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SN74HCS10QDRQ1

Texas Instruments · Logic Gates · SOIC-14

SN74HCS10QDRQ1 from Texas Instruments, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1A input Channel 1 input A of the three-input NAND gate, a CMOS Schmitt-trigger input.
2 1B input Channel 1 input B of the three-input NAND gate, a CMOS Schmitt-trigger input.
3 2A input Channel 2 input A of the three-input NAND gate, a CMOS Schmitt-trigger input.
4 2B input Channel 2 input B of the three-input NAND gate, a CMOS Schmitt-trigger input.
5 2C input Channel 2 input C of the three-input NAND gate, a CMOS Schmitt-trigger input.
6 2Y output Channel 2 NAND gate output Y, a balanced CMOS push-pull output.
7 GND power_in Ground reference for the device.
8 3Y output Channel 3 NAND gate output Y, a balanced CMOS push-pull output.
9 3A input Channel 3 input A of the three-input NAND gate, a CMOS Schmitt-trigger input.
10 3B input Channel 3 input B of the three-input NAND gate, a CMOS Schmitt-trigger input.
11 3C input Channel 3 input C of the three-input NAND gate, a CMOS Schmitt-trigger input.
12 1Y output Channel 1 NAND gate output Y, a balanced CMOS push-pull output.
13 1C input Channel 1 input C of the three-input NAND gate, a CMOS Schmitt-trigger input.
14 VCC power_in Positive supply; the recommended operating supply range is 2 V to 6 V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-14
Category Logic
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.5 7 V 3
Input clamp current IIK -20 20 mA VI < -0.5 V or VI > VCC + 0.5 V 3
Output clamp current IOK -20 20 mA VI < -0.5 V or VI > VCC + 0.5 V 3
Continuous output current IO -35 35 mA VO = 0 to VCC 3
Continuous current through VCC or GND -70 70 mA 3
Junction temperature TJ 150 °C 3
Storage temperature Tstg -65 150 °C 3
Supply voltage VCC 2 5 6 V 4
Input voltage VI 0 V 4
Output voltage VO 0 V 4
Ambient temperature TA -40 125 °C 4
Positive switching threshold VT+ 0.7 1.5 V VCC = 2 V 4
Positive switching threshold VT+ 1.7 3.15 V VCC = 4.5 V 4
Positive switching threshold VT+ 2.1 4.2 V VCC = 6 V 4
Negative switching threshold VT- 0.3 1 V VCC = 2 V 4
Negative switching threshold VT- 0.9 2.2 V VCC = 4.5 V 4
Negative switching threshold VT- 1.2 3 V VCC = 6 V 4
Hysteresis (VT+ - VT-) ΔVT 0.2 1 V VCC = 2 V 4
Hysteresis (VT+ - VT-) ΔVT 0.4 1.4 V VCC = 4.5 V 4
Hysteresis (VT+ - VT-) ΔVT 0.6 1.6 V VCC = 6 V 4
High-level output voltage VOH 4 4.3 V VI = VIH or VIL; IOH = -6 mA; VCC = 4.5 V 4
High-level output voltage VOH 5.4 5.75 V VI = VIH or VIL; IOH = -7.8 mA; VCC = 6 V 4
Low-level output voltage VOL 0.002 0.1 V VI = VIH or VIL; IOL = 20 µA; VCC = 2 V to 6 V 4
Low-level output voltage VOL 0.18 0.3 V VI = VIH or VIL; IOL = 6 mA; VCC = 4.5 V 4
Low-level output voltage VOL 0.22 0.33 V VI = VIH or VIL; IOL = 7.8 mA; VCC = 6 V 4
Input leakage current II -1000 100 1000 nA VI = VCC or 0; VCC = 6 V 4
Supply current ICC 0.1 2 µA VI = VCC or 0, IO = 0; VCC = 6 V 4
Propagation delay A or B or C to Y tpd 14 40 ns CL = 50 pF; VCC = 2 V 5
Propagation delay A or B or C to Y tpd 6 17 ns CL = 50 pF; VCC = 4.5 V 5
Propagation delay A or B or C to Y tpd 5 16 ns CL = 50 pF; VCC = 6 V 5
Transition time Y tt 9 16 ns CL = 50 pF; VCC = 2 V 5
Transition time Y tt 5 9 ns CL = 50 pF; VCC = 4.5 V 5
Transition time Y tt 4 8 ns CL = 50 pF; VCC = 6 V 5
Junction-to-ambient thermal resistance (D, SOIC-14) RθJA 133.6 °C/W D (SOIC) 14 pins 4
Junction-to-case (top) thermal resistance (D, SOIC-14) RθJC(top) 89 °C/W D (SOIC) 14 pins 4
Junction-to-board thermal resistance (D, SOIC-14) RθJB 89.5 °C/W D (SOIC) 14 pins 4
Junction-to-top characterization parameter (D, SOIC-14) ΨJT 45.5 °C/W D (SOIC) 14 pins 4
Junction-to-board characterization parameter (D, SOIC-14) ΨJB 89.1 °C/W D (SOIC) 14 pins 4

CAD (KiCad official)

  • Symbol: SN74HCS10QDRQ1
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: sn74hcs10qdrq1-etched.step / sn74hcs10qdrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74hcs10qdrq1.step / sn74hcs10qdrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (22 pp, sha256 705cac84369e848a, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF