# SN65HVD11

**Texas Instruments** · RS-485 Transceiver · SOIC-8

The SN65HVD11 is a 3.3 V half-duplex RS-485 transceiver with a driver and receiver in one package. Its slew-rate-limited driver reduces electromagnetic emissions and reflections on longer cables, and it supports up to 256 nodes on a bus. It is used for industrial multidrop networks like Modbus.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | R | output | Receive data output. Digital output presenting the recovered logic level from the differential A/B bus inputs. High-impedance when RE is high (receiver disabled). |
| 2 | RE | input | Active-low receiver enable. Drive low to enable the receiver output R; drive high to place R in high-impedance and (together with DE low) enter low-current standby mode (typ 1 uA). |
| 3 | DE | input | Active-high driver enable. Drive high to enable the differential bus driver on A/B; drive low to place the driver outputs in high-impedance. |
| 4 | D | input | Driver data input. TTL/CMOS-compatible logic input whose state is transmitted to the differential A/B bus when DE is asserted high. |
| 5 | GND | power_in | Local device ground / reference potential for logic and bus signals. |
| 6 | A | bidirectional | Non-inverting RS-485 differential bus I/O. Driver output or receiver input, complementary to B. Withstands -7 V to 12 V common-mode; ESD protected to +/-16 kV HBM. |
| 7 | B | bidirectional | Inverting RS-485 differential bus I/O. Driver output or receiver input, complementary to A. Withstands -7 V to 12 V common-mode; ESD protected to +/-16 kV HBM. |
| 8 | VCC | power_in | Supply voltage input, 3 V to 3.6 V (3.3-V nominal). Bypass locally with a decoupling capacitor to GND. |

## Key specifications

| Parameter | Value |
|---|---|
| Type | Half-duplex RS-485 transceiver |
| Supply voltage | 3.0 V to 3.6 V |
| Data rate | Up to 10 Mbps |
| Driver | Slew-rate limited |
| Bus loading | Up to 256 nodes |
| Enables | Separate driver and receiver |
| Operating temperature | -40 C to 85 C |

## Ordering variants

Same part, different packaging or reel option.

- `SN65HVD11D`
- `SN65HVD11DR`
- `SN65HVD11P`

## CAD (KiCad official)

- Symbol: `sn65hvd11.kicad_sym`
- Footprint: `sn65hvd11.kicad_mod`
- 3D model: SOIC-8 body from KiCad `Package_SO/SOIC-8_3.9x4.9mm_P1.27mm`.
- 3D model files: `sn65hvd11-etched.step` / `sn65hvd11-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sn65hvd11.step` / `sn65hvd11.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/sn65hvd11.pdf) (37 pp, sha256 `c180625a50ecb754`, retrieved 2026-08-17, tier: manufacturer)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sn65hvd11-datasheet.pdf)