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SN65HVD75EIM

Public Made by Adom

by adom

HGSEMI RS-485 / RS-422 ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SN65HVD75EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

SN65HVD75EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A−B is at or above −50 mV and low when A−B is at or below −200 mV, and it is high-impedance when RE is high.
2 RE input Active-low receiver output enable: RO is active when this pin is low and high-impedance when it is high, and RE high together with DE low puts the device into low-power shutdown (hot-plug input).
3 DE input Driver output enable: outputs A and B are active when DE is high and high-impedance when DE is low, and DE high is not a shutdown condition while DE low with RE high enters low-power shutdown (hot-plug input).
4 DI input Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground reference for the device.
6 A bidirectional Non-inverting receiver input and driver output on the bus; the absolute maximum voltage range for A and B is −7 V to +12 V, with ±16 kV IEC 61000-4-2 ESD protection.
7 B bidirectional Inverting receiver input and driver output on the bus; the absolute maximum voltage range for A and B is −7 V to +12 V, with ±16 kV IEC 61000-4-2 ESD protection.
8 VCC power_in Positive supply: 3.15 V ≤ VCC ≤ 3.45 V; place a 0.1 µF capacitor to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 6 V 4
Control input voltage RE, DE -0.3 6 V 4
Driver input voltage DI -0.3 6 V 4
Driver output voltage A,B -7 12 V 4
Receiver input voltage A,B -7 12 V 4
Receiver output voltage RO -0.3 V 4
Continuous power dissipation (8SOP) 500 mW TA=+70℃, 8SOP 4
Storage temperature -65 150 ℃ 4
Lead temperature (soldering) TLEAD 260 ℃ 焊接 10s 4
Supply voltage VCC 3.15 3.45 V 4
Operating temperature range (industrial) -40 85 ℃ SN65HVDxxEI 4
Differential driver output voltage VOD 2 V 图1，RL=100Ω（RS-422） 4
Differential driver output voltage VOD 1.5 V 图1，RL=54Ω（RS-485） 4
Differential driver output voltage magnitude change ΔVOD 0.2 V 图1，RL=100Ω 或 RL=54Ω 4
Driver common-mode output voltage VOC 3 V 图1，RL=100Ω 或 RL=54Ω 4
Input high voltage VIH 2 V 5
Input low voltage VIL 0.8 V 5
Input current IIN -1 1 μA 5
Input current (A,B) full duplex IA, IB -75 μA DE=GND, VCC=GND 或VCC, VIN=-7V 5
Input current (A,B) full duplex IA, IB 125 μA DE=GND, VCC=GND 或VCC, VIN=12V 5
Output leakage current (Y,Z) full duplex IO -100 μA DE=GND, VCC=GND 或VCC, VIN=-7V 5
Output leakage current (Y,Z) full duplex IO 125 μA DE=GND, VCC=GND 或VCC, VIN=12V 5
Driver short-circuit output current IOSD -250 mA -7≦VOUT≦Vcc 5
Driver short-circuit output current IOSD 250 mA 0≦VOUT≦12V 5
Driver short-circuit foldback output current IOSDF -20 mA -0.5V≦VOUT≦+1V 5
Driver short-circuit foldback output current IOSDF 20 mA Vcc-1V≦VOUT≦Vcc+0.5V 5
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V≦VCM≦12V 5
Receiver output low voltage VOL 0.4 V IO= 4mA，VID=-200mV 5
Receiver tri-state output current IOZR -1 1 μA 0≦VO≦VCC 5
Supply current Icc 400 900 μA 无负载，￾￾￾=VCC，DI=GND 或VCC，DE=VCC 6
Supply current Icc 330 600 μA 无负载，￾￾￾=VCC，DI=GND 或VCC，DE=GND 6
Supply current Icc 400 1000 μA 无负载，￾￾￾=GND，DI=GND 或VCC，DE=VCC 6
Supply current Icc 330 800 μA 无负载，￾￾￾=GND，DI=GND 或VCC，DE=GND 6
Standby mode supply current ISHDN 0.05 10 μA DE = GND, ￾￾￾= VCC 6
ESD HBM, pin to GND -16 16 kV HBM, 管脚到地 (A, B) 6
ESD IEC 61000-4-2 contact discharge -16 16 kV IEC61000-4-2 接触, 半双工 (A, B) 6
Driver propagation delay tDPLH, tDPHL 200 1000 ns 图 2 和 5，RL=54Ω CL=50pF 8
Driver output skew tDSKEW -140 140 ns 图2 和5，RL =54Ω CL=50pF 8
Driver rise/fall time tDR, tDF 250 900 ns 图2 和5，RL =54Ω CL=50pF 8
Maximum data rate (driver) fMAX 500 kbps 8
Driver enable to output high tDZH 2500 ns 图 3 和6，CL =100pF,S3 闭合 8
Driver enable to output low tDZL 2500 ns 图 3 和6，CL =100pF, S2 闭合 8
Driver low to disable time tDLZ 100 ns 图3 和6，CL =15pF S2 闭合 8
Driver high to disable time tDHZ 100 ns 图3 和6，CL =15pF S3 闭合 8
Driver enable from standby to output high tDZH(SHDN) 5500 ns 图3 和6，CL =15pF S3 闭合 8
Driver enable from standby to output low tDZL(SHDN) 5500 ns 图3 和6，CL =15pF S2 闭合 8
Standby time (driver) tSHDN 50 700 ns 8
Receiver propagation delay tRPLH, tRPHL 200 ns 图7 和8，CL=15pF /VID/≥2.0V，VID≤15ns 8
Receiver differential output skew tRSKEW -30 30 ns 图7 和8，CL=15pF /VID/≥2.0V，VID≤15ns 8
Maximum data rate (receiver) fMAX 500 kbps 8
Receiver enable to output low tRZL 50 ns 图 4 和 9，S1=-1.5V,S2 接VCC 8
Receiver enable to output high tRZH 50 ns 图 4 和 9，S1=+1.5V,S2 接 GND 8
Receiver low to invalid time tRLZ 50 ns 图4 和9，S1=-1.5V,S2 接VCC 8
Receiver high to invalid time tRHZ 50 ns 图 4 和 9，S1=+1.5V,S2 接 GND 8
Receiver enable from standby to output high tRZH(SHDN) 5500 ns 图4 和9，S1=-1.5V,S2 接VCC 8
Receiver enable from standby to output low tRZL(SHDN) 5500 ns 图 4 和 9，S1=+1.5V,S2 接 GND 8
Standby time (receiver) tSHDN 50 700 ns 8
Input hysteresis VHYS 100 mV 5
Receiver input resistance RIN 96 kΩ -7V≦VCM≦12V 5
Thermal shutdown temperature TTS 165 ℃ 5

CAD (KiCad official)

  • Symbol: SN65HVD75EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: sn65hvd75eim-etched.step / sn65hvd75eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn65hvd75eim.step / sn65hvd75eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (20 pp, sha256 81ed86cf3caebd1f, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF