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SMF15CT1G
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MSKSEMI ESD Protection Devices, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SMF15CT1G
MSKSEMI · ESD Protection Devices · SOT-363
SMF15CT1G from MSKSEMI, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O1 | passive | ESD-protected line 1 (diode array channel); datasheet says measured from pins 1, 3, 4, 5 or 6 to pin 2. |
| 2 | GND | power_in | Common reference pin of the ESD array; clamping and surge ratings are measured from the other pins to pin 2. |
| 3 | I/O3 | passive | ESD-protected line 3 (diode array channel); datasheet says measured from pins 1, 3, 4, 5 or 6 to pin 2. |
| 4 | I/O4 | passive | ESD-protected line 4 (diode array channel); datasheet says measured from pins 1, 3, 4, 5 or 6 to pin 2. |
| 5 | I/O5 | passive | ESD-protected line 5 (diode array channel); datasheet says measured from pins 1, 3, 4, 5 or 6 to pin 2. |
| 6 | I/O6 | passive | ESD-protected line 6 (diode array channel); datasheet says measured from pins 1, 3, 4, 5 or 6 to pin 2. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SOT-363 |
| Category | Circuit Protection |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (min) | VBR | 17 | V | 3 | |||
| Breakdown voltage (max) | VBR | 19 | V | 3 | |||
| Clamping voltage (max) at IPP = 1 A | VCL | 23 | V | 8/20 μs pulse; notes 1 and 2; @ IPP = 1 A | 3 | ||
| Clamping voltage (max) at IPP = 5 A | VCL | 29 | V | 8/20 μs pulse; notes 1 and 2; @ IPP = 5 A | 3 | ||
| Peak pulse power | PPP | 150 | W | tp = 8/20 μs | 2 | ||
| ESD electrostatic discharge, IEC61000-4-2 contact discharge | VPP | 30 | kV | IEC61000-4-2 (contact discharge) | 2 | ||
| ESD electrostatic discharge, IEC61000-4-2 air discharge | VPP | 30 | kV | IEC61000-4-2 (air discharge) | 2 | ||
| Maximum lead temperature for soldering | TL | 260 | °C | during 10 s | 2 | ||
| Storage temperature range | Tstg | -60 | 150 | °C | 2 | ||
| Operating temperature range | Top | -60 | 150 | °C | 2 | ||
| Maximum junction temperature | Tj | 150 | °C | 2 | |||
| Stand-off voltage | VRM | 15 | V | 3 | |||
| Leakage current | IR | 1 | μA | 3 | |||
| Peak pulse current | IPP | 5 | A | 8/20 μs pulse; notes 1 and 2 | 3 | ||
| Capacitance | C | 15 | pF | f = 1 MHz; VR = 0 V | 3 |
CAD (KiCad official)
- Symbol:
SMF15CT1G - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files:
smf15ct1g-etched.step/smf15ct1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);smf15ct1g.step/smf15ct1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MSKSEMI datasheet (6 pp, sha256
8cb4e0d6382bb739, retrieved 2026-11-04, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SMF15CT1G
**MSKSEMI** · ESD Protection Devices · SOT-363
SMF15CT1G from MSKSEMI, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O1 | passive | ESD-protected line 1 (diode array channel); datasheet says measured from pins 1, 3, 4, 5 or 6 to pin 2. |
| 2 | GND | power_in | Common reference pin of the ESD array; clamping and surge ratings are measured from the other pins to pin 2. |
| 3 | I/O3 | passive | ESD-protected line 3 (diode array channel); datasheet says measured from pins 1, 3, 4, 5 or 6 to pin 2. |
| 4 | I/O4 | passive | ESD-protected line 4 (diode array channel); datasheet says measured from pins 1, 3, 4, 5 or 6 to pin 2. |
| 5 | I/O5 | passive | ESD-protected line 5 (diode array channel); datasheet says measured from pins 1, 3, 4, 5 or 6 to pin 2. |
| 6 | I/O6 | passive | ESD-protected line 6 (diode array channel); datasheet says measured from pins 1, 3, 4, 5 or 6 to pin 2. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SOT-363 |
| Category | Circuit Protection |
| Pins | 6 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (min) | VBR | 17 | | | V | | 3 |
| Breakdown voltage (max) | VBR | | | 19 | V | | 3 |
| Clamping voltage (max) at IPP = 1 A | VCL | | | 23 | V | 8/20 μs pulse; notes 1 and 2; @ IPP = 1 A | 3 |
| Clamping voltage (max) at IPP = 5 A | VCL | | | 29 | V | 8/20 μs pulse; notes 1 and 2; @ IPP = 5 A | 3 |
| Peak pulse power | PPP | | | 150 | W | tp = 8/20 μs | 2 |
| ESD electrostatic discharge, IEC61000-4-2 contact discharge | VPP | | | 30 | kV | IEC61000-4-2 (contact discharge) | 2 |
| ESD electrostatic discharge, IEC61000-4-2 air discharge | VPP | | | 30 | kV | IEC61000-4-2 (air discharge) | 2 |
| Maximum lead temperature for soldering | TL | | | 260 | °C | during 10 s | 2 |
| Storage temperature range | Tstg | -60 | | 150 | °C | | 2 |
| Operating temperature range | Top | -60 | | 150 | °C | | 2 |
| Maximum junction temperature | Tj | | | 150 | °C | | 2 |
| Stand-off voltage | VRM | | 15 | | V | | 3 |
| Leakage current | IR | | 1 | | μA | | 3 |
| Peak pulse current | IPP | | 5 | | A | 8/20 μs pulse; notes 1 and 2 | 3 |
| Capacitance | C | | 15 | | pF | f = 1 MHz; VR = 0 V | 3 |
## CAD (KiCad official)
- Symbol: `SMF15CT1G`
- Footprint: `Package_TO_SOT_SMD:SOT-363_SC-70-6`
- 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files: `smf15ct1g-etched.step` / `smf15ct1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `smf15ct1g.step` / `smf15ct1g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [MSKSEMI datasheet](docs/smf15ct1g-datasheet.pdf) (6 pp, sha256 `8cb4e0d6382bb739`, retrieved 2026-11-04, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/smf15ct1g-datasheet.pdf)