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SN74HC01N

lingxingic · Logic Gates · DIP-14

SN74HC01N from lingxingic, in a DIP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1Y output Gate 1 open-drain data output that goes LOW only when 1A and 1B are both HIGH and is high-impedance (Z) otherwise.
2 1A input Gate 1 data input A, one of the two inputs of the 2-input NAND gate.
3 1B input Gate 1 data input B, one of the two inputs of the 2-input NAND gate.
4 2Y output Gate 2 open-drain data output that goes LOW only when 2A and 2B are both HIGH and is high-impedance (Z) otherwise.
5 2A input Gate 2 data input A, one of the two inputs of the 2-input NAND gate.
6 2B input Gate 2 data input B, one of the two inputs of the 2-input NAND gate.
7 GND power_in Ground reference, 0 V.
8 3A input Gate 3 data input A, one of the two inputs of the 2-input NAND gate.
9 3B input Gate 3 data input B, one of the two inputs of the 2-input NAND gate.
10 3Y output Gate 3 open-drain data output that goes LOW only when 3A and 3B are both HIGH and is high-impedance (Z) otherwise.
11 4A input Gate 4 data input A, one of the two inputs of the 2-input NAND gate.
12 4B input Gate 4 data input B, one of the two inputs of the 2-input NAND gate.
13 4Y output Gate 4 open-drain data output that goes LOW only when 4A and 4B are both HIGH and is high-impedance (Z) otherwise.
14 VCC power_in Supply voltage; the SN74HC01 is specified at 2.0 V to 6.0 V (typ. 5.0 V) in the recommended operating conditions.

Key specifications

Parameter Value
Manufacturer lingxingic
Package DIP-14
Category Logic
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
supply voltage VCC -0.5 7 V 6
supply current ICC 50 mA 6
ground current IGND -50 mA 6
input clamping current IIK -20 20 mA VI < -0.5V or VI > VCC+0.5V 6
output clamping current IOK -20 20 mA VO < -0.5V or VO > VCC+0.5V 6
output current IO -25 25 mA -0.5V < VO < VCC+0.5V 6
storage temperature Tstg -65 150 ℃ 6
soldering temperature TL 245 ℃ 10s DIP 6
supply voltage VCC 2 5 6 V 6
input voltage VI 0 V 6
output voltage VO 0 V 6
ambient temperature Tamb -40 125 ℃ 6
HIGH-level input voltage VIH 1.5 1.2 V Tamb=-40℃ to +85℃; VCC=2.0V 7
HIGH-level input voltage VIH 3.15 2.4 V Tamb=-40℃ to +85℃; VCC=4.5V 7
HIGH-level input voltage VIH 4.2 3.2 V Tamb=-40℃ to +85℃; VCC=6.0V 7
LOW-level input voltage VIL 0.8 0.5 V Tamb=-40℃ to +85℃; VCC=2.0V 7
LOW-level input voltage VIL 2.1 1.35 V Tamb=-40℃ to +85℃; VCC=4.5V 7
LOW-level input voltage VIL 2.8 1.8 V Tamb=-40℃ to +85℃; VCC=6.0V 7
LOW-level output voltage VOL 0 0.1 V Tamb=-40℃ to +85℃; VCC=2.0V; IO=20uA 7
LOW-level output voltage VOL 0.15 0.33 V Tamb=-40℃ to +85℃; VCC=4.5V; IO=4.0mA 7
LOW-level output voltage VOL 0.16 0.33 V Tamb=-40℃ to +85℃; VCC=6.0V; IO=5.2mA 7
input leakage current II -1 1 uA Tamb=-40℃ to +85℃; VCC=6.0V; VI=VCC or GND 7
OFF-state output current IOZ -5 5 uA Tamb=-40℃ to +85℃; VCC=6.0V; VI=VIH or VIL; VO=VCC or GND 7
supply current ICC 10 uA Tamb=-40℃ to +85℃; VCC=6.0V; VI=VCC or GND; IO=0A 7
HIGH-level input voltage VIH 1.5 V Tamb=-40℃ to +125℃; VCC=2.0V 8
HIGH-level input voltage VIH 3.15 V Tamb=-40℃ to +125℃; VCC=4.5V 8
HIGH-level input voltage VIH 4.2 V Tamb=-40℃ to +125℃; VCC=6.0V 8
LOW-level input voltage VIL 0.5 V Tamb=-40℃ to +125℃; VCC=2.0V 8
LOW-level input voltage VIL 1.35 V Tamb=-40℃ to +125℃; VCC=4.5V 8
LOW-level input voltage VIL 1.8 V Tamb=-40℃ to +125℃; VCC=6.0V 8
LOW-level output voltage VOL 0.1 V Tamb=-40℃ to +125℃; VCC=2.0V; IO=20uA 8
LOW-level output voltage VOL 0.4 V Tamb=-40℃ to +125℃; VCC=4.5V; IO=4.0mA 8
input leakage current II -1 1 uA Tamb=-40℃ to +125℃; VCC=6.0V; VI=VCC or GND 8
OFF-state output current IOZ -10 10 uA Tamb=-40℃ to +125℃; VCC=6.0V; VI=VIH or VIL; VO=VCC or GND 8
supply current ICC 160 uA Tamb=-40℃ to +125℃; VCC=6.0V; VI=VCC or GND; IO=0A 8
propagation delay tPLZ, tPZL 41 155 ns Tamb=-40℃ to +85℃; VCC=2.0V; CL=50pF; see Figure 4 9
propagation delay tPLZ, tPZL 15 23 ns Tamb=-40℃ to +85℃; VCC=4.5V; CL=50pF 9
propagation delay tPLZ, tPZL 12 20 ns Tamb=-40℃ to +85℃; VCC=6.0V; CL=50pF 9
transition time tTHL 19 95 ns Tamb=-40℃ to +85℃; VCC=2.0V; CL=50pF; see Figure 4 9
transition time tTHL 7 19 ns Tamb=-40℃ to +85℃; VCC=4.5V; CL=50pF 9
transition time tTHL 6 16 ns Tamb=-40℃ to +85℃; VCC=6.0V; CL=50pF 9
propagation delay tPLZ, tPZL 190 ns Tamb=-40℃ to +125℃; VCC=2.0V; CL=50pF; see Figure 4 9
propagation delay tPLZ, tPZL 38 ns Tamb=-40℃ to +125℃; VCC=4.5V; CL=50pF 9
propagation delay tPLZ, tPZL 32 ns Tamb=-40℃ to +125℃; VCC=6.0V; CL=50pF 9
transition time tTHL 110 ns Tamb=-40℃ to +125℃; VCC=2.0V; CL=50pF; see Figure 4 9
transition time tTHL 22 ns Tamb=-40℃ to +125℃; VCC=4.5V; CL=50pF 9
transition time tTHL 19 ns Tamb=-40℃ to +125℃; VCC=6.0V; CL=50pF 9

CAD (KiCad official)

  • Symbol: SN74HC01N
  • Footprint: Package_DIP:DIP-14_W7.62mm
  • 3D model: DIP-14 (KiCad packages3D, STEP)
  • 3D model files: sn74hc01n-etched.step / sn74hc01n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74hc01n.step / sn74hc01n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: lingxingic datasheet (15 pp, sha256 fed8722ab99d9327, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF