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Contents

README

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SN65HVD07EIM

HGSEMI · RS-485/RS-422 ICs · SOP-8

SN65HVD07EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 R output Receiver output, 3-state, driven high or low from the A-B differential input when RE is low and high impedance when RE is high; VOH is 4 V min at IOH = -8 mA and VOL is 0.4 V max at IOL = 8 mA.
2 RE input Active-low receiver enable; low enables the receiver and high disables it, with VIH 2 V min and VIL 0.8 V max, and the device enters standby when RE is high and DE is low.
3 DE input Active-high driver enable; high enables the A/B driver outputs and low places them in high impedance, with VIH 2 V min and VIL 0.8 V max.
4 D input Driver data input; with DE high, D high drives A high and B low, and D low drives A low and B high, with VIH 2 V min and VIL 0.8 V max.
5 GND power_in Ground (network ground reference); the A, B and GND pins are rated for 16 kV HBM ESD.
6 A bidirectional Non-inverting RS-485 driver output and receiver input on the differential bus; voltage range at A or B is -9 V to 14 V absolute maximum and -7 V to 12 V recommended.
7 B bidirectional Inverting RS-485 driver output and receiver input on the differential bus; voltage range at A or B is -9 V to 14 V absolute maximum and -7 V to 12 V recommended.
8 VCC power_in Positive supply; recommended operating range is 4.5 V to 5.5 V and absolute maximum is -0.3 V to 6 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Communication Interface Chip/UART/485/232
Pins 8

CAD (KiCad official)

  • Symbol: SN65HVD07EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: sn65hvd07eim-etched.step / sn65hvd07eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sn65hvd07eim.step / sn65hvd07eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (21 pp, sha256 d88167bea2b20824, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF