# SMLP14WBCN1W1

**ROHM Semicon** · LED Indication - Discrete · 0402

SMLP14WBCN1W1 from ROHM Semicon, in a 0402. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.


::adom-states{src="/adom/smlp14wbcn1w1/render/states.json"}

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode; pad 1 of the KiCad LED footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | 0402 |
| Category | Optoelectronics |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward Current | IF |  |  | 10 | mA | Ta=25℃ | 1 |
| Peak Forward Current | IFP |  |  | 50 | mA | Ta=25℃, Duty 1/10, 1kHz | 1 |
| Power Dissipation | PD |  |  | 33 | mW | Ta=25℃ | 1 |
| Reverse Voltage | VR |  |  | 5 | V | Ta=25℃ | 1 |
| Storage Temperature | Tstg | -40 |  | 100 | ℃ |  | 1 |
| Operation Temperature | Topr | -40 |  | 85 | ℃ |  | 1 |
| Forward Voltage | VF | 1.9 | 2.9 | 3.3 | V | IF=5mA | 1 |
| Luminous Intensity | IV | 90 | 180 | 360 | mcd | IF=5mA | 1 |
| Reverse Current | IR |  |  | 100 | μA | VR=5V | 1 |
| Thermal Resistance (Junction/Solder Point) | Rθj-s |  |  | 770 | ℃/W | Evaluation board: glass epoxy FR4 30x10mm, t=0.8mm; Cu pad 13.5x4.7mm (cathode), t=0.07mm | 15 |
| Thermal Resistance (Junction/Ambient) | Rθj-a |  |  | 920 | ℃/W | Evaluation board: glass epoxy FR4 30x10mm, t=0.8mm; Cu pad 13.5x4.7mm (cathode), t=0.07mm | 15 |
| Junction Temperature | TjMax |  |  | 100 | ℃ |  | 15 |

## CAD (KiCad official)

- Symbol: `SMLP14WBCN1W1`
- Footprint: `LED_SMD:LED_0402_1005Metric`
- 3D model: 0402 (KiCad packages3D, STEP)
- 3D model files: `smlp14wbcn1w1-etched.step` / `smlp14wbcn1w1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smlp14wbcn1w1.step` / `smlp14wbcn1w1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [ROHM Semicon datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603165561983410176) (19 pp, sha256 `2f04703ec3aa0759`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `LED convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smlp14wbcn1w1-datasheet.pdf)