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Contents

README

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SN65HVD75

Texas Instruments · RS-485 transceiver · SOIC-8

3.3 V half-duplex RS-485 transceiver in a SOIC-8 package, rated for signaling up to 20 Mbps with IEC 61000-4-2 ESD protection on the bus pins. A logic-side D/R pair plus independent RE (active-low) and DE (active-high) enables let one MCU UART drive and listen on a shared A/B differential bus with -7 to +12 V common-mode range. The default long-wire multidrop link for industrial sensors and Modbus. Terminate the bus with 120 ohm at each end.

Pinout

Pin Name Type Function
1 R output Receive data output. Logic-level output from the differential receiver, driven from bus pins A and B. High when A-B > VIT+ (-20 mV), low when A-B < VIT- (-150 mV), with 80 mV typical hysteresis.
2 RE input Active-low receiver enable. Drive low to enable the receiver output R; drive high to place R in high-impedance. 5-V tolerant logic input.
3 DE input Active-high driver enable. Drive high to enable the differential driver outputs on A and B; drive low to place them in high-impedance. 5-V tolerant logic input.
4 D input Driver data input. Logic-level input that sets the differential state of bus pins A and B when the driver is enabled (DE = high). 5-V tolerant.
5 GND power_in Local device ground (0 V reference).
6 A bidirectional Non-inverting RS-485 bus I/O. Driver output (complementary to B) when DE is high; receiver input (complementary to B) when RE is low. Rated for -7 V to +12 V common-mode with >=12 kV IEC 61000-4-2 contact ESD.
7 B bidirectional Inverting RS-485 bus I/O. Driver output (complementary to A) when DE is high; receiver input (complementary to A) when RE is low. Rated for -7 V to +12 V common-mode with >=12 kV IEC 61000-4-2 contact ESD.
8 VCC power_in Supply voltage input, 3.0 V to 3.6 V (3.3 V nominal). Bypass locally with a 100 nF ceramic capacitor to GND.

Key specifications

Parameter Value
Type Half-duplex RS-485 transceiver
Data rate up to 20 Mbps
Supply voltage 3.0-3.6 V (3.3 V nominal)
Bus A / B differential, -7 to +12 V common-mode
ESD >=12 kV IEC 61000-4-2 (contact)
Enables RE (active-low), DE (active-high)
Package SOIC-8
Body (L×W×H) 4.9 × 3.9 × 1.75 mm

Ordering variants

Same part, different packaging or reel option.

  • SN65HVD75D (SOIC-8, tube)
  • SN65HVD75DR (SOIC-8, tape & reel)

CAD (KiCad official)

  • Symbol: SN65HVD75 (Adom-authored grouped symbol via adom-symbol; not in KiCad libs)
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D)
  • 3D model files: sn65hvd75-etched.step / sn65hvd75-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn65hvd75.step / sn65hvd75.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (47 pp, sha256 b46f5803fa8302f9, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude) — every pin and dimension is cited to a datasheet page; refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF