# SMFJ13CA

**BORN** · ESD And Surge Protection (TVS/ESD) · SOD-123F

SMFJ13CA from BORN, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | SOD-123F |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage (min) | VBR | 14.4 |  |  | V | IT = 1 mA | 3 |
| Breakdown Voltage (max) | VBR |  |  | 15.9 | V | IT = 1 mA | 3 |
| Maximum Clamping Voltage | VC |  |  | 21.5 | V | at Ipp = 9.3 A | 3 |
| Maximum Peak Pulse Current | Ipp |  |  | 9.3 | A |  | 3 |
| Maximum Reverse Leakage Current | IR |  |  | 1 | uA | at VR = 13 V | 3 |
| Peak Pulse Power Dissipation | PPPM |  |  | 200 | W | 10/1000us waveform, non-repetitive (Notes 1,2) | 2 |
| Steady State Power Dissipation | PD |  |  | 1 | W | Infinite heat sink at TA = 50°C (Note 3) | 2 |
| Peak Forward Surge Current | IFSM |  |  | 20 | A | 8.3ms single half sine wave (Note 4) | 2 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | °C |  | 2 |
| Storage Temperature Range | TSTG | -55 |  | 150 | °C |  | 2 |
| Reverse Stand-Off Voltage | VR |  | 13 |  | V |  | 3 |
| Typical Thermal Resistance Junction to Lead | RθJL |  | 100 |  | °C/W |  | 2 |
| Typical Thermal Resistance Junction to Ambient | RθJA |  | 220 |  | °C/W |  | 2 |

## CAD (KiCad official)

- Symbol: `SMFJ13CA`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123F (KiCad packages3D, STEP)
- 3D model files: `smfj13ca-etched.step` / `smfj13ca-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smfj13ca.step` / `smfj13ca.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [BORN datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757049265670119424) (7 pp, sha256 `dd8422b2bd24ae70`, retrieved 2026-10-14, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smfj13ca-datasheet.pdf)