# SMLMN2WB1CW1

**ROHM Semicon** · LED Indication - Discrete · 0805

SMLMN2WB1CW1 from ROHM Semicon, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.


::adom-states{src="/adom/smlmn2wb1cw1/render/states.json"}

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode; pad 1 of the KiCad LED footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | 0805 |
| Category | Optoelectronics |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward current (absolute maximum) | IF |  |  | 20 | mA |  | 1 |
| Peak forward current (absolute maximum) | IFP |  |  | 100 | mA | *1 : 1/10, 1kHz | 1 |
| Reverse voltage (absolute maximum) | VR |  |  | 12 | V |  | 1 |
| Operating temperature (absolute maximum) | Topr | -40 |  | 100 | ºC |  | 1 |
| Storage temperature (absolute maximum) | Tstg | -40 |  | 100 | ºC |  | 1 |
| Luminous intensity (White, WB) | IV | 56 |  | 140 | mcd | Ta=25ºC, IF=5mA | 1 |
| Reverse current (White) | IR |  |  | 10 | µA | VR=12 V (inferred from column layout) | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | abs |  | adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of expansion and moisture absorption at humidity will cause heat stress during soldering process and | 8 |

## CAD (KiCad official)

- Symbol: `SMLMN2WB1CW1`
- Footprint: `LED_SMD:LED_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `smlmn2wb1cw1-etched.step` / `smlmn2wb1cw1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smlmn2wb1cw1.step` / `smlmn2wb1cw1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [ROHM Semicon datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590227702369320960) (10 pp, sha256 `c03e42a781a2da5f`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `LED convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smlmn2wb1cw1-datasheet.pdf)