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SN74HC107N

lingxingic · Flip Flops · DIP-14

SN74HC107N from lingxingic, in a DIP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1J input Synchronous J input of flip-flop 1, sampled on the HIGH-to-LOW clock transition.
2 1Q output Complement output of flip-flop 1, as listed in the pin description table (overbar lost in text extraction).
3 1Q output True output of flip-flop 1, as listed in the pin description table.
4 1K input Synchronous K input of flip-flop 1, sampled on the HIGH-to-LOW clock transition.
5 2Q output True output of flip-flop 2, as listed in the pin description table.
6 2Q output Complement output of flip-flop 2, as listed in the pin description table (overbar lost in text extraction).
7 GND power_in Ground reference (0V) for the device.
8 2J input Synchronous J input of flip-flop 2, sampled on the HIGH-to-LOW clock transition.
9 2CP input Clock input of flip-flop 2, triggered on a HIGH-to-LOW edge.
10 2R input Asynchronous reset input of flip-flop 2, active LOW.
11 2K input Synchronous K input of flip-flop 2, sampled on the HIGH-to-LOW clock transition.
12 1CP input Clock input of flip-flop 1, triggered on a HIGH-to-LOW edge.
13 1R input Asynchronous reset input of flip-flop 1, active LOW.
14 VCC power_in Supply voltage pin; recommended VCC is 2.0V to 6.0V for SN74HC107 and 4.5V to 5.5V for SN74HCT107.

Key specifications

Parameter Value
Manufacturer lingxingic
Package DIP-14
Category Logic
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
supply voltage VCC -0.5 7 V voltages referenced to GND 6
supply current ICC 50 mA - 6
ground current IGND -50 mA - 6
input clamping current IIK -20 20 mA VI < -0.5V or VI > VCC+0.5V 6
output clamping current IOK -20 20 mA VO < -0.5V or VO > VCC+0.5V 6
output current IO -25 25 mA -0.5V < VO < VCC+0.5V 6
storage temperature Tstg -65 150 ℃ - 6
soldering temperature TL 245 ℃ 10s, DIP package 6
supply voltage (HC) VCC 2 5 6 V SN74HC107 6
input voltage (HC) VI 0 V SN74HC107; max printed as VCC 6
output voltage (HC) VO 0 V SN74HC107; max printed as VCC 6
ambient temperature Tamb -40 125 ℃ SN74HC107 6
HIGH-level input voltage VIH 1.5 1.2 V VCC=2.0V; Tamb -40 to +85℃ 7
HIGH-level input voltage VIH 3.15 2.4 V VCC=4.5V; Tamb -40 to +85℃ 7
HIGH-level input voltage VIH 4.2 3.2 V VCC=6.0V; Tamb -40 to +85℃ 7
LOW-level input voltage VIL 0.8 0.5 V VCC=2.0V; Tamb -40 to +85℃ 7
LOW-level input voltage VIL 2.1 1.35 V VCC=4.5V; Tamb -40 to +85℃ 7
LOW-level input voltage VIL 2.8 1.8 V VCC=6.0V; Tamb -40 to +85℃ 7
HIGH-level output voltage VOH 1.9 2 V VCC=2.0V; IO=-20uA; Tamb -40 to +85℃ 7
HIGH-level output voltage VOH 4.4 4.5 V VCC=4.5V; IO=-20uA; Tamb -40 to +85℃ 7
HIGH-level output voltage VOH 5.9 6 V VCC=6.0V; IO=-20uA; Tamb -40 to +85℃ 7
HIGH-level output voltage VOH 3.84 4.32 V VCC=4.5V; IO=-4.0mA; Tamb -40 to +85℃ 7
HIGH-level output voltage VOH 5.34 5.81 V VCC=6.0V; IO=-5.2mA; Tamb -40 to +85℃ 7
LOW-level output voltage VOL 0 0.1 V VCC=2.0V; IO=20uA; Tamb -40 to +85℃ 7
LOW-level output voltage VOL 0 0.1 V VCC=4.5V; IO=20uA; Tamb -40 to +85℃ 7
LOW-level output voltage VOL 0 0.1 V VCC=6.0V; IO=20uA; Tamb -40 to +85℃ 7
LOW-level output voltage VOL 0.15 0.33 V VCC=4.5V; IO=4.0mA; Tamb -40 to +85℃ 7
LOW-level output voltage VOL 0.16 0.33 V VCC=6.0V; IO=5.2mA; Tamb -40 to +85℃ 7
input leakage current II -1 1 uA VCC=6.0V; VI=VCC or GND; Tamb -40 to +85℃ 7
supply current ICC 80 uA VCC=6.0V; VI=VCC or GND; IO=0A; Tamb -40 to +85℃ 7
HIGH-level input voltage VIH 1.5 V VCC=2.0V; Tamb -40 to +125℃ 8
HIGH-level input voltage VIH 3.15 V VCC=4.5V; Tamb -40 to +125℃ 8
HIGH-level input voltage VIH 4.2 V VCC=6.0V; Tamb -40 to +125℃ 8
LOW-level input voltage VIL 0.5 V VCC=2.0V; Tamb -40 to +125℃ 8
LOW-level input voltage VIL 1.35 V VCC=4.5V; Tamb -40 to +125℃ 8
LOW-level input voltage VIL 1.8 V VCC=6.0V; Tamb -40 to +125℃ 8
HIGH-level output voltage VOH 1.9 V VCC=2.0V; IO=-20uA; Tamb -40 to +125℃ 8
HIGH-level output voltage VOH 4.4 V VCC=4.5V; IO=-20uA; Tamb -40 to +125℃ 8
HIGH-level output voltage VOH 5.9 V VCC=6.0V; IO=-20uA; Tamb -40 to +125℃ 8
HIGH-level output voltage VOH 3.7 V VCC=4.5V; IO=-4.0mA; Tamb -40 to +125℃ 8
HIGH-level output voltage VOH 5.2 V VCC=6.0V; IO=-5.2mA; Tamb -40 to +125℃ 8
LOW-level output voltage VOL 0.1 V VCC=2.0V; IO=20uA; Tamb -40 to +125℃ 8
LOW-level output voltage VOL 0.1 V VCC=4.5V; IO=20uA; Tamb -40 to +125℃ 8
LOW-level output voltage VOL 0.1 V VCC=6.0V; IO=20uA; Tamb -40 to +125℃ 8
LOW-level output voltage VOL 0.4 V VCC=4.5V; IO=4.0mA; Tamb -40 to +125℃ 8
LOW-level output voltage VOL 0.4 V VCC=6.0V; IO=5.2mA; Tamb -40 to +125℃ 8
input leakage current II -1 1 uA VCC=6.0V; VI=VCC or GND; Tamb -40 to +125℃ 8
supply current ICC 160 uA VCC=6.0V; VI=VCC or GND; IO=0A; Tamb -40 to +125℃ 8
propagation delay nCP to nQ (tPLH, tPHL) tPLH/tPHL 52 160 ns VCC=2.0V; CL=50pF; Tamb -40 to +85℃ 9
propagation delay nCP to nQ (tPLH, tPHL) tPLH/tPHL 19 32 ns VCC=4.5V; CL=50pF; Tamb -40 to +85℃ 9
propagation delay nCP to nQ (tPLH, tPHL) tPLH/tPHL 15 27 ns VCC=6.0V; CL=50pF; Tamb -40 to +85℃ 9
maximum clock frequency fmax 4.8 30 MHz VCC=2.0V; CL=50pF; Tamb -40 to +85℃ 9
maximum clock frequency fmax 24 91 MHz VCC=4.5V; CL=50pF; Tamb -40 to +85℃ 9
maximum clock frequency fmax 28 108 MHz VCC=6.0V; CL=50pF; Tamb -40 to +85℃ 9
propagation delay nCP to nQ (tPLH, tPHL) tPLH/tPHL 240 ns VCC=2.0V; CL=50pF; Tamb -40 to +125℃ 10
propagation delay nCP to nQ (tPLH, tPHL) tPLH/tPHL 48 ns VCC=4.5V; CL=50pF; Tamb -40 to +125℃ 10
propagation delay nCP to nQ (tPLH, tPHL) tPLH/tPHL 41 ns VCC=6.0V; CL=50pF; Tamb -40 to +125℃ 10
maximum clock frequency fmax 4 MHz VCC=2.0V; CL=50pF; Tamb -40 to +125℃ 11
maximum clock frequency fmax 20 MHz VCC=4.5V; CL=50pF; Tamb -40 to +125℃ 11
maximum clock frequency fmax 24 MHz VCC=6.0V; CL=50pF; Tamb -40 to +125℃ 11

CAD (KiCad official)

  • Symbol: SN74HC107N
  • Footprint: Package_DIP:DIP-14_W7.62mm
  • 3D model: DIP-14 (KiCad packages3D, STEP)
  • 3D model files: sn74hc107n-etched.step / sn74hc107n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74hc107n.step / sn74hc107n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: lingxingic datasheet (18 pp, sha256 99a95eaa77126bd1, retrieved 2026-10-13, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF