component
SMFJ9.0A
Public Made by Adomby adom
BORN ESD And Surge Protection (TVS/ESD), SOD-123F. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownSMFJ9.0A
BORN · ESD And Surge Protection (TVS/ESD) · SOD-123F
SMFJ9.0A from BORN, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | SOD-123F |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 10 | 11.1 | V | @ IT = 1 mA | 3 | |
| Reverse Stand-Off Voltage | VR | 9 | V | 3 | |||
| Maximum Clamping Voltage | VC | 15.4 | V | @ Ipp = 13 A | 3 | ||
| Maximum Peak Pulse Current | Ipp | 13 | A | 3 | |||
| Maximum Reverse Leakage | IR | 5 | uA | @ VR | 3 | ||
| Test Current | IT | 1 | mA | 3 | |||
| Peak Pulse Power Dissipation | PPPM | 200 | W | TA=+25°C, 10/1000us non-repetitive, 3x3mm copper pad each terminal | 2 | ||
| Steady State Power Dissipation | PD | 1 | W | Infinite heat sink at TA=50°C | 2 | ||
| Peak Forward Surge Current | IFSM | 20 | A | 8.3ms single half sine wave, duty cycle=4 per minute max | 2 | ||
| Maximum Instantaneous Forward Voltage | VFM | 3.5 | V | at 10A, unidirectional only | 2 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | °C | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 2 | ||
| Thermal Resistance Junction to Lead | RθJL | 100 | °C/W | Typical | 2 | ||
| Thermal Resistance Junction to Ambient | RθJA | 220 | °C/W | Typical | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • Lead Finish: Matte Tin • Case Material: Epoxy Molding Compound | 1 |
CAD (KiCad official)
- Symbol:
SMFJ9.0A - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123F (KiCad packages3D, STEP)
- 3D model files:
smfj9-0a-etched.step/smfj9-0a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smfj9-0a.step/smfj9-0a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (7 pp, sha256
dd8422b2bd24ae70, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).