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SMDJ9.0CA

Shandong Jingdao Microelectronics · TVS · SMC

SMDJ9.0CA from Shandong Jingdao Microelectronics, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal per the PINNING table; the datasheet gives this pin for the Unipolar symbol and rates SMDJ9.0CA at a reverse stand-off voltage VRWM of 9.0 V.
2 Anode passive Anode terminal per the PINNING table; for SMDJ9.0CA the datasheet lists a minimum breakdown of 10 V and a maximum of 11.1 V at a test current of 1 mA.

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package SMC
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage (bidirectional) VBR 10 11.1 V @ IT = 1 mA 2
Max. Clamping Voltage VC 15.4 V @ IPP = 194.8 A 2
Max. Peak Pulse Current IPP 194.8 A 10/1000us waveform 2
Max. Reverse Leakage Current IR 10 uA @ VR = VRWM = 9.0 V 2
Peak Pulse Power Dissipation PPPM 3000 W TA=25°C, 10x1000us waveform (Fig.1) 1
Power Dissipation on infinite heat sink PM(AV) 6.5 W TA=50°C 1
Operating Junction and Storage Temperature Range Tj, TSTG -65 150 °C 1
Reverse Stand-off Voltage VRWM 9 V Single stand-off value printed in table; no min/max given 2
Typical Thermal Resistance Junction to Lead RθJL 15 ℃/W Typical 1
Typical Thermal Resistance Junction to Ambient RθJA 75 ℃/W Typical; mounted on copper pad 0.31x0.31" (8.0x8.0mm) per Note 2 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Matte Tin Lead-free Plated Maximum Ratings and Thermal Characteristics (TA=25℃ unless otherwise noted) 1

CAD (KiCad official)

  • Symbol: SMDJ9.0CA
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC (KiCad packages3D, STEP)
  • 3D model files: smdj9-0ca-etched.step / smdj9-0ca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); smdj9-0ca.step / smdj9-0ca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (4 pp, sha256 a89aa326add6c47a, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF