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SML-D12D8WT86C

ROHM Semicon · LED Indication - Discrete · 0603

SML-D12D8WT86C from ROHM Semicon, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode electrode, marked by the cathode index on the package top (left electrode in the top view); VF 2.2V typ and 2.7V max at IF=20mA.
2 A passive Anode electrode (right electrode in the top view, opposite the cathode index); forward current IF max 20mA, peak forward current IFP 100mA (duty 1/10, 1kHz), reverse voltage VR max 5V.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package 0603
Category Optoelectronics
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage VF 1.2 2.2 2.7 V IF=20mA 1
Luminous Intensity IV 40 100 250 mcd IF=20mA 1
Reverse Current IR 10 μA VR=5V 1
Dominant Wave Length λD 602 605 608 nm IF=20mA 1
Dominant Wave Length tolerance λD -1 1 nm Printed footnote 4 tolerance ±1nm 1
Luminous classification tolerance -10 10 % Printed tolerance ±10% under luminous classification table 1
Forward Current IF 20 mA Ta=25℃ 1
Peak Forward Current IFP 100 mA Duty 1/10, 1kHz 1
Power Dissipation PD 54 mW Ta=25℃ 1
Reverse Voltage VR 5 V Ta=25℃ 1
Storage Temperature Tstg -40 100 ℃ 1
Operation Temperature Topr -40 100 ℃ 1
Thermal resistance (junction/solder point) Rθj-s 720 ℃/W Evaluation board: glass epoxy FR4 30x10mm t=0.8mm; Cu pad 1.5x1.0mm (cathode), t=0.035mm 14
Thermal resistance (junction/ambient) Rθj-a 945 ℃/W Evaluation board: glass epoxy FR4 30x10mm t=0.8mm; Cu pad 1.5x1.0mm (cathode), t=0.035mm 14
Junction temperature TjMax 100 ℃ 14
Reflow peak temperature TP 260 ℃ Recommended reflow profile, peak temperature (MAX.) 10

CAD (KiCad official)

  • Symbol: SML-D12D8WT86C
  • Footprint: LED_SMD:LED_0603_1608Metric
  • 3D model: 0603 (KiCad packages3D, STEP)
  • 3D model files: sml-d12d8wt86c-etched.step / sml-d12d8wt86c-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sml-d12d8wt86c.step / sml-d12d8wt86c.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (18 pp, sha256 76199d963cfd39ff, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF