component
SN74ALS574BDWR
Public Made by Adomby adom
Texas Instruments Flip Flops, SOIC-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 12d ago |
| viewers | 12d ago |
| package.json | 12d ago |
| page.json | 12d ago |
| README.md | 12d ago |
| sn74als574bdwr-etched.glb | 12d ago |
| sn74als574bdwr-etched.step | 12d ago |
| sn74als574bdwr-hero.glb | 12d ago |
| sn74als574bdwr-hero.overlay.json | 12d ago |
| sn74als574bdwr.glb | 12d ago |
| sn74als574bdwr.kicad_mod | 12d ago |
| sn74als574bdwr.kicad_sym | 12d ago |
| sn74als574bdwr.lbr | 12d ago |
| sn74als574bdwr.step | 12d ago |
SN74ALS574BDWR
Texas Instruments · Flip Flops · SOIC-20-300mil
SN74ALS574BDWR from Texas Instruments, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OE | input | Active-low output enable; when high the 3-state outputs are placed in the high-impedance state, and OE does not affect internal flip-flop operation. |
| 2 | 1D | input | Data input to flip-flop 1, entered on the low-to-high transition of CLK with a setup time of 15 ns before CLK↑. |
| 3 | 2D | input | Data input to flip-flop 2, entered on the low-to-high transition of CLK with a setup time of 15 ns before CLK↑. |
| 4 | 3D | input | Data input to flip-flop 3, entered on the low-to-high transition of CLK with a setup time of 15 ns before CLK↑. |
| 5 | 4D | input | Data input to flip-flop 4, entered on the low-to-high transition of CLK with a setup time of 15 ns before CLK↑. |
| 6 | 5D | input | Data input to flip-flop 5, entered on the low-to-high transition of CLK with a setup time of 15 ns before CLK↑. |
| 7 | 6D | input | Data input to flip-flop 6, entered on the low-to-high transition of CLK with a setup time of 15 ns before CLK↑. |
| 8 | 7D | input | Data input to flip-flop 7, entered on the low-to-high transition of CLK with a setup time of 15 ns before CLK↑. |
| 9 | 8D | input | Data input to flip-flop 8, entered on the low-to-high transition of CLK with a setup time of 15 ns before CLK↑. |
| 10 | GND | power_in | Ground reference for the device. |
| 11 | CLK | input | Clock input; the eight flip-flops enter data on its low-to-high transition, with a minimum clock pulse width of 16.5 ns high or low per the recommended operating conditions. |
| 12 | 8Q | tri_state | Noninverting 3-state output of flip-flop 8 designed to drive bus lines directly, in the high-impedance state when OE is high. |
| 13 | 7Q | tri_state | Noninverting 3-state output of flip-flop 7 designed to drive bus lines directly, in the high-impedance state when OE is high. |
| 14 | 6Q | tri_state | Noninverting 3-state output of flip-flop 6 designed to drive bus lines directly, in the high-impedance state when OE is high. |
| 15 | 5Q | tri_state | Noninverting 3-state output of flip-flop 5 designed to drive bus lines directly, in the high-impedance state when OE is high. |
| 16 | 4Q | tri_state | Noninverting 3-state output of flip-flop 4 designed to drive bus lines directly, in the high-impedance state when OE is high. |
| 17 | 3Q | tri_state | Noninverting 3-state output of flip-flop 3 designed to drive bus lines directly, in the high-impedance state when OE is high. |
| 18 | 2Q | tri_state | Noninverting 3-state output of flip-flop 2 designed to drive bus lines directly, in the high-impedance state when OE is high. |
| 19 | 1Q | tri_state | Noninverting 3-state output of flip-flop 1 designed to drive bus lines directly, in the high-impedance state when OE is high. |
| 20 | VCC | power_in | Positive supply; recommended supply voltage is 4.5 V to 5.5 V (nominal 5 V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-20-300mil |
| Category | Logic |
| Pins | 20 |
CAD (KiCad official)
- Symbol:
SN74ALS574BDWR - Footprint:
Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm - 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
- 3D model files:
sn74als574bdwr-etched.step/sn74als574bdwr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sn74als574bdwr.step/sn74als574bdwr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (23 pp, sha256
481b7b6fa6c6803b, retrieved 2026-10-10, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).