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SN74AHC245DBR

Texas Instruments · Logic ICs · SSOP-20-208mil

SN74AHC245DBR from Texas Instruments, in a SSOP-20-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DIR input Direction control pin of the octal bus transceiver; the datasheet gives only the pin name and does not state its logic-level mapping.
2 A1 bidirectional Bidirectional A-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
3 A2 bidirectional Bidirectional A-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
4 A3 bidirectional Bidirectional A-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
5 A4 bidirectional Bidirectional A-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
6 A5 bidirectional Bidirectional A-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
7 A6 bidirectional Bidirectional A-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
8 A7 bidirectional Bidirectional A-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
9 A8 bidirectional Bidirectional A-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
10 GND power_in Ground pin for the device.
11 B8 bidirectional Bidirectional B-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
12 B7 bidirectional Bidirectional B-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
13 B6 bidirectional Bidirectional B-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
14 B5 bidirectional Bidirectional B-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
15 B4 bidirectional Bidirectional B-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
16 B3 bidirectional Bidirectional B-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
17 B2 bidirectional Bidirectional B-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
18 B1 bidirectional Bidirectional B-bus data input/output of the octal transceiver, used in the asynchronous two-way path between the A and B buses.
19 OE input Output enable control pin of the device; the datasheet gives only the pin name and does not state its active level in the provided text.
20 VCC power_in Power supply pin; the datasheet states the device operates from 4.5 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SSOP-20-208mil
Category Logic ICs
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 2 5.5 V 5
High-level input voltage VIH 1.5 V VCC = 2 V 5
High-level input voltage VIH 2.1 V VCC = 3 V 5
High-level input voltage VIH 3.85 V VCC = 5.5 V 5
Low-level input voltage VIL 0.5 V VCC = 2 V 5
Low-level input voltage VIL 0.9 V VCC = 3 V 5
Low-level input voltage VIL 1.65 V VCC = 5.5 V 5
Input voltage OE or DIR VI 0 5.5 V OE or DIR 5
Output voltage A or B VO 0 V A or B; maximum printed as VCC 5
High-level output current IOH -50 µA VCC = 2 V 5
High-level output current IOH -4 mA VCC = 3.3 V ± 0.3 V 5
High-level output current IOH -8 mA VCC = 5 V ± 0.5 V 5
Low-level output current IOL 50 µA VCC = 2 V 5
Low-level output current IOL 4 mA VCC = 3.3 V ± 0.3 V 5
Low-level output current IOL 8 mA VCC = 5 V ± 0.5 V 5
Input transition rise or fall rate Δt/Δv 100 ns/V VCC = 3.3 V ± 0.3 V 5
Input transition rise or fall rate Δt/Δv 20 ns/V VCC = 5 V ± 0.5 V 5
Operating free-air temperature TA -40 125 °C SN74AHC245 5
Supply voltage range VCC -0.5 7 V 4
Input voltage range, control inputs VI -0.5 7 V Control inputs 4
Output voltage range, I/O VO -0.5 V I/O; maximum printed as VCC + 0.5 V 4
Input clamp current IIK -20 mA VI < 0, control inputs 4
Output clamp current IOK -20 20 mA VO < 0 or VO > VCC 4
Continuous output current IO -25 25 mA VO = 0 to VCC 4
Continuous current through VCC or GND -75 75 mA 4
Storage temperature range Tstg -65 150 °C 4
Human body model ESD V(ESD) 0 1500 V HBM, per ANSI/ESDA/JEDEC JS-001, all pins 4
Charged device model ESD V(ESD) 0 2000 V CDM, per JEDEC JESD22-C101, all pins 4
Junction-to-ambient thermal resistance RθJA 96 °C/W DB package, 20 pins 5
Junction-to-case (top) thermal resistance RθJC(top) 57.7 °C/W DB package, 20 pins 5
Junction-to-board thermal resistance RθJB 51.2 °C/W DB package, 20 pins 5
Junction-to-top characterization parameter ψJT 19.4 °C/W DB package, 20 pins 5
Junction-to-board characterization parameter ψJB 50.8 °C/W DB package, 20 pins 5
High-level output voltage VOH 1.9 V IOH = -50 µA, VCC = 2 V 6
High-level output voltage VOH 2.9 V IOH = -50 µA, VCC = 3 V 6
High-level output voltage VOH 4.4 V IOH = -50 µA, VCC = 4.5 V 6
High-level output voltage VOH 2.48 V IOH = -4 mA, VCC = 3 V 6
High-level output voltage VOH 3.8 V IOH = -8 mA, VCC = 4.5 V 6
Low-level output voltage VOL 0.1 V IOL = 50 µA, VCC = 2 V 6
Low-level output voltage VOL 0.44 V IOL = 4 mA, VCC = 3 V 6
Input current II -1 1 µA A or B inputs, VI = VCC or GND, VCC = 5.5 V 6
Off-state output current IOZ -2.5 2.5 µA VO = VCC or GND, VI(OE) = VIL or VIH, VCC = 5.5 V 6
Supply current ICC 40 µA VI = VCC or GND, IO = 0, VCC = 5.5 V 6
Input capacitance Ci 10 pF OE or DIR, VI = VCC or GND, VCC = 5 V 6
Propagation delay A or B to B or A (tPLH) tPLH 1 13.5 ns CL = 50 pF, VCC = 3.3 V ± 0.3 V 6
Propagation delay A or B to B or A (tPHL) tPHL 1 13.5 ns CL = 50 pF, VCC = 3.3 V ± 0.3 V 6
Enable time OE to A or B (tPZH) tPZH 1 19 ns CL = 50 pF, VCC = 3.3 V ± 0.3 V 6
Enable time OE to A or B (tPZL) tPZL 1 19 ns CL = 50 pF, VCC = 3.3 V ± 0.3 V 6
Disable time OE to A or B (tPHZ) tPHZ 1 18 ns CL = 50 pF, VCC = 3.3 V ± 0.3 V 6
Disable time OE to A or B (tPLZ) tPLZ 1 18 ns CL = 50 pF, VCC = 3.3 V ± 0.3 V 6
Propagation delay A or B to B or A (tPLH) tPLH 1 8.5 ns CL = 50 pF, VCC = 5 V ± 0.5 V 7
Propagation delay A or B to B or A (tPHL) tPHL 1 8.5 ns CL = 50 pF, VCC = 5 V ± 0.5 V 7
Enable time OE to A or B (tPZH) tPZH 1 12 ns CL = 50 pF, VCC = 5 V ± 0.5 V 7
Enable time OE to A or B (tPZL) tPZL 1 12 ns CL = 50 pF, VCC = 5 V ± 0.5 V 7
Disable time OE to A or B (tPHZ) tPHZ 1 11 ns CL = 50 pF, VCC = 5 V ± 0.5 V 7
Disable time OE to A or B (tPLZ) tPLZ 1 11 ns CL = 50 pF, VCC = 5 V ± 0.5 V 7

CAD (KiCad official)

  • Symbol: SN74AHC245DBR
  • Footprint: Package_SO:SSOP-20_5.3x7.2mm_P0.65mm
  • 3D model: SSOP-20-208mil (KiCad packages3D, STEP)
  • 3D model files: sn74ahc245dbr-etched.step / sn74ahc245dbr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn74ahc245dbr.step / sn74ahc245dbr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 2e0da200efe77de1, retrieved 2026-10-18, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF