component
SMLVT3V3
Public Made by Adomby adom
STMicroelectronics TVS, DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSMLVT3V3
STMicroelectronics · TVS · DO-214AA(SMB)
SMLVT3V3 from STMicroelectronics, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | Ppp | 600 | W | Tj initial = Tamb | 2 | ||
| Power dissipation on infinite heatsink | P | 6 | W | Tamb = 50 °C | 2 | ||
| Non repetitive surge peak forward current (unidirectional types) | IFSM | 100 | A | tp = 10 ms, Tj initial = Tamb | 2 | ||
| Storage temperature range | Tstg | -65 | 175 | °C | 2 | ||
| Junction temperature range | Tj | -55 | 175 | °C | 2 | ||
| Maximum lead temperature for soldering | TL | 260 | °C | during 10 s | 2 | ||
| Reverse leakage current | IRM | 200 | μA | at VRM = 3.3 V, Tamb = 25 °C | 2 | ||
| Breakdown voltage | VBR | 4.1 | V | at IR = 1 mA, pulse test tp < 50 ms, Tamb = 25 °C | 2 | ||
| Clamping voltage (10/1000 μs) | VCL | 7.3 | V | at IPP = 50 A, 10/1000 μs, Tamb = 25 °C | 2 | ||
| Clamping voltage (8/20 μs) | VCL | 10.3 | V | at IPP = 200 A, 8/20 μs, Tamb = 25 °C | 2 | ||
| Breakdown voltage temperature coefficient | αT | -5.3 | 10-4 /°C | VBR = αT x (Tamb -25) x VBR(25 °C) | 2 | ||
| Junction capacitance | C | 5200 | pF | VR = 0 V, F = 1 MHz, Tamb = 25 °C | 2 | ||
| Junction to leads thermal resistance | Rth(j-l) | 20 | °C/W | 2 | |||
| Junction to ambient thermal resistance | Rth(j-a) | 100 | °C/W | on printed circuit on recommended pad layout | 2 |
CAD (KiCad official)
- Symbol:
SMLVT3V3 - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
smlvt3v3-etched.step/smlvt3v3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smlvt3v3.step/smlvt3v3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (8 pp, sha256
f8d52e57e87b9a9a, retrieved 2026-10-21, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).