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SN74HC373D

lingxingic · Latches · SOP-20-300mil

SN74HC373D from lingxingic, in a SOP-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE input Three-state output enable input, active low; a high level puts the Q outputs in high impedance and does not affect the latch state.
2 Q0 tri_state Three-state latch output 0; high impedance when OE is high.
3 D0 input Data input 0; transparent to the output while LE is high and latched on the LE falling edge.
4 D1 input Data input 1; transparent to the output while LE is high and latched on the LE falling edge.
5 Q1 tri_state Three-state latch output 1; high impedance when OE is high.
6 Q2 tri_state Three-state latch output 2; high impedance when OE is high.
7 D2 input Data input 2; transparent to the output while LE is high and latched on the LE falling edge.
8 D3 input Data input 3; transparent to the output while LE is high and latched on the LE falling edge.
9 Q3 tri_state Three-state latch output 3; high impedance when OE is high.
10 GND power_in Ground (0 V).
11 LE input Latch enable input, active high; when high data passes through the latch, and when low the latch holds the data present before the LE falling edge.
12 Q4 tri_state Three-state latch output 4; high impedance when OE is high.
13 D4 input Data input 4; transparent to the output while LE is high and latched on the LE falling edge.
14 D5 input Data input 5; transparent to the output while LE is high and latched on the LE falling edge.
15 Q5 tri_state Three-state latch output 5; high impedance when OE is high.
16 Q6 tri_state Three-state latch output 6; high impedance when OE is high.
17 D6 input Data input 6; transparent to the output while LE is high and latched on the LE falling edge.
18 D7 input Data input 7; transparent to the output while LE is high and latched on the LE falling edge.
19 Q7 tri_state Three-state latch output 7; high impedance when OE is high.
20 VCC power_in Supply voltage: 2.0 V to 6.0 V for SN74HC373 and 4.5 V to 5.5 V for SN74HCT373.

Key specifications

Parameter Value
Manufacturer lingxingic
Package SOP-20-300mil
Category Logic
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
电源电压 (Supply voltage) VCC -0.5 7 V 7
输入钳位电流 (Input clamp current) IIK -20 20 mA VI<-0.5V 或 VI>VCC+0.5V 7
输出钳位电流 (Output clamp current) IOK -20 20 mA VO<-0.5V 或 VO>VCC+0.5V 7
输出电流 (Output current) IO -35 35 mA VO=-0.5V~(VCC+0.5V) 7
电源电流 (Supply current) ICC 70 mA 7
地电流 (Ground current) IGND -70 mA 7
贮存温度 (Storage temperature) Tstg -65 150 ℃ 7
总功耗 (Total power dissipation) Ptot 500 mW 7
焊接温度 (Soldering temperature) TL 260 ℃ 10 秒;SOP/TSSOP/SOP(M) 7
电源电压 (Supply voltage, HC) VCC 2 5 6 V SN74HC373 7
输入电压 (Input voltage) VI 0 V SN74HC373; 最大值印刷为 VCC 7
输出电压 (Output voltage) VO 0 V SN74HC373; 最大值印刷为 VCC 7
输入上升和下降转换速率 (Input rise and fall rate) Δt/ΔV 625 ns/V VCC=2.0V 7
输入上升和下降转换速率 (Input rise and fall rate) Δt/ΔV 1.67 139 ns/V VCC=4.5V 7
输入上升和下降转换速率 (Input rise and fall rate) Δt/ΔV 83 ns/V VCC=6.0V 7
工作环境温度 (Operating ambient temperature) Tamb -40 125 ℃ 7
高电平输入电压 (High-level input voltage) VIH 1.5 1.2 V VCC=2.0V 8
高电平输入电压 (High-level input voltage) VIH 3.15 2.4 V VCC=4.5V 8
高电平输入电压 (High-level input voltage) VIH 4.2 3.2 V VCC=6.0V 8
低电平输入电压 (Low-level input voltage) VIL 0.8 0.5 V VCC=2.0V 8
低电平输入电压 (Low-level input voltage) VIL 2.1 1.35 V VCC=4.5V 8
低电平输入电压 (Low-level input voltage) VIL 2.8 1.8 V VCC=6.0V 8
高电平输出电压 (High-level output voltage) VOH 1.9 2 V VI=VIH或VIL;IO=-20uA;VCC=2.0V 8
高电平输出电压 (High-level output voltage) VOH 4.4 4.5 V VI=VIH或VIL;IO=-20uA;VCC=4.5V 8
高电平输出电压 (High-level output voltage) VOH 5.9 6 V VI=VIH或VIL;IO=-20uA;VCC=6.0V 8
高电平输出电压 (High-level output voltage) VOH 3.98 4.32 V VI=VIH或VIL;IO=-6.0mA;VCC=4.5V 8
高电平输出电压 (High-level output voltage) VOH 5.48 5.81 V VI=VIH或VIL;IO=-7.8mA;VCC=6.0V 8
低电平输出电压 (Low-level output voltage) VOL 0 0.1 V VI=VIH或VIL;IO=20uA;VCC=2.0V 8
低电平输出电压 (Low-level output voltage) VOL 0.15 0.26 V VI=VIH或VIL;IO=6.0mA;VCC=4.5V 8
低电平输出电压 (Low-level output voltage) VOL 0.16 0.26 V VI=VIH或VIL;IO=7.8mA;VCC=6.0V 8
输入漏电流 (Input leakage current) II -1 1 uA VI=VCC或GND;VCC=6.0V 8
截止状态输出电流 (Off-state output current) IOZ -1 1 uA VI=VIH或VIL;VCC=6.0V;VO=VCC or GND 8
静态电流 (Quiescent supply current) ICC 8 uA VI=VCC或GND;IO=0A;VCC=6.0V 8
传输延时 Dn到Qn (Propagation delay) tpd 41 150 ns Dn到Qn;见图7;VCC=2.0V;CL=50pF 11
传输延时 Dn到Qn (Propagation delay) tpd 15 30 ns Dn到Qn;见图7;VCC=4.5V;CL=50pF 11
传输延时 Dn到Qn (Propagation delay) tpd 12 26 ns Dn到Qn;见图7;VCC=6.0V;CL=50pF 11
传输延时 LE到Qn (Propagation delay) tpd 50 175 ns LE到Qn;见图8;VCC=2.0V;CL=50pF 11
传输延时 LE到Qn (Propagation delay) tpd 18 35 ns LE到Qn;见图8;VCC=4.5V;CL=50pF 11
传输延时 LE到Qn (Propagation delay) tpd 14 30 ns LE到Qn;见图8;VCC=6.0V;CL=50pF 11
使能时间 OE到Qn (Output enable time) ten 44 150 ns 见图9;VCC=2.0V;CL=50pF 11
使能时间 OE到Qn (Output enable time) ten 16 30 ns 见图9;VCC=4.5V;CL=50pF 11
使能时间 OE到Qn (Output enable time) ten 13 26 ns 见图9;VCC=6.0V;CL=50pF 11
失能时间 OE到Qn (Output disable time) tdis 47 150 ns 见图9;VCC=2.0V;CL=50pF 11
失能时间 OE到Qn (Output disable time) tdis 17 30 ns 见图9;VCC=4.5V;CL=50pF 11
失能时间 OE到Qn (Output disable time) tdis 14 26 ns 见图9;VCC=6.0V;CL=50pF 11
转换时间 (Output transition time) tt 14 60 ns Qn;见图7,8;VCC=2.0V;CL=50pF 11
转换时间 (Output transition time) tt 5 12 ns Qn;见图7,8;VCC=4.5V;CL=50pF 11
转换时间 (Output transition time) tt 4 10 ns Qn;见图7,8;VCC=6.0V;CL=50pF 11
脉冲宽度 LE高电平 (Pulse width) tW 80 17 ns LE为高电平;见图8;VCC=2.0V;CL=50pF 11
脉冲宽度 LE高电平 (Pulse width) tW 16 6 ns LE为高电平;见图8;VCC=4.5V;CL=50pF 11
脉冲宽度 LE高电平 (Pulse width) tW 14 5 ns LE为高电平;见图8;VCC=6.0V;CL=50pF 11
建立时间 Dn到LE (Setup time) tsu 50 14 ns Dn到LE;见图10;VCC=2.0V;CL=50pF 11
建立时间 Dn到LE (Setup time) tsu 10 5 ns Dn到LE;见图10;VCC=4.5V;CL=50pF 11
建立时间 Dn到LE (Setup time) tsu 9 4 ns Dn到LE;见图10;VCC=6.0V;CL=50pF 11
保持时间 Dn到LE (Hold time) th 5 -8 ns Dn到LE;见图10;VCC=2.0V;CL=50pF 11
保持时间 Dn到LE (Hold time) th 5 -3 ns Dn到LE;见图10;VCC=4.5V;CL=50pF 11
保持时间 Dn到LE (Hold time) th 5 -2 ns Dn到LE;见图10;VCC=6.0V;CL=50pF 11

CAD (KiCad official)

  • Symbol: SN74HC373D
  • Footprint: Package_SO:SOP-20_7.5x12.8mm_P1.27mm
  • 3D model: SOP-20-300mil, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: sn74hc373d-etched.step / sn74hc373d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74hc373d.step / sn74hc373d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: lingxingic datasheet (22 pp, sha256 0f3c8499ba7a7a92, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF