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SN74HCS157DR

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TI Global Sourcing Parts, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SN74HCS157DR

TI · Global Sourcing Parts · SOIC-16

SN74HCS157DR from TI, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A/B input Address select for all four channels: a low level selects data input A and a high level selects data input B (function table).
2 1A input Channel 1 data input A, selected onto 1Y when A/B is low and G is low.
3 1B input Channel 1 data input B, selected onto 1Y when A/B is high and G is low.
4 1Y output Channel 1 multiplexer output; forced low when the strobe G is high.
5 2A input Channel 2 data input A, selected onto 2Y when A/B is low and G is low.
6 2B input Channel 2 data input B, selected onto 2Y when A/B is high and G is low.
7 2Y output Channel 2 multiplexer output; forced low when the strobe G is high.
8 GND power_in Ground reference for the device.
9 3Y output Channel 3 multiplexer output; forced low when the strobe G is high.
10 3B input Channel 3 data input B, selected onto 3Y when A/B is high and G is low.
11 3A input Channel 3 data input A, selected onto 3Y when A/B is low and G is low.
12 4Y output Channel 4 multiplexer output; forced low when the strobe G is high.
13 4B input Channel 4 data input B, selected onto 4Y when A/B is high and G is low.
14 4A input Channel 4 data input A, selected onto 4Y when A/B is low and G is low.
15 G input Output strobe, active low; a high level forces all Y outputs low regardless of other inputs.
16 VCC power_in Positive supply; recommended operating range is 2 V to 6 V (VCC must stay within the recommended range, with absolute maximum 7 V).

Key specifications

Parameter Value
Manufacturer TI
Package SOIC-16
Category Global Sourcing Parts
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.5 7 V 4
Input clamp current IIK -20 20 mA VI < -0.5 V or VI > VCC + 0.5 V 4
Output clamp current IOK -20 20 mA VI < -0.5 V or VI > VCC + 0.5 V 4
Continuous output current IO -35 35 mA VO = 0 to VCC 4
Continuous current through VCC or GND -70 70 mA 4
Junction temperature TJ 150 °C 4
Storage temperature Tstg -65 150 °C 4
Supply voltage VCC 2 5 6 V 4
Input voltage VI 0 V 4
Output voltage VO 0 V 4
Ambient temperature TA -40 125 °C 4
Positive switching threshold VT+ 0.7 1.5 V VCC = 2 V 5
Positive switching threshold VT+ 1.7 3.15 V VCC = 4.5 V 5
Positive switching threshold VT+ 2.1 4.2 V VCC = 6 V 5
Negative switching threshold VT- 0.3 1 V VCC = 2 V 5
Negative switching threshold VT- 0.9 2.2 V VCC = 4.5 V 5
Negative switching threshold VT- 1.2 3 V VCC = 6 V 5
Hysteresis (VT+ - VT-) ΔVT 0.2 1 V VCC = 2 V 5
Hysteresis (VT+ - VT-) ΔVT 0.4 1.4 V VCC = 4.5 V 5
Hysteresis (VT+ - VT-) ΔVT 0.6 1.6 V VCC = 6 V 5
High-level output voltage VOH 4 4.3 V VI = VIH or VIL; IOH = -6 mA; VCC = 4.5 V 5
High-level output voltage VOH 5.4 5.75 V VI = VIH or VIL; IOH = -7.8 mA; VCC = 6 V 5
Low-level output voltage VOL 0.002 0.1 V VI = VIH or VIL; IOL = 20 µA; VCC 2 V to 6 V 5
Low-level output voltage VOL 0.18 0.3 V VI = VIH or VIL; IOL = 6 mA; VCC = 4.5 V 5
Low-level output voltage VOL 0.22 0.33 V VI = VIH or VIL; IOL = 7.8 mA; VCC = 6 V 5
Input leakage current II -1000 100 1000 nA VI = VCC or 0; VCC = 6 V 5
Supply current ICC 0.1 2 µA VI = VCC or 0, IO = 0; VCC = 6 V 5
Max switching frequency fmax 5 6 MHz CL = 50 pF; VCC = 2 V; typ at 25°C, min at -40°C to 125°C 5
Max switching frequency fmax 25 31 MHz CL = 50 pF; VCC = 4.5 V; typ at 25°C, min at -40°C to 125°C 5
Max switching frequency fmax 29 36 MHz CL = 50 pF; VCC = 6 V; typ at 25°C, min at -40°C to 125°C 5
Propagation delay A or B to Y tpd 21 32 ns CL = 50 pF; VCC = 2 V; TA = 25°C 5
Propagation delay A or B to Y tpd 55 ns CL = 50 pF; VCC = 2 V; TA = -40°C to 125°C 5
Propagation delay A or B to Y tpd 8 12 ns CL = 50 pF; VCC = 4.5 V; TA = 25°C 5
Propagation delay A or B to Y tpd 19 ns CL = 50 pF; VCC = 4.5 V; TA = -40°C to 125°C 5
Propagation delay A or B to Y tpd 7 11 ns CL = 50 pF; VCC = 6 V; TA = 25°C 5
Propagation delay A or B to Y tpd 16 ns CL = 50 pF; VCC = 6 V; TA = -40°C to 125°C 5
Propagation delay A/B to Y tpd 21 32 ns CL = 50 pF; VCC = 2 V; TA = 25°C 5
Propagation delay A/B to Y tpd 57 ns CL = 50 pF; VCC = 2 V; TA = -40°C to 125°C 5
Propagation delay A/B to Y tpd 8 12 ns CL = 50 pF; VCC = 4.5 V; TA = 25°C 5
Propagation delay A/B to Y tpd 20 ns CL = 50 pF; VCC = 4.5 V; TA = -40°C to 125°C 5
Propagation delay A/B to Y tpd 7 11 ns CL = 50 pF; VCC = 6 V; TA = 25°C 5
Propagation delay A/B to Y tpd 16 ns CL = 50 pF; VCC = 6 V; TA = -40°C to 125°C 5
Propagation delay G to Y tpd 22 33 ns CL = 50 pF; VCC = 2 V; TA = 25°C 5
Propagation delay G to Y tpd 53 ns CL = 50 pF; VCC = 2 V; TA = -40°C to 125°C 5
Propagation delay G to Y tpd 9 14 ns CL = 50 pF; VCC = 4.5 V; TA = 25°C 5
Propagation delay G to Y tpd 18 ns CL = 50 pF; VCC = 4.5 V; TA = -40°C to 125°C 5
Propagation delay G to Y tpd 8 12 ns CL = 50 pF; VCC = 6 V; TA = 25°C 5
Propagation delay G to Y tpd 15 ns CL = 50 pF; VCC = 6 V; TA = -40°C to 125°C 5
Transition time, any output tt 13 21 ns CL = 50 pF; VCC = 2 V; typ at 25°C, max at -40°C to 125°C 5
Transition time, any output tt 6 9 ns CL = 50 pF; VCC = 4.5 V; typ at 25°C, max at -40°C to 125°C 5
Transition time, any output tt 5 7 ns CL = 50 pF; VCC = 6 V; typ at 25°C, max at -40°C to 125°C 5
Junction-to-ambient thermal resistance (D, SOIC) RθJA 122.2 °C/W SOIC (D) 16-pin package 4
Junction-to-case (top) thermal resistance (D, SOIC) RθJC(top) 80.9 °C/W SOIC (D) 16-pin package 4
Junction-to-board thermal resistance (D, SOIC) RθJB 80.6 °C/W SOIC (D) 16-pin package 4
Junction-to-top characterization parameter (D, SOIC) ΨJT 40.4 °C/W SOIC (D) 16-pin package 4
Junction-to-board characterization parameter (D, SOIC) ΨJB 80.3 °C/W SOIC (D) 16-pin package 4

CAD (KiCad official)

  • Symbol: SN74HCS157DR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: sn74hcs157dr-etched.step / sn74hcs157dr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74hcs157dr.step / sn74hcs157dr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TI datasheet (25 pp, sha256 2163a572761a2f95, retrieved 2026-10-18, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF