SN65HVD3085EIMM

HGSEMI · RS-485 / RS-422 ICs · MSOP-8

SN65HVD3085EIMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output: with RE low, RO is high if (A - B) is at least -50 mV and low if (A - B) is at or below -200 mV.
2	RE	input	Receiver output enable, active low: RO is enabled when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure.
3	DE	input	Driver output enable, active high: the driver outputs are enabled when DE is high and high-impedance when DE is low; DE low with RE high puts the device into low-power shutdown, and DE has a hot-plug input structure.
4	DI	input	Driver input: when DE is high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5	GND	power_in	Ground reference for the device.
6	A	bidirectional	Receiver non-inverting input and driver non-inverting output on the bus; it is the A terminal of the RS-485 bus.
7	B	bidirectional	Receiver inverting input and driver inverting output on the bus; it is the B terminal of the RS-485 bus.
8	VCC	power_in	Positive supply: 4.5 V ≤ VCC ≤ 5.5 V; decouple with a 0.1 µF capacitor to ground.

Key specifications

Parameter	Value
Manufacturer	HGSEMI
Package	MSOP-8
Category	Interface
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage	VCC			6	V		3
Control input voltage (RE, DE)		-0.3		6	V		3
Driver input voltage (DI)		-0.3		6	V		3
Driver output voltage (A,B,Y,Z)		-7		12	V		3
Receiver input voltage (A,B)		-7		12	V		3
Receiver output voltage (RO)		-0.3			V	Max printed as VCC+0.3	3
Storage temperature		-65		150	℃		3
Operating temperature range, SN65HVD308_I (industrial)		-40		85	℃	Printed in absolute-maximum table for SN65HVD308_I	3
Supply voltage (recommended)	VCC	4.5		5.5	V		4
Differential driver output, RL=100Ω (RS-422)	VOD	2.7			V	Fig.1, RL=100Ω (RS-422); max printed as VCC	4
Differential driver output, RL=54Ω (RS-485)	VOD	2.1			V	Fig.1, RL=54Ω (RS-485); max printed as VCC	4
Change in magnitude of differential driver output voltage	ΔVOD			0.2	V	Fig.1, RL=100Ω or RL=54Ω	4
Driver common-mode output voltage	VOC			3	V	Fig.1, RL=100Ω or RL=54Ω; min printed as VCC/2	4
Change in magnitude of common-mode output voltage	ΔVOC			0.2	V	Fig.1, RL=100Ω or RL=54Ω	4
Input high voltage	VIH	2			V	DE, DI, RE	4
Input low voltage	VIL			0.8	V	DE, DI,	4
Input hysteresis	VHYS	100			mV	DE, DI, RE	4
Input current	IIN	-1		1	μA	DE, DI, RE	4
Input current (A,B), full duplex	IA, IB			125	μA	DE=GND, VCC=GND or VCC, VIN=12V	4
Input current (A,B), full duplex	IA, IB	-75			μA	DE=GND, VCC=GND or VCC, VIN=-7V	4
Output leakage current (Y,Z), full duplex	IO			125	μA	DE=GND, VCC=GND or VCC, VIN=12V	4
Output leakage current (Y,Z), full duplex	IO	-100			μA	DE=GND, VCC=GND or VCC, VIN=-7V	4
Driver short-circuit output current	IOSD			250	mA	0≦VOUT≦12V	4
Driver short-circuit output current	IOSD	-250			mA	-7≦VOUT≦VCC	4
Driver short-circuit foldback output current	IOSDF			20	mA	VCC-1V≦VOUT≦VCC+0.5V	4
Driver short-circuit foldback output current	IOSDF	-20			mA	-0.5V≦VOUT≦+1V	4
Receiver differential threshold voltage	VTH	-200	-125	-50	mV	-7V≦VCM≦12V	4
Receiver input hysteresis	ΔVTH	15			mV	VA+VB=0	4
Receiver output low voltage	VOL			0.4	V	IO= 4mA, VID=-200mV	4
Receiver tri-state output current	IOZR	-1		1	μA	0≦VO≦VCC	4
Receiver input resistance	RIN	96			kΩ	-7V≦VCM≦12V	4
Supply current, no load	Icc		530	900	μA	No load, RE=VCC, DI=GND or VCC, DE=VCC	5
Supply current, no load	Icc		475	600	μA	No load, RE=VCC, DE=GND	5
Supply current, no load	Icc		530	1000	μA	No load, RE=GND, DI=GND or VCC, DE=VCC	5
Supply current, no load	Icc		475	800	μA	No load, RE=GND, DE=GND	5
Standby mode supply current	ISHDN		0.05	10	μA	DE=GND, RE=VCC	5
ESD, IEC 61000-4-2 air-gap discharge, RS-485 pins		-16		16	kV	Pins A, B, Y, Z, A/Y, B/Z; IEC61000-4-2 air-gap	5
ESD, IEC 61000-4-2 contact discharge, half-duplex		-16		16	kV	Half-duplex; IEC61000-4-2 contact discharge	5
ESD, HBM pin to GND, RS-485 pins		-16		16	kV	Pins A, B, Y, Z, A/Y, B/Z; pin to GND	5
Driver propagation delay, low to high	tDPLH	200		1000	ns	Fig.2 and 5, RL=54Ω, CL=50pF	7
Driver propagation delay, high to low	tDPHL	200		1000	ns	Fig.2 and 5, RL=54Ω, CL=50pF	7
Driver output skew	tDSKEW	-140		140	ns	Fig.2 and 5, RL=54Ω, CL=50pF	7
Driver rise or fall time	tDR, tDF	250		900	ns	Fig.2 and 5, RL=54Ω, CL=50pF	7
Maximum data rate (driver table)	fMAX			500	kbps		7
Driver enable to output high	tDZH			2500	ns	Fig.3 and 6, CL=100pF, S3 closed	7
Driver enable to output low	tDZL			2500	ns	Fig.3 and 6, CL=100pF, S2 closed	7
Driver low to disable time	tDLZ			100	ns	Fig.3 and 6, CL=15pF, S2 closed	7
Driver high to disable time	tDHZ			100	ns	Fig.3 and 6, CL=15pF, S3 closed	7
Driver enable from standby to output high	tDZH(SHDN)			5500	ns	Fig.3 and 6, CL=15pF, S3 closed	7
Driver enable from standby to output low	tDZL(SHDN)			5500	ns	Fig.3 and 6, CL=15pF, S2 closed	7
Standby time	tSHDN	50		700	ns		7
Receiver propagation delay	tRPLH, tRPHL			200	ns	Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns	7
Receiver differential output skew	tRSKEW	-30		30	ns	Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns	7
Maximum data rate (receiver table)	fMAX			500	kbps		7
Receiver enable to output low	tRZL			50	ns	Fig.4 and 9, S1=-1.5V, S2 to VCC	7
Receiver enable to output high	tRZH			50	ns	Fig.4 and 9, S1=+1.5V, S2 to GND	7
Receiver low to disable time	tRLZ			50	ns	Fig.4 and 9, S1=-1.5V, S2 to VCC	7
Receiver high to disable time	tRHZ			50	ns	Fig.4 and 9, S1=+1.5V, S2 to GND	7
Thermal shutdown temperature	TTS		165		℃		4

CAD (KiCad official)

Symbol: SN65HVD3085EIMM
Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
3D model: MSOP-8 (KiCad packages3D, STEP)
3D model files: sn65hvd3085eimm-etched.step / sn65hvd3085eimm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn65hvd3085eimm.step / sn65hvd3085eimm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: HGSEMI datasheet (25 pp, sha256 a90d2a5b15f5f462, retrieved 2026-10-17, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

# SN65HVD3085EIMM

**HGSEMI** · RS-485 / RS-422 ICs · MSOP-8

SN65HVD3085EIMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: with RE low, RO is high if (A - B) is at least -50 mV and low if (A - B) is at or below -200 mV. |
| 2 | RE | input | Receiver output enable, active low: RO is enabled when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure. |
| 3 | DE | input | Driver output enable, active high: the driver outputs are enabled when DE is high and high-impedance when DE is low; DE low with RE high puts the device into low-power shutdown, and DE has a hot-plug input structure. |
| 4 | DI | input | Driver input: when DE is high, a low on DI drives A low and B high, and a high on DI drives A high and B low. |
| 5 | GND | power_in | Ground reference for the device. |
| 6 | A | bidirectional | Receiver non-inverting input and driver non-inverting output on the bus; it is the A terminal of the RS-485 bus. |
| 7 | B | bidirectional | Receiver inverting input and driver inverting output on the bus; it is the B terminal of the RS-485 bus. |
| 8 | VCC | power_in | Positive supply: 4.5 V ≤ VCC ≤ 5.5 V; decouple with a 0.1 µF capacitor to ground. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Interface |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC |  |  | 6 | V |  | 3 |
| Control input voltage (RE, DE) |  | -0.3 |  | 6 | V |  | 3 |
| Driver input voltage (DI) |  | -0.3 |  | 6 | V |  | 3 |
| Driver output voltage (A,B,Y,Z) |  | -7 |  | 12 | V |  | 3 |
| Receiver input voltage (A,B) |  | -7 |  | 12 | V |  | 3 |
| Receiver output voltage (RO) |  | -0.3 |  |  | V | Max printed as VCC+0.3 | 3 |
| Storage temperature |  | -65 |  | 150 | ℃ |  | 3 |
| Operating temperature range, SN65HVD308_I (industrial) |  | -40 |  | 85 | ℃ | Printed in absolute-maximum table for SN65HVD308_I | 3 |
| Supply voltage (recommended) | VCC | 4.5 |  | 5.5 | V |  | 4 |
| Differential driver output, RL=100Ω (RS-422) | VOD | 2.7 |  |  | V | Fig.1, RL=100Ω (RS-422); max printed as VCC | 4 |
| Differential driver output, RL=54Ω (RS-485) | VOD | 2.1 |  |  | V | Fig.1, RL=54Ω (RS-485); max printed as VCC | 4 |
| Change in magnitude of differential driver output voltage | ΔVOD |  |  | 0.2 | V | Fig.1, RL=100Ω or RL=54Ω | 4 |
| Driver common-mode output voltage | VOC |  |  | 3 | V | Fig.1, RL=100Ω or RL=54Ω; min printed as VCC/2 | 4 |
| Change in magnitude of common-mode output voltage | ΔVOC |  |  | 0.2 | V | Fig.1, RL=100Ω or RL=54Ω | 4 |
| Input high voltage | VIH | 2 |  |  | V | DE, DI, RE | 4 |
| Input low voltage | VIL |  |  | 0.8 | V | DE, DI, | 4 |
| Input hysteresis | VHYS | 100 |  |  | mV | DE, DI, RE | 4 |
| Input current | IIN | -1 |  | 1 | μA | DE, DI, RE | 4 |
| Input current (A,B), full duplex | IA, IB |  |  | 125 | μA | DE=GND, VCC=GND or VCC, VIN=12V | 4 |
| Input current (A,B), full duplex | IA, IB | -75 |  |  | μA | DE=GND, VCC=GND or VCC, VIN=-7V | 4 |
| Output leakage current (Y,Z), full duplex | IO |  |  | 125 | μA | DE=GND, VCC=GND or VCC, VIN=12V | 4 |
| Output leakage current (Y,Z), full duplex | IO | -100 |  |  | μA | DE=GND, VCC=GND or VCC, VIN=-7V | 4 |
| Driver short-circuit output current | IOSD |  |  | 250 | mA | 0≦VOUT≦12V | 4 |
| Driver short-circuit output current | IOSD | -250 |  |  | mA | -7≦VOUT≦VCC | 4 |
| Driver short-circuit foldback output current | IOSDF |  |  | 20 | mA | VCC-1V≦VOUT≦VCC+0.5V | 4 |
| Driver short-circuit foldback output current | IOSDF | -20 |  |  | mA | -0.5V≦VOUT≦+1V | 4 |
| Receiver differential threshold voltage | VTH | -200 | -125 | -50 | mV | -7V≦VCM≦12V | 4 |
| Receiver input hysteresis | ΔVTH | 15 |  |  | mV | VA+VB=0 | 4 |
| Receiver output low voltage | VOL |  |  | 0.4 | V | IO= 4mA, VID=-200mV | 4 |
| Receiver tri-state output current | IOZR | -1 |  | 1 | μA | 0≦VO≦VCC | 4 |
| Receiver input resistance | RIN | 96 |  |  | kΩ | -7V≦VCM≦12V | 4 |
| Supply current, no load | Icc |  | 530 | 900 | μA | No load, RE=VCC, DI=GND or VCC, DE=VCC | 5 |
| Supply current, no load | Icc |  | 475 | 600 | μA | No load, RE=VCC, DE=GND | 5 |
| Supply current, no load | Icc |  | 530 | 1000 | μA | No load, RE=GND, DI=GND or VCC, DE=VCC | 5 |
| Supply current, no load | Icc |  | 475 | 800 | μA | No load, RE=GND, DE=GND | 5 |
| Standby mode supply current | ISHDN |  | 0.05 | 10 | μA | DE=GND, RE=VCC | 5 |
| ESD, IEC 61000-4-2 air-gap discharge, RS-485 pins |  | -16 |  | 16 | kV | Pins A, B, Y, Z, A/Y, B/Z; IEC61000-4-2 air-gap | 5 |
| ESD, IEC 61000-4-2 contact discharge, half-duplex |  | -16 |  | 16 | kV | Half-duplex; IEC61000-4-2 contact discharge | 5 |
| ESD, HBM pin to GND, RS-485 pins |  | -16 |  | 16 | kV | Pins A, B, Y, Z, A/Y, B/Z; pin to GND | 5 |
| Driver propagation delay, low to high | tDPLH | 200 |  | 1000 | ns | Fig.2 and 5, RL=54Ω, CL=50pF | 7 |
| Driver propagation delay, high to low | tDPHL | 200 |  | 1000 | ns | Fig.2 and 5, RL=54Ω, CL=50pF | 7 |
| Driver output skew | tDSKEW | -140 |  | 140 | ns | Fig.2 and 5, RL=54Ω, CL=50pF | 7 |
| Driver rise or fall time | tDR, tDF | 250 |  | 900 | ns | Fig.2 and 5, RL=54Ω, CL=50pF | 7 |
| Maximum data rate (driver table) | fMAX |  |  | 500 | kbps |  | 7 |
| Driver enable to output high | tDZH |  |  | 2500 | ns | Fig.3 and 6, CL=100pF, S3 closed | 7 |
| Driver enable to output low | tDZL |  |  | 2500 | ns | Fig.3 and 6, CL=100pF, S2 closed | 7 |
| Driver low to disable time | tDLZ |  |  | 100 | ns | Fig.3 and 6, CL=15pF, S2 closed | 7 |
| Driver high to disable time | tDHZ |  |  | 100 | ns | Fig.3 and 6, CL=15pF, S3 closed | 7 |
| Driver enable from standby to output high | tDZH(SHDN) |  |  | 5500 | ns | Fig.3 and 6, CL=15pF, S3 closed | 7 |
| Driver enable from standby to output low | tDZL(SHDN) |  |  | 5500 | ns | Fig.3 and 6, CL=15pF, S2 closed | 7 |
| Standby time | tSHDN | 50 |  | 700 | ns |  | 7 |
| Receiver propagation delay | tRPLH, tRPHL |  |  | 200 | ns | Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns | 7 |
| Receiver differential output skew | tRSKEW | -30 |  | 30 | ns | Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns | 7 |
| Maximum data rate (receiver table) | fMAX |  |  | 500 | kbps |  | 7 |
| Receiver enable to output low | tRZL |  |  | 50 | ns | Fig.4 and 9, S1=-1.5V, S2 to VCC | 7 |
| Receiver enable to output high | tRZH |  |  | 50 | ns | Fig.4 and 9, S1=+1.5V, S2 to GND | 7 |
| Receiver low to disable time | tRLZ |  |  | 50 | ns | Fig.4 and 9, S1=-1.5V, S2 to VCC | 7 |
| Receiver high to disable time | tRHZ |  |  | 50 | ns | Fig.4 and 9, S1=+1.5V, S2 to GND | 7 |
| Thermal shutdown temperature | TTS |  | 165 |  | ℃ |  | 4 |

## CAD (KiCad official)

- Symbol: `SN65HVD3085EIMM`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files: `sn65hvd3085eimm-etched.step` / `sn65hvd3085eimm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sn65hvd3085eimm.step` / `sn65hvd3085eimm.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757765517577211904) (25 pp, sha256 `a90d2a5b15f5f462`, retrieved 2026-10-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sn65hvd3085eimm-datasheet.pdf)