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SN65HVD78EIM

Public Made by Adom

by adom

HGSEMI RS-485 / RS-422 ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SN65HVD78EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

SN65HVD78EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A-B is not less than 200 mV and low when A-B is not greater than -200 mV (the failsafe section and function table instead give -50 mV as the high threshold, so this value should be checked).
2 RE input Receiver output enable, active low: RO is enabled when RE is low and high-impedance when RE is high; RE high together with DE low puts the device into low-power shutdown.
3 DE input Driver output enable: the driver outputs are active when DE is high and high-impedance when DE is low, and DE uses a hot-plug input structure.
4 DI input Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground reference for the device.
6 A bidirectional Receiver non-inverting input and driver non-inverting output on the RS-485 bus, with ±16 kV IEC 61000-4-2 ESD protection.
7 B bidirectional Receiver inverting input and driver inverting output on the RS-485 bus, with ±16 kV IEC 61000-4-2 ESD protection.
8 VCC power_in Positive supply, 3.15 V to 3.45 V; a 0.1 µF capacitor should be connected to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 6 V 4
Control input voltage (RE, DE) RE, DE -0.3 6 V 4
Driver input voltage DI -0.3 6 V 4
Driver output voltage (A, B) A,B -7 12 V 4
Receiver input voltage (A, B) A,B -7 12 V 4
Receiver output voltage RO -0.3 V Maximum printed as VCC+0.3 V 4
Continuous power dissipation, 8SOP 500 mW TA=+70℃ 4
Operating temperature range, SN65HVDxxEI (industrial) TA -40 85 ℃ SN65HVDxxEI 4
Storage temperature -65 150 ℃ 4
Lead temperature (soldering) TLEAD 260 ℃ 10 s soldering 4
Supply voltage (operating) VCC 3.15 3.45 V VCC=+3.3V±5% 4
ESD, IEC 61000-4-2 air-gap discharge, RS-485 pins A and B -16 16 kV Pins A, B, IEC 61000-4-2 air-gap discharge 6
ESD, IEC 61000-4-2 contact discharge, RS-485 pins A and B -16 16 kV Pins A, B, IEC 61000-4-2 contact discharge, half duplex 6
ESD, HBM pin to GND, RS-485 pins A and B -16 16 kV Pins A, B, HBM pin to GND 6
Differential driver output voltage VOD 2 V Fig. 1, RL=100Ω (RS-422); max printed as VCC 4
Differential driver output voltage VOD 1.5 V Fig. 1, RL=54Ω (RS-485); max printed as VCC 4
Change in magnitude of differential output voltage ΔVOD 0.2 V Fig. 1, RL=100Ω or RL=54Ω 4
Driver common-mode output voltage VOC 3 V Fig. 1, RL=100Ω or RL=54Ω; min printed as VCC/2 4
Change in magnitude of common-mode output voltage ΔVOC 0.2 V Fig. 1, RL=100Ω or RL=54Ω 4
Input high voltage VIH 2 V DE, DI, RE 5
Input low voltage VIL 0.8 V DE, DI 5
Input current IIN -1 1 μA DE, DI, RE 5
Input current (A, B) full duplex IA, IB 125 μA DE=GND, VCC=GND or VCC, VIN=12V 5
Input current (A, B) full duplex IA, IB -75 μA DE=GND, VCC=GND or VCC, VIN=-7V 5
Output leakage current (Y, Z) full duplex IO 125 μA DE=GND, VCC=GND or VCC, VIN=12V 5
Output leakage current (Y, Z) full duplex IO -100 μA DE=GND, VCC=GND or VCC, VIN=-7V 5
Driver short-circuit output current IOSD 250 mA 0≦VOUT≦12V 5
Driver short-circuit output current IOSD -250 mA -7≦VOUT≦VCC 5
Driver short-circuit foldback output current IOSDF 20 mA Vcc-1V≦VOUT≦Vcc+0.5V 5
Driver short-circuit foldback output current IOSDF -20 mA -0.5V≦VOUT≦+1V 5
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V≦VCM≦12V 5
Receiver output low voltage VOL 0.4 V IO=4mA, VID=-200mV 5
Receiver tri-state output current IOZR -1 1 μA 0≦VO≦VCC 5
Supply current, no load Icc 400 900 μA No load, RE=VCC, DI=GND or VCC, DE=VCC 6
Supply current, no load Icc 330 600 μA No load, RE=VCC, DI=GND or VCC, DE=GND 6
Supply current, no load Icc 400 1000 μA No load, RE=GND, DI=GND or VCC, DE=VCC 6
Supply current, no load Icc 330 800 μA No load, RE=GND, DI=GND or VCC, DE=GND 6
Standby supply current ISHDN 0.05 10 μA DE=GND, RE=VCC 6
Driver standby time (SN65HVD78) tSHDN 50 350 700 ns Note 4 9
Receiver standby time (SN65HVD78) tSHDN 50 350 700 ns Note 4 9

CAD (KiCad official)

  • Symbol: SN65HVD78EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: sn65hvd78eim-etched.step / sn65hvd78eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn65hvd78eim.step / sn65hvd78eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (20 pp, sha256 81ed86cf3caebd1f, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF