# SMF60A-TP

**MCC(美微科)** · IC · SOD-123FL

SMF60A-TP from MCC(美微科), in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the unidirectional TVS (marked end of the body); SMF60A has 60V reverse stand-off, 66.7V to 73.7V breakdown at 1mA and 96.8V max clamping at 1.8A IPP. |
| 2 | A | passive | Anode of the unidirectional TVS; 200W peak pulse power (10/1000µs) and ±30kV IEC61000-4-2 air/contact ESD rating. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(美微科) |
| Package | SOD-123FL |
| Category |  |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage (VBR) at test current | VBR | 66.7 |  | 73.7 | V | @IT = 1.0 mA | 2 |
| Max Clamping Voltage | VC |  |  | 96.8 | V | @IPP = 1.8 A | 2 |
| Max Peak Pulse Current | IPP |  |  | 1.8 | A |  | 2 |
| Max Reverse Leakage Current | ID |  |  | 1 | µA | @VWM = 60 V | 2 |
| Reverse Stand-Off Voltage | VWM |  |  | 60 | V |  | 2 |
| Peak Pulse Power Dissipation | PPP |  |  | 200 | W | 10/1000µs waveform | 1 |
| Peak Forward Surge Current | IFSM |  |  | 30 | A | 8.3 ms single half sine-wave | 1 |
| ESD Voltage (HBM) | VESD | 16 |  |  | KV | HBM; printed as >16KV | 1 |
| ESD Voltage (IEC61000-4-2 contact) |  | -30 |  | 30 | KV | IEC61000-4-2 contact discharge, printed ±30KV | 1 |
| ESD Voltage (IEC61000-4-2 air) |  | -30 |  | 30 | KV | IEC61000-4-2 air discharge, printed ±30KV | 1 |
| Operating Junction Temperature Range | TJ | -65 |  | 175 | °C |  | 1 |
| Storage Temperature Range | TSTG | -65 |  | 175 | °C |  | 1 |
| Typical Thermal Resistance, Junction to Lead |  |  | 26 |  | °C/W | Junction to lead, typical | 1 |
| Typical Thermal Resistance, Junction to Ambient |  |  | 300 |  | °C/W | Junction to ambient, typical | 1 |

## CAD (KiCad official)

- Symbol: `SMF60A-TP`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files: `smf60a-tp-etched.step` / `smf60a-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smf60a-tp.step` / `smf60a-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(美微科) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590310028210446336) (5 pp, sha256 `c4100e793386d984`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/smf60a-tp-datasheet.pdf)