# SMLMN2BCTT86C

**ROHM Semicon** · LED Indication - Discrete · 0805

SMLMN2BCTT86C from ROHM Semicon, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.


::adom-states{src="/adom/smlmn2bctt86c/render/states.json"}

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode electrode of the blue InGaN LED, on the sprocket-hole side of the T86 tape; max forward current 20 mA (100 mA pulsed at 1/10 duty, 1 kHz), max reverse voltage 12 V. |
| 2 | A | passive | Anode electrode of the blue InGaN LED; typical VF 2.9 V at IF=5 mA, power dissipation 68 mW max, drive with constant current. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | 0805 |
| Category | Optoelectronics |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Current | IR |  |  | 10 | µA | VR=12 V | 1 |
| Dominant Wavelength (Blue) | λD | 464 | 470 | 476 | nm | IF=5 mA, Ta=25ºC | 1 |
| Luminous Intensity (Blue) | IV | 14 | 36 |  | mcd | IF=5 mA, Ta=25ºC | 1 |
| Forward Current | IF |  |  | 20 | mA | Ta=25ºC | 1 |
| Peak Forward Current | IFP |  |  | 100 | mA | 1/10 duty, 1 kHz (*1) | 1 |
| Reverse Voltage | VR |  |  | 12 | V | Ta=25ºC | 1 |
| Power Dissipation | PD |  |  | 68 | mW | Ta=25ºC | 1 |
| Operating Temperature | Topr | -40 |  | 100 | ºC | Ta=25ºC | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | abs |  | adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of expansion and moisture absorption at humidity will cause heat stress during soldering process and | 8 |

## CAD (KiCad official)

- Symbol: `SMLMN2BCTT86C`
- Footprint: `LED_SMD:LED_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `smlmn2bctt86c-etched.step` / `smlmn2bctt86c-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smlmn2bctt86c.step` / `smlmn2bctt86c.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [ROHM Semicon datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586519882809032704) (10 pp, sha256 `6e82574a81e88bdb`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smlmn2bctt86c-datasheet.pdf)