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SN74ABT651DWR
Public Made by Adomby adom
Texas Instruments Buffers, Drivers, Receivers, Transceivers, SOIC-24-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SN74ABT651DWR
Texas Instruments · Buffers, Drivers, Receivers, Transceivers · SOIC-24-300mil
SN74ABT651DWR from Texas Instruments, in a SOIC-24-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CLKAB | input | Clock input for the A-to-B storage flip-flops; data is stored on low-to-high transitions regardless of the select or enable controls, with a minimum CLK pulse duration of 4 ns. |
| 2 | SAB | input | Select control for the A-to-B path: a low level selects real-time data and a high level selects stored data. |
| 3 | OEAB | input | Output enable for the A-to-B data path; to keep outputs high-impedance during power up or power down, tie OEAB to GND through a pulldown resistor sized by the driver's current-sourcing capability. |
| 4 | A1 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 5 | A2 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 6 | A3 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 7 | A4 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 8 | A5 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 9 | A6 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 10 | A7 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 11 | A8 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 12 | GND | power_in | Ground reference; all unused control and I/O pins must be held at VCC or GND for proper device operation. |
| 13 | B8 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 14 | B7 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 15 | B6 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 16 | B5 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 17 | B4 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 18 | B3 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 19 | B2 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 20 | B1 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 21 | OEBA | input | Output enable for the B-to-A data path; to keep outputs high-impedance during power up or power down, tie OEBA to VCC through a pullup resistor sized by the driver's current-sinking capability. |
| 22 | SBA | input | Select control for the B-to-A path: a low level selects real-time data and a high level selects stored data. |
| 23 | CLKBA | input | Clock input for the B-to-A storage flip-flops; data is stored on low-to-high transitions regardless of the select or enable controls, with a minimum CLK pulse duration of 4 ns. |
| 24 | VCC | power_in | Supply voltage, recommended 4.5 V to 5.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-24-300mil |
| Category | Logic |
| Pins | 24 |
CAD (KiCad official)
- Symbol:
SN74ABT651DWR - Footprint:
Package_SO:SOIC-24W_7.5x15.4mm_P1.27mm - 3D model: SOIC-24-300mil (KiCad packages3D, STEP)
- 3D model files:
sn74abt651dwr-etched.step/sn74abt651dwr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sn74abt651dwr.step/sn74abt651dwr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (14 pp, sha256
4f2592736ebf6087, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SN74ABT651DWR
**Texas Instruments** · Buffers, Drivers, Receivers, Transceivers · SOIC-24-300mil
SN74ABT651DWR from Texas Instruments, in a SOIC-24-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CLKAB | input | Clock input for the A-to-B storage flip-flops; data is stored on low-to-high transitions regardless of the select or enable controls, with a minimum CLK pulse duration of 4 ns. |
| 2 | SAB | input | Select control for the A-to-B path: a low level selects real-time data and a high level selects stored data. |
| 3 | OEAB | input | Output enable for the A-to-B data path; to keep outputs high-impedance during power up or power down, tie OEAB to GND through a pulldown resistor sized by the driver's current-sourcing capability. |
| 4 | A1 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 5 | A2 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 6 | A3 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 7 | A4 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 8 | A5 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 9 | A6 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 10 | A7 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 11 | A8 | bidirectional | Bus A data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 12 | GND | power_in | Ground reference; all unused control and I/O pins must be held at VCC or GND for proper device operation. |
| 13 | B8 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 14 | B7 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 15 | B6 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 16 | B5 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 17 | B4 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 18 | B3 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 19 | B2 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 20 | B1 | bidirectional | Bus B data input/output, 3-state; the high-drive outputs are rated at -32 mA IOH and 64 mA IOL. |
| 21 | OEBA | input | Output enable for the B-to-A data path; to keep outputs high-impedance during power up or power down, tie OEBA to VCC through a pullup resistor sized by the driver's current-sinking capability. |
| 22 | SBA | input | Select control for the B-to-A path: a low level selects real-time data and a high level selects stored data. |
| 23 | CLKBA | input | Clock input for the B-to-A storage flip-flops; data is stored on low-to-high transitions regardless of the select or enable controls, with a minimum CLK pulse duration of 4 ns. |
| 24 | VCC | power_in | Supply voltage, recommended 4.5 V to 5.5 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-24-300mil |
| Category | Logic |
| Pins | 24 |
## CAD (KiCad official)
- Symbol: `SN74ABT651DWR`
- Footprint: `Package_SO:SOIC-24W_7.5x15.4mm_P1.27mm`
- 3D model: SOIC-24-300mil (KiCad packages3D, STEP)
- 3D model files: `sn74abt651dwr-etched.step` / `sn74abt651dwr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sn74abt651dwr.step` / `sn74abt651dwr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/sn74abt651) (14 pp, sha256 `4f2592736ebf6087`, retrieved 2026-10-08, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/sn74abt651dwr-datasheet.pdf)