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Contents

README

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SN74HC374DWR

Texas Instruments · Flip Flops · SOIC-20-300mil

SN74HC374DWR from Texas Instruments, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE input Active-low three-state output enable common to all eight Q outputs; when HIGH all outputs enter high-impedance state; when LOW outputs reflect stored flip-flop data; VI = 0 to VCC.
2 1Q tri_state Three-state data output of flip-flop 1; updated on rising edge of CLK when OE is LOW; VOH min 4.4 V / VOL max 0.1 V at VCC = 4.5 V with IOH/IOL = ±6 mA; high-impedance when OE is HIGH.
3 1D input Data input to flip-flop 1; logic level present at this pin is captured on the positive transition of CLK; setup time tsu = 25 ns min at VCC = 4.5 V.
4 2D input Data input to flip-flop 2; logic level present at this pin is captured on the positive transition of CLK; setup time tsu = 25 ns min at VCC = 4.5 V.
5 2Q tri_state Three-state data output of flip-flop 2; updated on rising edge of CLK when OE is LOW; VOH min 4.4 V / VOL max 0.1 V at VCC = 4.5 V with IOH/IOL = ±6 mA; high-impedance when OE is HIGH.
6 3Q tri_state Three-state data output of flip-flop 3; updated on rising edge of CLK when OE is LOW; VOH min 4.4 V / VOL max 0.1 V at VCC = 4.5 V with IOH/IOL = ±6 mA; high-impedance when OE is HIGH.
7 3D input Data input to flip-flop 3; logic level present at this pin is captured on the positive transition of CLK; setup time tsu = 25 ns min at VCC = 4.5 V.
8 4D input Data input to flip-flop 4; logic level present at this pin is captured on the positive transition of CLK; setup time tsu = 25 ns min at VCC = 4.5 V.
9 4Q tri_state Three-state data output of flip-flop 4; updated on rising edge of CLK when OE is LOW; VOH min 4.4 V / VOL max 0.1 V at VCC = 4.5 V with IOH/IOL = ±6 mA; high-impedance when OE is HIGH.
10 GND power_in Ground reference (0 V); continuous current through GND pin not to exceed ±70 mA.
11 CLK input Positive-edge clock common to all eight flip-flops; Q outputs update on the LOW-to-HIGH transition; fclock max 24 MHz at VCC = 4.5 V; pulse-width tw min 20 ns at VCC = 4.5 V.
12 5Q tri_state Three-state data output of flip-flop 5; updated on rising edge of CLK when OE is LOW; VOH min 4.4 V / VOL max 0.1 V at VCC = 4.5 V with IOH/IOL = ±6 mA; high-impedance when OE is HIGH.
13 5D input Data input to flip-flop 5; logic level present at this pin is captured on the positive transition of CLK; setup time tsu = 25 ns min at VCC = 4.5 V.
14 6D input Data input to flip-flop 6; logic level present at this pin is captured on the positive transition of CLK; setup time tsu = 25 ns min at VCC = 4.5 V.
15 6Q tri_state Three-state data output of flip-flop 6; updated on rising edge of CLK when OE is LOW; VOH min 4.4 V / VOL max 0.1 V at VCC = 4.5 V with IOH/IOL = ±6 mA; high-impedance when OE is HIGH.
16 7Q tri_state Three-state data output of flip-flop 7; updated on rising edge of CLK when OE is LOW; VOH min 4.4 V / VOL max 0.1 V at VCC = 4.5 V with IOH/IOL = ±6 mA; high-impedance when OE is HIGH.
17 7D input Data input to flip-flop 7; logic level present at this pin is captured on the positive transition of CLK; setup time tsu = 25 ns min at VCC = 4.5 V.
18 8D input Data input to flip-flop 8; logic level present at this pin is captured on the positive transition of CLK; setup time tsu = 25 ns min at VCC = 4.5 V.
19 8Q tri_state Three-state data output of flip-flop 8; updated on rising edge of CLK when OE is LOW; VOH min 4.4 V / VOL max 0.1 V at VCC = 4.5 V with IOH/IOL = ±6 mA; high-impedance when OE is HIGH.
20 VCC power_in Positive supply voltage; recommended operating range 2 V to 6 V; ICC max 80 µA at VCC = 6 V, IO = 0; bypass with 0.1 µF capacitor as close to pin as possible.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-20-300mil
Category Logic
Pins 20

CAD (KiCad official)

  • Symbol: SN74HC374DWR
  • Footprint: Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm
  • 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
  • 3D model files: sn74hc374dwr-etched.step / sn74hc374dwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74hc374dwr.step / sn74hc374dwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 e72f5f2d1a24107d, retrieved 2026-09-27, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-sonnet-4-6 (text+vision), consensus claude-opus-4-7 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF