package) ψJT 8.8 °C/W D package, 8-pins 4
Junction-to-board characterization parameter (D package) ψJB 62.6 °C/W D package, 8-pins 4
Differential output voltage /VOD1/ 3.5 V VCC = MAX, IO = 0 5
Differential output voltage /VOD2/ 3 V VCC = MIN, RL = 100Ω, See Figure 6-1 5
Change in magnitude of differential output voltage ΔVOD -0.4 0.02 0.4 V VCC = MIN, RL = 100Ω, See Figure 6-1 5
Common-mode output voltage VOC 1.8 3 V VCC = MAX, RL = 100Ω, See Figure 6-1 5
Common-mode output voltage VOC 1.5 3 V VCC = MIN, RL = 100Ω, See Figure 6-1 5
Change in magnitude of common-mode output voltage ΔVOC -0.4 0.02 0.4 V VCC = MIN or MAX, RL = 100Ω, See Figure 6-1 5
Output current with power off IO 0.1 100 μA VCC = 0, VO = 6V 5
Output current with power off IO -0.1 -100 μA VCC = 0, VO = -0.25V 5
Output current with power off IO -100 100 μA VCC = 0, VO = -0.25 to 6V 5
Input current at maximum input voltage II 1 mA VCC = MAX, VI = 5.5V 5
High-level input current IIH 40 μA VCC = MAX, VI = 2.4V 5
Low-level input current IIL -1 -1.6 mA VCC = MAX, VI = 0.4V 5
Short-circuit output current IOS -40 -90 -150 mA VCC = MAX 5
Supply current (both drivers) ICC 37 50 mA VCC = MAX, TA = 25°C, Inputs grounded, No load 5
Input clamp voltage VIK -0.9 -1.5 V VCC = MIN, II = -12mA 5
High-level output voltage VOH 2.4 3 V VCC = MIN, VIH = 2V, VIL = 0.8V, IOH = -40mA 5
Low-level output voltage VOL 0.2 0.4 V VCC = MIN, VIH = 2V, VIL = 0.8V, IOH = 40mA 5
Propagation delay time, low- to high-level output tPLH 16 25 ns VCC = 5V, TA = 25°C, Termination A, See Figure 6-2 5
Propagation delay time, low- to high-level output tPLH 13 20 ns VCC = 5V, TA = 25°C, Termination B, See Figure 6-2 5
Propagation delay time, high- to low-level output tPHL 10 20 ns VCC = 5V, TA = 25°C, Termination A, See Figure 6-2 5
Propagation delay time, high- to low-level output tPHL 9 15 ns VCC = 5V, TA = 25°C, Termination B, See Figure 6-2 5
Transition time, low-to-high-level output tTLH 4 20 ns VCC = 5V, TA = 25°C, Termination A, See Figure 6-2 5
Transition time, high- to low-level output tTHL 4 20 ns VCC = 5V, TA = 25°C, Termination A, See Figure 6-2 5
Overshoot factor 10 % VCC = 5V, TA = 25°C, See Figure 6-2, Termination C 5

CAD (KiCad official)

  • Symbol: SN75158DR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: sn75158dr-etched.step / sn75158dr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn75158dr.step / sn75158dr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (22 pp, sha256 5f28db5fffebb500, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF